FR3032038B1 - Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat - Google Patents
Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat Download PDFInfo
- Publication number
- FR3032038B1 FR3032038B1 FR1550606A FR1550606A FR3032038B1 FR 3032038 B1 FR3032038 B1 FR 3032038B1 FR 1550606 A FR1550606 A FR 1550606A FR 1550606 A FR1550606 A FR 1550606A FR 3032038 B1 FR3032038 B1 FR 3032038B1
- Authority
- FR
- France
- Prior art keywords
- measuring
- substrate
- electrical characteristic
- characteristic
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/12—Measuring electrostatic fields or voltage-potential
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2648—Characterising semiconductor materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1550606A FR3032038B1 (fr) | 2015-01-27 | 2015-01-27 | Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat |
TW105101586A TWI642946B (zh) | 2015-01-27 | 2016-01-19 | 底材電特性之測量方法、裝置及系統 |
US15/546,252 US10429436B2 (en) | 2015-01-27 | 2016-01-19 | Method, device and system for measuring an electrical characteristic of a substrate |
PCT/EP2016/050977 WO2016120122A1 (fr) | 2015-01-27 | 2016-01-19 | Procédé, dispositif et système permettant de mesurer une caractéristique électrique d'un substrat |
JP2017540647A JP6778201B2 (ja) | 2015-01-27 | 2016-01-19 | 基板の電気的特性を測定するための、方法、装置およびシステム |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1550606 | 2015-01-27 | ||
FR1550606A FR3032038B1 (fr) | 2015-01-27 | 2015-01-27 | Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3032038A1 FR3032038A1 (fr) | 2016-07-29 |
FR3032038B1 true FR3032038B1 (fr) | 2018-07-27 |
Family
ID=52692953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1550606A Active FR3032038B1 (fr) | 2015-01-27 | 2015-01-27 | Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat |
Country Status (5)
Country | Link |
---|---|
US (1) | US10429436B2 (fr) |
JP (1) | JP6778201B2 (fr) |
FR (1) | FR3032038B1 (fr) |
TW (1) | TWI642946B (fr) |
WO (1) | WO2016120122A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI628443B (zh) * | 2017-12-20 | 2018-07-01 | 矽品精密工業股份有限公司 | 量測結構 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5225771A (en) * | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
JPH0798329A (ja) * | 1993-09-28 | 1995-04-11 | Hamamatsu Photonics Kk | E−oプローブ |
JP3616031B2 (ja) * | 2001-05-10 | 2005-02-02 | 富士通株式会社 | 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置 |
EP1417501B1 (fr) | 2001-08-13 | 2017-05-31 | Finisar Corporation | Systemes de rodage sur la tranche de dispositifs electroniques |
US20070040565A1 (en) * | 2005-08-19 | 2007-02-22 | National University of Singapore, Agency For Science, Technology and Research | Compliant probes and test methodology for fine pitch wafer level devices and interconnects |
JP2008028251A (ja) * | 2006-07-24 | 2008-02-07 | Japan Electronic Materials Corp | 半導体デバイス検査装置 |
JP2008082734A (ja) * | 2006-09-26 | 2008-04-10 | Sony Corp | 電気的接触装置、高周波測定システムおよび高周波測定方法 |
US7808248B2 (en) * | 2006-10-05 | 2010-10-05 | United Microelectronics Corp. | Radio frequency test key structure |
JP2010175378A (ja) * | 2009-01-29 | 2010-08-12 | Kyocera Corp | アンテナ測定用プローブ及びこれを用いた測定方法 |
JP2010219210A (ja) * | 2009-03-16 | 2010-09-30 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
GB2477358A (en) * | 2010-02-02 | 2011-08-03 | Thales Holdings Uk Plc | RF testing an integrated circuit assembly during manufacture using a interposed adaptor layer which is removed after test to attach the IC to a BGA |
KR101182268B1 (ko) * | 2010-07-09 | 2012-09-12 | 삼성디스플레이 주식회사 | 유기 발광 장치 |
WO2012054201A1 (fr) * | 2010-09-28 | 2012-04-26 | Advanced Inquiry Systems, Inc. | Systèmes de test de plaquettes et procédés associés pour leur utilisation et leur fabrication |
US8569861B2 (en) * | 2010-12-22 | 2013-10-29 | Analog Devices, Inc. | Vertically integrated systems |
JP5687172B2 (ja) * | 2011-11-01 | 2015-03-18 | 三菱電機株式会社 | 半導体テスト治具およびそれを用いた耐圧測定方法 |
FR2985812B1 (fr) * | 2012-01-16 | 2014-02-07 | Soitec Silicon On Insulator | Procede et dispositif de test de substrats semi-conducteurs pour applications radiofrequences |
US8779789B2 (en) * | 2012-04-09 | 2014-07-15 | Advanced Inquiry Systems, Inc. | Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods |
EP2674770A1 (fr) | 2012-06-14 | 2013-12-18 | Multitest elektronische Systeme GmbH | Dispositif et procédé de contrôle de composants électroniques sur un support ou un substrat |
TWI512306B (zh) | 2013-04-25 | 2015-12-11 | Murata Manufacturing Co | Test equipment for electronic parts |
TWM469489U (zh) | 2013-09-04 | 2014-01-01 | Nano Bit Tech Co Ltd | 測試組件及其電性檢測裝置 |
-
2015
- 2015-01-27 FR FR1550606A patent/FR3032038B1/fr active Active
-
2016
- 2016-01-19 TW TW105101586A patent/TWI642946B/zh active
- 2016-01-19 WO PCT/EP2016/050977 patent/WO2016120122A1/fr active Application Filing
- 2016-01-19 US US15/546,252 patent/US10429436B2/en active Active
- 2016-01-19 JP JP2017540647A patent/JP6778201B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2016120122A1 (fr) | 2016-08-04 |
JP6778201B2 (ja) | 2020-10-28 |
US10429436B2 (en) | 2019-10-01 |
TWI642946B (zh) | 2018-12-01 |
FR3032038A1 (fr) | 2016-07-29 |
JP2018508768A (ja) | 2018-03-29 |
US20180024186A1 (en) | 2018-01-25 |
TW201627675A (zh) | 2016-08-01 |
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