JP6027812B2 - 回路接続材料 - Google Patents

回路接続材料 Download PDF

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Publication number
JP6027812B2
JP6027812B2 JP2012173730A JP2012173730A JP6027812B2 JP 6027812 B2 JP6027812 B2 JP 6027812B2 JP 2012173730 A JP2012173730 A JP 2012173730A JP 2012173730 A JP2012173730 A JP 2012173730A JP 6027812 B2 JP6027812 B2 JP 6027812B2
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JP
Japan
Prior art keywords
mass
parts
acrylic rubber
anisotropic conductive
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012173730A
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English (en)
Japanese (ja)
Other versions
JP2014031464A (ja
Inventor
慎一 林
慎一 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2012173730A priority Critical patent/JP6027812B2/ja
Priority to KR1020130092327A priority patent/KR102094305B1/ko
Priority to CN201310338315.2A priority patent/CN103571424B/zh
Publication of JP2014031464A publication Critical patent/JP2014031464A/ja
Application granted granted Critical
Publication of JP6027812B2 publication Critical patent/JP6027812B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2012173730A 2012-08-06 2012-08-06 回路接続材料 Active JP6027812B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012173730A JP6027812B2 (ja) 2012-08-06 2012-08-06 回路接続材料
KR1020130092327A KR102094305B1 (ko) 2012-08-06 2013-08-05 회로 접속 재료
CN201310338315.2A CN103571424B (zh) 2012-08-06 2013-08-06 电路连接材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012173730A JP6027812B2 (ja) 2012-08-06 2012-08-06 回路接続材料

Publications (2)

Publication Number Publication Date
JP2014031464A JP2014031464A (ja) 2014-02-20
JP6027812B2 true JP6027812B2 (ja) 2016-11-16

Family

ID=50044148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012173730A Active JP6027812B2 (ja) 2012-08-06 2012-08-06 回路接続材料

Country Status (3)

Country Link
JP (1) JP6027812B2 (ko)
KR (1) KR102094305B1 (ko)
CN (1) CN103571424B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104951156A (zh) * 2014-03-31 2015-09-30 宸盛光电有限公司 电容式触控装置
JP7273283B2 (ja) * 2018-09-10 2023-05-15 デクセリアルズ株式会社 接着剤組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211602A (en) * 1961-05-05 1965-10-12 Harold R Horstman Polytrifluorocarbon adhesive comprising an alpha-carboxymethylacrylate copolymer reacted with an epoxy and a polyamino-polyamide resin
JPH03277650A (ja) * 1990-03-28 1991-12-09 Nissan Motor Co Ltd 接着性にすぐれた導電性樹脂組成物
JPH06228412A (ja) * 1993-01-29 1994-08-16 Nissan Motor Co Ltd 防錆性に優れた樹脂組成物
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
WO2000060614A1 (fr) * 1999-04-01 2000-10-12 Mitsui Chemicals, Inc. Pate a conduction anisotrope
JP3904798B2 (ja) * 1999-04-01 2007-04-11 三井化学株式会社 異方導電性ペースト
JP2003147306A (ja) 2001-11-09 2003-05-21 Fujitsu Ltd 導電性接着剤
JP5252698B2 (ja) * 2008-06-18 2013-07-31 信越化学工業株式会社 樹脂バンプ用組成物
JP2010241951A (ja) * 2009-04-06 2010-10-28 Hitachi Chem Co Ltd 透明接着剤組成物、透明接着フィルムとその製造方法及び表示装置搭載部材とその製造方法
JP2011228637A (ja) * 2010-03-30 2011-11-10 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP5767792B2 (ja) 2010-08-27 2015-08-19 デクセリアルズ株式会社 実装体の製造方法、接続方法及び異方性導電膜
JP2011181525A (ja) * 2011-06-09 2011-09-15 Sony Chemical & Information Device Corp 異方性導電材料

Also Published As

Publication number Publication date
JP2014031464A (ja) 2014-02-20
KR102094305B1 (ko) 2020-03-31
CN103571424A (zh) 2014-02-12
CN103571424B (zh) 2017-07-18
KR20140019234A (ko) 2014-02-14

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