CN104350588B - 可连接到微电子基板的相反表面的用于测试的转换器以及相关的系统和方法 - Google Patents

可连接到微电子基板的相反表面的用于测试的转换器以及相关的系统和方法 Download PDF

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Publication number
CN104350588B
CN104350588B CN201380030314.XA CN201380030314A CN104350588B CN 104350588 B CN104350588 B CN 104350588B CN 201380030314 A CN201380030314 A CN 201380030314A CN 104350588 B CN104350588 B CN 104350588B
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CN
China
Prior art keywords
transducer
substrate
hole
microelectronic substrate
signal
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Active
Application number
CN201380030314.XA
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English (en)
Chinese (zh)
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CN104350588A (zh
Inventor
摩根·T·约翰逊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jiasheng Semiconductor Co ltd
Original Assignee
Whole Company Larry
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Publication of CN104350588A publication Critical patent/CN104350588A/zh
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Publication of CN104350588B publication Critical patent/CN104350588B/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
CN201380030314.XA 2012-04-09 2013-04-04 可连接到微电子基板的相反表面的用于测试的转换器以及相关的系统和方法 Active CN104350588B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261621954P 2012-04-09 2012-04-09
US61/621,954 2012-04-09
US13/840,937 2013-03-15
US13/840,937 US8779789B2 (en) 2012-04-09 2013-03-15 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
PCT/US2013/035286 WO2013154909A1 (en) 2012-04-09 2013-04-04 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Publications (2)

Publication Number Publication Date
CN104350588A CN104350588A (zh) 2015-02-11
CN104350588B true CN104350588B (zh) 2017-04-05

Family

ID=49291807

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380030314.XA Active CN104350588B (zh) 2012-04-09 2013-04-04 可连接到微电子基板的相反表面的用于测试的转换器以及相关的系统和方法

Country Status (8)

Country Link
US (2) US8779789B2 (https=)
EP (1) EP2837023A4 (https=)
JP (1) JP6058119B2 (https=)
KR (1) KR20150007305A (https=)
CN (1) CN104350588B (https=)
SG (1) SG11201406383RA (https=)
TW (1) TWI551869B (https=)
WO (1) WO2013154909A1 (https=)

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US8779789B2 (en) * 2012-04-09 2014-07-15 Advanced Inquiry Systems, Inc. Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
FR3032038B1 (fr) 2015-01-27 2018-07-27 Soitec Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat
CN106154596A (zh) * 2015-04-08 2016-11-23 上海纪显电子科技有限公司 光电显示装置、检测装置及其方法
US9794009B1 (en) * 2016-06-30 2017-10-17 Litepoint Corporation Method for testing a radio frequency (RF) data packet signal transceiver for proper implicit beamforming operation
US11791326B2 (en) * 2021-05-10 2023-10-17 International Business Machines Corporation Memory and logic chip stack with a translator chip

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US20050270055A1 (en) * 2004-06-02 2005-12-08 Salman Akram Systems and methods for testing microelectronic imagers and microfeature devices
CN101346813A (zh) * 2005-12-22 2009-01-14 Jsr株式会社 晶片检查用电路基板装置、探针卡和晶片检查装置
US20110304349A1 (en) * 2010-06-11 2011-12-15 Texas Instruments Incorporated Lateral coupling enabled topside only dual-side testing of tsv die attached to package substrate
US20120074976A1 (en) * 2010-09-28 2012-03-29 Advanced Inquiry Systems, Inc. Wafer testing systems and associated methods of use and manufacture

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050270055A1 (en) * 2004-06-02 2005-12-08 Salman Akram Systems and methods for testing microelectronic imagers and microfeature devices
CN101346813A (zh) * 2005-12-22 2009-01-14 Jsr株式会社 晶片检查用电路基板装置、探针卡和晶片检查装置
US20110304349A1 (en) * 2010-06-11 2011-12-15 Texas Instruments Incorporated Lateral coupling enabled topside only dual-side testing of tsv die attached to package substrate
US20120074976A1 (en) * 2010-09-28 2012-03-29 Advanced Inquiry Systems, Inc. Wafer testing systems and associated methods of use and manufacture

Also Published As

Publication number Publication date
EP2837023A1 (en) 2015-02-18
WO2013154909A1 (en) 2013-10-17
KR20150007305A (ko) 2015-01-20
US9222965B2 (en) 2015-12-29
TW201350880A (zh) 2013-12-16
SG11201406383RA (en) 2014-11-27
US8779789B2 (en) 2014-07-15
EP2837023A4 (en) 2016-01-13
US20150015299A1 (en) 2015-01-15
JP2015514226A (ja) 2015-05-18
JP6058119B2 (ja) 2017-01-11
CN104350588A (zh) 2015-02-11
US20130265071A1 (en) 2013-10-10
TWI551869B (zh) 2016-10-01

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C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: oregon

Applicant after: The whole company, Larry

Address before: oregon

Applicant before: Advanced Inquiry Systems Inc

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: ADVANCED INQUIRY SYSTEMS INC. TO: TRANSLARITY, INC.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220413

Address after: Building 1, No. 599, Huiwang East Road, Jiading District, Shanghai

Patentee after: Shanghai Jiasheng Semiconductor Co.,Ltd.

Address before: Ore

Patentee before: TRANSLARITY, Inc.

TR01 Transfer of patent right