TWI551869B - 用於測試之可耦接至微電子基板之相對表面的傳送器及相關聯系統及方法 - Google Patents

用於測試之可耦接至微電子基板之相對表面的傳送器及相關聯系統及方法 Download PDF

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Publication number
TWI551869B
TWI551869B TW102112402A TW102112402A TWI551869B TW I551869 B TWI551869 B TW I551869B TW 102112402 A TW102112402 A TW 102112402A TW 102112402 A TW102112402 A TW 102112402A TW I551869 B TWI551869 B TW I551869B
Authority
TW
Taiwan
Prior art keywords
transmitter
substrate
microelectronic substrate
signal
microelectronic
Prior art date
Application number
TW102112402A
Other languages
English (en)
Chinese (zh)
Other versions
TW201350880A (zh
Inventor
摩根Ｔ 強森
Original Assignee
川斯萊緹公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 川斯萊緹公司 filed Critical 川斯萊緹公司
Publication of TW201350880A publication Critical patent/TW201350880A/zh
Application granted granted Critical
Publication of TWI551869B publication Critical patent/TWI551869B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
TW102112402A 2012-04-09 2013-04-08 用於測試之可耦接至微電子基板之相對表面的傳送器及相關聯系統及方法 TWI551869B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261621954P 2012-04-09 2012-04-09
US13/840,937 US8779789B2 (en) 2012-04-09 2013-03-15 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Publications (2)

Publication Number Publication Date
TW201350880A TW201350880A (zh) 2013-12-16
TWI551869B true TWI551869B (zh) 2016-10-01

Family

ID=49291807

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102112402A TWI551869B (zh) 2012-04-09 2013-04-08 用於測試之可耦接至微電子基板之相對表面的傳送器及相關聯系統及方法

Country Status (8)

Country Link
US (2) US8779789B2 (https=)
EP (1) EP2837023A4 (https=)
JP (1) JP6058119B2 (https=)
KR (1) KR20150007305A (https=)
CN (1) CN104350588B (https=)
SG (1) SG11201406383RA (https=)
TW (1) TWI551869B (https=)
WO (1) WO2013154909A1 (https=)

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US8779789B2 (en) * 2012-04-09 2014-07-15 Advanced Inquiry Systems, Inc. Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
FR3032038B1 (fr) 2015-01-27 2018-07-27 Soitec Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat
CN106154596A (zh) * 2015-04-08 2016-11-23 上海纪显电子科技有限公司 光电显示装置、检测装置及其方法
US9794009B1 (en) * 2016-06-30 2017-10-17 Litepoint Corporation Method for testing a radio frequency (RF) data packet signal transceiver for proper implicit beamforming operation
US11791326B2 (en) * 2021-05-10 2023-10-17 International Business Machines Corporation Memory and logic chip stack with a translator chip

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Also Published As

Publication number Publication date
EP2837023A1 (en) 2015-02-18
WO2013154909A1 (en) 2013-10-17
KR20150007305A (ko) 2015-01-20
US9222965B2 (en) 2015-12-29
TW201350880A (zh) 2013-12-16
SG11201406383RA (en) 2014-11-27
US8779789B2 (en) 2014-07-15
EP2837023A4 (en) 2016-01-13
CN104350588B (zh) 2017-04-05
US20150015299A1 (en) 2015-01-15
JP2015514226A (ja) 2015-05-18
JP6058119B2 (ja) 2017-01-11
CN104350588A (zh) 2015-02-11
US20130265071A1 (en) 2013-10-10

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