SG11201406383RA - Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods - Google Patents

Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Info

Publication number
SG11201406383RA
SG11201406383RA SG11201406383RA SG11201406383RA SG11201406383RA SG 11201406383R A SG11201406383R A SG 11201406383RA SG 11201406383R A SG11201406383R A SG 11201406383RA SG 11201406383R A SG11201406383R A SG 11201406383RA SG 11201406383R A SG11201406383R A SG 11201406383RA
Authority
SG
Singapore
Prior art keywords
translators
coupleable
testing
methods
opposing surfaces
Prior art date
Application number
SG11201406383RA
Other languages
English (en)
Inventor
Morgan T Johnson
Original Assignee
Translarity Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Translarity Inc filed Critical Translarity Inc
Publication of SG11201406383RA publication Critical patent/SG11201406383RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
SG11201406383RA 2012-04-09 2013-04-04 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods SG11201406383RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261621954P 2012-04-09 2012-04-09
US13/840,937 US8779789B2 (en) 2012-04-09 2013-03-15 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
PCT/US2013/035286 WO2013154909A1 (en) 2012-04-09 2013-04-04 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Publications (1)

Publication Number Publication Date
SG11201406383RA true SG11201406383RA (en) 2014-11-27

Family

ID=49291807

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201406383RA SG11201406383RA (en) 2012-04-09 2013-04-04 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Country Status (8)

Country Link
US (2) US8779789B2 (https=)
EP (1) EP2837023A4 (https=)
JP (1) JP6058119B2 (https=)
KR (1) KR20150007305A (https=)
CN (1) CN104350588B (https=)
SG (1) SG11201406383RA (https=)
TW (1) TWI551869B (https=)
WO (1) WO2013154909A1 (https=)

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* Cited by examiner, † Cited by third party
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US8779789B2 (en) * 2012-04-09 2014-07-15 Advanced Inquiry Systems, Inc. Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
FR3032038B1 (fr) 2015-01-27 2018-07-27 Soitec Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat
CN106154596A (zh) * 2015-04-08 2016-11-23 上海纪显电子科技有限公司 光电显示装置、检测装置及其方法
US9794009B1 (en) * 2016-06-30 2017-10-17 Litepoint Corporation Method for testing a radio frequency (RF) data packet signal transceiver for proper implicit beamforming operation
US11791326B2 (en) * 2021-05-10 2023-10-17 International Business Machines Corporation Memory and logic chip stack with a translator chip

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US6728113B1 (en) 1993-06-24 2004-04-27 Polychip, Inc. Method and apparatus for non-conductively interconnecting integrated circuits
US5592730A (en) 1994-07-29 1997-01-14 Hewlett-Packard Company Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes
US5567654A (en) 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US6798224B1 (en) 1997-02-11 2004-09-28 Micron Technology, Inc. Method for testing semiconductor wafers
US6121065A (en) 1997-09-26 2000-09-19 Institute Of Microelectronics Wafer scale burn-in testing
US6100709A (en) 1998-05-29 2000-08-08 Intel Corporation Silicon wafer testing rig and a method for testing a silicon wafer wherein the silicon wafer is bent into a dome shape
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6452113B2 (en) 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6884653B2 (en) 2001-03-21 2005-04-26 Micron Technology, Inc. Folded interposer
US6680213B2 (en) * 2001-04-02 2004-01-20 Micron Technology, Inc. Method and system for fabricating contacts on semiconductor components
US6429513B1 (en) 2001-05-25 2002-08-06 Amkor Technology, Inc. Active heat sink for cooling a semiconductor chip
US6737879B2 (en) 2001-06-21 2004-05-18 Morgan Labs, Llc Method and apparatus for wafer scale testing
US6841991B2 (en) * 2002-08-29 2005-01-11 Micron Technology, Inc. Planarity diagnostic system, E.G., for microelectronic component test systems
US7071420B2 (en) 2002-12-18 2006-07-04 Micron Technology, Inc. Methods and apparatus for a flexible circuit interposer
US6897666B2 (en) 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
US6853205B1 (en) 2003-07-17 2005-02-08 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
JP2006010682A (ja) * 2004-05-28 2006-01-12 Jsr Corp 回路基板の検査装置および回路基板の検査方法
US7148715B2 (en) * 2004-06-02 2006-12-12 Micron Technology, Inc. Systems and methods for testing microelectronic imagers and microfeature devices
US7489147B2 (en) * 2004-07-15 2009-02-10 Jsr Corporation Inspection equipment of circuit board and inspection method of circuit board
JP4598779B2 (ja) * 2004-11-16 2010-12-15 富士通セミコンダクター株式会社 コンタクタ及びコンタクタを用いた試験方法
US7671449B2 (en) 2005-05-04 2010-03-02 Sun Microsystems, Inc. Structures and methods for an application of a flexible bridge
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Also Published As

Publication number Publication date
EP2837023A1 (en) 2015-02-18
WO2013154909A1 (en) 2013-10-17
KR20150007305A (ko) 2015-01-20
US9222965B2 (en) 2015-12-29
TW201350880A (zh) 2013-12-16
US8779789B2 (en) 2014-07-15
EP2837023A4 (en) 2016-01-13
CN104350588B (zh) 2017-04-05
US20150015299A1 (en) 2015-01-15
JP2015514226A (ja) 2015-05-18
JP6058119B2 (ja) 2017-01-11
CN104350588A (zh) 2015-02-11
US20130265071A1 (en) 2013-10-10
TWI551869B (zh) 2016-10-01

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