JP6030848B2 - 無電解銅めっき浴及び無電解銅めっき方法 - Google Patents

無電解銅めっき浴及び無電解銅めっき方法 Download PDF

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Publication number
JP6030848B2
JP6030848B2 JP2012105924A JP2012105924A JP6030848B2 JP 6030848 B2 JP6030848 B2 JP 6030848B2 JP 2012105924 A JP2012105924 A JP 2012105924A JP 2012105924 A JP2012105924 A JP 2012105924A JP 6030848 B2 JP6030848 B2 JP 6030848B2
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Prior art keywords
copper plating
electroless copper
plating bath
plating
concentration
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JP2012105924A
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Japanese (ja)
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JP2013234343A (ja
Inventor
隆浩 石嵜
隆浩 石嵜
中山　智晴
智晴 中山
輝幸 堀田
輝幸 堀田
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C.UYEMURA&CO.,LTD.
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C.UYEMURA&CO.,LTD.
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Priority to JP2012105924A priority Critical patent/JP6030848B2/ja
Priority to TW101149801A priority patent/TWI593824B/zh
Priority to US13/729,721 priority patent/US20130295294A1/en
Priority to KR1020130007542A priority patent/KR20130124880A/ko
Priority to CN201310038268.XA priority patent/CN103388138B/zh
Publication of JP2013234343A publication Critical patent/JP2013234343A/ja
Application granted granted Critical
Publication of JP6030848B2 publication Critical patent/JP6030848B2/ja
Priority to KR1020200016929A priority patent/KR102092929B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2012105924A 2012-05-07 2012-05-07 無電解銅めっき浴及び無電解銅めっき方法 Active JP6030848B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012105924A JP6030848B2 (ja) 2012-05-07 2012-05-07 無電解銅めっき浴及び無電解銅めっき方法
TW101149801A TWI593824B (zh) 2012-05-07 2012-12-25 無電解鍍銅浴及無電解鍍銅方法
US13/729,721 US20130295294A1 (en) 2012-05-07 2012-12-28 Electroless copper plating bath and electroless copper plating method
KR1020130007542A KR20130124880A (ko) 2012-05-07 2013-01-23 무전해 동 도금욕 및 무전해 동 도금 방법
CN201310038268.XA CN103388138B (zh) 2012-05-07 2013-01-31 非电解镀铜浴和非电解镀铜方法
KR1020200016929A KR102092929B1 (ko) 2012-05-07 2020-02-12 무전해 동 도금욕 및 무전해 동 도금 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012105924A JP6030848B2 (ja) 2012-05-07 2012-05-07 無電解銅めっき浴及び無電解銅めっき方法

Publications (2)

Publication Number Publication Date
JP2013234343A JP2013234343A (ja) 2013-11-21
JP6030848B2 true JP6030848B2 (ja) 2016-11-24

Family

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JP2012105924A Active JP6030848B2 (ja) 2012-05-07 2012-05-07 無電解銅めっき浴及び無電解銅めっき方法

Country Status (5)

Country Link
US (1) US20130295294A1 (zh)
JP (1) JP6030848B2 (zh)
KR (2) KR20130124880A (zh)
CN (1) CN103388138B (zh)
TW (1) TWI593824B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6645881B2 (ja) 2016-03-18 2020-02-14 上村工業株式会社 銅めっき液及び銅めっき方法
CN105648426B (zh) * 2016-03-23 2017-03-15 深圳市松柏实业发展有限公司 沉铜组合液
US11035051B2 (en) * 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
CN108336473A (zh) * 2018-02-06 2018-07-27 北京宏诚创新科技有限公司 铜-铝纳米接面常温制程方法
CN113678232A (zh) * 2019-04-10 2021-11-19 三菱电机株式会社 半导体装置及其制造方法
WO2022102226A1 (ja) * 2020-11-10 2022-05-19 メルテックス株式会社 無電解銅めっき液
CN113463074B (zh) * 2021-06-03 2022-06-14 广东硕成科技股份有限公司 一种沉铜组合物及沉铜方法
CN115440989A (zh) * 2022-09-30 2022-12-06 楚能新能源股份有限公司 一种锂离子电池用负极集流体、极片及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition
NL7304650A (zh) * 1973-04-04 1974-10-08
US4143186A (en) * 1976-09-20 1979-03-06 Amp Incorporated Process for electroless copper deposition from an acidic bath
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
USH325H (en) * 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
US4374009A (en) * 1981-09-28 1983-02-15 Xerox Corporation Electrochemical post treatment of perpendicular magnetic recording media
JPH05195237A (ja) * 1992-01-21 1993-08-03 Hitachi Ltd ホルマリンを用いない化学銅めっき方法
JP2001131761A (ja) * 1999-11-02 2001-05-15 Murata Mfg Co Ltd 無電解銅めっき浴、無電解銅めっき方法および電子部品
JP2004273315A (ja) * 2003-03-10 2004-09-30 Sharp Corp イオン発生装置、空気調節装置および荷電装置

Also Published As

Publication number Publication date
CN103388138A (zh) 2013-11-13
US20130295294A1 (en) 2013-11-07
CN103388138B (zh) 2018-07-24
JP2013234343A (ja) 2013-11-21
KR20200020750A (ko) 2020-02-26
KR102092929B1 (ko) 2020-03-24
KR20130124880A (ko) 2013-11-15
TWI593824B (zh) 2017-08-01
TW201346068A (zh) 2013-11-16

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