JP6020562B2 - 蓋開閉装置 - Google Patents
蓋開閉装置 Download PDFInfo
- Publication number
- JP6020562B2 JP6020562B2 JP2014520992A JP2014520992A JP6020562B2 JP 6020562 B2 JP6020562 B2 JP 6020562B2 JP 2014520992 A JP2014520992 A JP 2014520992A JP 2014520992 A JP2014520992 A JP 2014520992A JP 6020562 B2 JP6020562 B2 JP 6020562B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Retry When Errors Occur (AREA)
- User Interface Of Digital Computer (AREA)
- Medicinal Preparation (AREA)
Description
[ストッカの構成]
[蓋開閉装置の構成]
[蓋開閉装置の錠開閉機構の構成]
Claims (3)
- 被収納物を収納する容器本体と、前記容器本体に対して開閉可能な底部を成し、前記被収納物が載置される蓋部と、前記容器本体に対する前記蓋部の開錠及び施錠を行う錠機構と、を備える収納容器について、前記容器本体に対する前記蓋部の開閉を行う蓋開閉装置であって、
前記収納容器が載置される装置本体と、
前記装置本体に前記収納容器が載置されたときに前記錠機構に係合する係合部を有し、前記係合部を移動させることで、前記錠機構に前記開錠を行わせるための開錠動作、及び前記錠機構に前記施錠を行わせるための施錠動作を行う移動部と、
前記錠機構に前記開錠を行わせる場合には、前記移動部と連動して、前記容器本体を前記装置本体に固定させる容器固定部と、
を備え、
前記移動部は、
前記係合部を有すると共に、前記装置本体に対して第1の中心軸まわりに回動可能に支持された回動部材と、
前記回動部材に対して前記第1の中心軸に平行な第2の中心軸まわりに回動可能に連結され、移動により前記回動部材を回動させる連結部材と、
前記装置本体に取り付けられ、前記連結部材に駆動力を付与するアクチュエータと、
前記連結部材に設けられた連動部材と、を有し、
前記容器固定部は、
基端側が前記装置本体に対して前記第1の中心軸に平行な第3の中心軸まわりに回動可能に支持され先端側が移動可能とされると共に、カム面を有するレバー部と、
前記レバー部の先端側に取り付けられ、前記容器本体に当接及び離間可能な押圧部材と、
前記押圧部材が前記容器本体に向けて付勢されるように、前記レバー部を付勢する付勢部材と、を有し、
前記連動部材は、前記施錠動作を行う方向に前記連結部材が移動させられた場合、前記カム面に当接して前記付勢部材の付勢に抗する方向に前記レバー部を回動させ、且つ、前記開錠動作を行う方向に前記連結部材が移動させられた場合、前記付勢部材によるレバー部の付勢を許容する、前記連結部材上の位置に設けられている、蓋開閉装置。 - 前記回動部材は複数設けられ、
前記連結部材は、少なくとも一対の前記回動部材を連結して当該回動部材を回動させる、
請求項1記載の蓋開閉装置。 - 前記押圧部材は、前記容器本体と弾性的に当接可能な弾性ローラであり、前記レバー部の先端側に回動可能に取り付けられ、
前記付勢部材は、前記レバー部の先端側を付勢するバネであり、
前記連動部材は、前記レバー部を回動させるカムフォロアである、
請求項1又は2に記載の蓋開閉装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014520992A JP6020562B2 (ja) | 2012-06-14 | 2013-04-17 | 蓋開閉装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012134831 | 2012-06-14 | ||
JP2012134831 | 2012-06-14 | ||
PCT/JP2013/061400 WO2013187121A1 (ja) | 2012-06-14 | 2013-04-17 | 蓋開閉装置 |
JP2014520992A JP6020562B2 (ja) | 2012-06-14 | 2013-04-17 | 蓋開閉装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013187121A1 JPWO2013187121A1 (ja) | 2016-02-04 |
JP6020562B2 true JP6020562B2 (ja) | 2016-11-02 |
Family
ID=49757959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014520992A Active JP6020562B2 (ja) | 2012-06-14 | 2013-04-17 | 蓋開閉装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9514973B2 (ja) |
EP (1) | EP2863422B1 (ja) |
JP (1) | JP6020562B2 (ja) |
KR (1) | KR101657595B1 (ja) |
CN (1) | CN104380455B (ja) |
SG (1) | SG11201408294QA (ja) |
TW (1) | TWI567005B (ja) |
WO (1) | WO2013187121A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2863423B1 (en) * | 2012-06-14 | 2019-09-11 | Murata Machinery, Ltd. | Lid opening/closing device |
CN105474380B (zh) * | 2013-08-20 | 2017-10-31 | 村田机械株式会社 | 气体清洗装置及气体清洗方法 |
JP6020511B2 (ja) * | 2014-05-08 | 2016-11-02 | トヨタ自動車株式会社 | ウエハキャリア |
TWI674930B (zh) * | 2017-04-18 | 2019-10-21 | 韓商Sti股份有限公司 | 用於清潔容器的設備 |
CN110719835B (zh) * | 2017-06-09 | 2021-09-24 | 日精Asb机械株式会社 | 模具 |
KR20190068266A (ko) | 2017-12-08 | 2019-06-18 | 김정구 | 영상을 이용한 가축 무게 측정 장치 및 방법 |
US20190333797A1 (en) * | 2018-04-30 | 2019-10-31 | Stek Co., Ltd | Apparatus and method for opening snap-shot cases |
TWI685711B (zh) * | 2018-08-27 | 2020-02-21 | 家登精密工業股份有限公司 | 光罩盒及其作動方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4746256A (en) | 1986-03-13 | 1988-05-24 | Roboptek, Inc. | Apparatus for handling sensitive material such as semiconductor wafers |
JPH03180600A (ja) | 1989-12-06 | 1991-08-06 | Nisshinbo Ind Inc | ペーパータオル及びその製造方法 |
JP3180600B2 (ja) | 1995-01-09 | 2001-06-25 | 神鋼電機株式会社 | 密閉コンテナ |
US5586585A (en) * | 1995-02-27 | 1996-12-24 | Asyst Technologies, Inc. | Direct loadlock interface |
JP3796782B2 (ja) * | 1995-11-13 | 2006-07-12 | アシスト シンコー株式会社 | 機械的インターフェイス装置 |
US6160265A (en) * | 1998-07-13 | 2000-12-12 | Kensington Laboratories, Inc. | SMIF box cover hold down latch and box door latch actuating mechanism |
JP3954287B2 (ja) * | 1999-06-28 | 2007-08-08 | 東京エレクトロン株式会社 | ウェハキャリア用蓋体の着脱装置 |
JP3933921B2 (ja) * | 2001-12-04 | 2007-06-20 | Tdk株式会社 | 半導体ウェーハ保管用クリーンボックスパージ装置 |
JP4765607B2 (ja) * | 2005-12-19 | 2011-09-07 | 大日本印刷株式会社 | 耐衝撃性クリーン容器、試料移載システム |
TW200808628A (en) * | 2006-08-09 | 2008-02-16 | Gudeng Prec Ind Co Ltd | Filling device of conveying box |
JP5273245B2 (ja) * | 2009-05-12 | 2013-08-28 | 村田機械株式会社 | パージ装置およびパージ方法 |
TW201206787A (en) * | 2010-04-30 | 2012-02-16 | Fortrend Engineering Corp | Opener for extreme ultra violet lithography reticle pods |
-
2013
- 2013-04-17 EP EP13804692.5A patent/EP2863422B1/en active Active
- 2013-04-17 US US14/407,195 patent/US9514973B2/en active Active
- 2013-04-17 KR KR1020157000135A patent/KR101657595B1/ko active IP Right Grant
- 2013-04-17 WO PCT/JP2013/061400 patent/WO2013187121A1/ja active Application Filing
- 2013-04-17 CN CN201380030404.9A patent/CN104380455B/zh active Active
- 2013-04-17 SG SG11201408294QA patent/SG11201408294QA/en unknown
- 2013-04-17 JP JP2014520992A patent/JP6020562B2/ja active Active
- 2013-06-11 TW TW102120699A patent/TWI567005B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2013187121A1 (ja) | 2013-12-19 |
CN104380455A (zh) | 2015-02-25 |
US20150170949A1 (en) | 2015-06-18 |
TW201404687A (zh) | 2014-02-01 |
SG11201408294QA (en) | 2015-01-29 |
KR101657595B1 (ko) | 2016-09-19 |
TWI567005B (zh) | 2017-01-21 |
JPWO2013187121A1 (ja) | 2016-02-04 |
KR20150023636A (ko) | 2015-03-05 |
EP2863422B1 (en) | 2020-06-24 |
US9514973B2 (en) | 2016-12-06 |
EP2863422A4 (en) | 2016-02-10 |
EP2863422A1 (en) | 2015-04-22 |
CN104380455B (zh) | 2016-10-12 |
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