SG11201408294QA - Lid-opening/closing device - Google Patents

Lid-opening/closing device

Info

Publication number
SG11201408294QA
SG11201408294QA SG11201408294QA SG11201408294QA SG11201408294QA SG 11201408294Q A SG11201408294Q A SG 11201408294QA SG 11201408294Q A SG11201408294Q A SG 11201408294QA SG 11201408294Q A SG11201408294Q A SG 11201408294QA SG 11201408294Q A SG11201408294Q A SG 11201408294QA
Authority
SG
Singapore
Prior art keywords
opening
locking
lid
closing
locking mechanism
Prior art date
Application number
SG11201408294QA
Inventor
Noriyasu Fukaya
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11201408294QA publication Critical patent/SG11201408294QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Retry When Errors Occur (AREA)
  • User Interface Of Digital Computer (AREA)
  • Medicinal Preparation (AREA)

Abstract

(i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» allium 2013# 12 fll9 0(19.12.2013) w , PO tpCT (10) WO 2013/187121 A1 (51) H01L 21/677 (2006.01) B65D 55/02 (2006.01) (21) (22) (25) (26) HI®4>§f]CDl r=£. I DP • B65D 85/86 (2006.01) H01L 21/673 (2006.01) PCT/JP2013/061400 2013^4^ 17 0(17.04.2013) (30) fiBfefix — £: 2012-134831 2012 ^6^ 14 0(14.06.2012) JP (71) Hi M A : H H M # tt (MURATA MA­ CHINERY, LTD.) [JP/JP]; T 6018326 MEn#l&M2i-nBT3#±t!; Kyoto (JP). (72) ^E \R%-.W& ®JS(1'UKAYA Noriyasu); T 4848502 timmm Aichi(jp). (74) ftllA: 5?lit, ^(HASEGAWA Yoshiki et al.); T 1000005 itifvflW-t H E^LCO fa ~ T g 1 # I-^*LO>A MY PLAZA 9® Tokyo (JP). (8i) (^ro&i^PBy, IS ^ nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) ii£H (asrofci^isy > ±T(Dmm(Dfcm% 11^ nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3. — =j V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI [&£%] (54) Title: LID-OPENING/CLOSING DEVICE (54) | [013] 82A 80A- CJ i-H l> 00 i-H o CJ o & -80B S -82B -38 FRONT SIDE REAR SIDE . LEFTSIDE . RIGHT SIDE (57) Abstract: A lid-opening/closing device (1) equipped is with a device body (2), a lock-opening/closing mechanism (30), and a container-immobilizing part (80). The device body is provided with a pod (70) equipped with container a body (71), a lid section (72) for forming bottom section capable of a opening and closing in relation to the container body, and a locking mechanism (74) for unlocking and locking the lid section in relation to the contain­ er body. The lock-opening/closing mechanism performs an un­ locking operation for unlocking the locking mechanism, and per­ forms locking mechanism a for locking the locking mechanism, by moving an engaging part (35) which engages the locking mechan­ ism when the pod is positioned in the device body. (57)®ift:SMfflgS (1) l£> SS*f* (2) t, teMfflttH# (3 0) t, (8 0) tzm*. •i>o (7 1) (7 2) t, t, R (7 0) jb<*ES$*i6o m\t, vfimwztitztzizm (35) Zlt&ZtV* % m&mn m& % ic £ tz © m&mit > RU%m Icffite £ frfr 1± <5 f= ifc©ffiteSbtt £ *T 5 o ®S §m?m mtmrnLx, WO 2013/187121 AlllllllH (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). - (&&£ 21 &(3))
SG11201408294QA 2012-06-14 2013-04-17 Lid-opening/closing device SG11201408294QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012134831 2012-06-14
PCT/JP2013/061400 WO2013187121A1 (en) 2012-06-14 2013-04-17 Lid-opening/closing device

Publications (1)

Publication Number Publication Date
SG11201408294QA true SG11201408294QA (en) 2015-01-29

Family

ID=49757959

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408294QA SG11201408294QA (en) 2012-06-14 2013-04-17 Lid-opening/closing device

Country Status (8)

Country Link
US (1) US9514973B2 (en)
EP (1) EP2863422B1 (en)
JP (1) JP6020562B2 (en)
KR (1) KR101657595B1 (en)
CN (1) CN104380455B (en)
SG (1) SG11201408294QA (en)
TW (1) TWI567005B (en)
WO (1) WO2013187121A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101650530B1 (en) * 2012-06-14 2016-08-23 무라다기카이가부시끼가이샤 Lid opening/closing device
EP3038147B1 (en) * 2013-08-20 2021-03-24 Murata Machinery, Ltd. Gas purge device and gas purge method
JP6020511B2 (en) * 2014-05-08 2016-11-02 トヨタ自動車株式会社 Wafer carrier
TWI674930B (en) * 2017-04-18 2019-10-21 韓商Ｓｔｉ股份有限公司 Apparatus for cleaning container
JP7112395B2 (en) * 2017-06-09 2022-08-03 日精エー・エス・ビー機械株式会社 Mold
KR20190068266A (en) 2017-12-08 2019-06-18 김정구 System for measuring weight of livestocks using image analysis and method using the same
US20190333797A1 (en) * 2018-04-30 2019-10-31 Stek Co., Ltd Apparatus and method for opening snap-shot cases
TWI685711B (en) * 2018-08-27 2020-02-21 家登精密工業股份有限公司 Reticle pod and operating method thereof
KR102698157B1 (en) * 2024-03-21 2024-08-23 내일시스템주식회사 The cassette for the substrate mounting

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4746256A (en) * 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
JPH03180600A (en) 1989-12-06 1991-08-06 Nisshinbo Ind Inc Paper towel and production thereof
JP3180600B2 (en) 1995-01-09 2001-06-25 神鋼電機株式会社 Closed container
US5586585A (en) * 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface
JP3796782B2 (en) * 1995-11-13 2006-07-12 アシスト シンコー株式会社 Mechanical interface device
US6160265A (en) * 1998-07-13 2000-12-12 Kensington Laboratories, Inc. SMIF box cover hold down latch and box door latch actuating mechanism
JP3954287B2 (en) * 1999-06-28 2007-08-08 東京エレクトロン株式会社 Wafer carrier lid attachment / detachment device
JP3933921B2 (en) 2001-12-04 2007-06-20 Ｔｄｋ株式会社 Clean box purge equipment for semiconductor wafer storage
JP4765607B2 (en) 2005-12-19 2011-09-07 大日本印刷株式会社 Impact resistant clean container, sample transfer system
TW200808628A (en) 2006-08-09 2008-02-16 Gudeng Prec Ind Co Ltd Filling device of conveying box
JP5273245B2 (en) * 2009-05-12 2013-08-28 村田機械株式会社 Purge apparatus and purge method
TW201206787A (en) 2010-04-30 2012-02-16 Fortrend Engineering Corp Opener for extreme ultra violet lithography reticle pods

Also Published As

Publication number Publication date
JP6020562B2 (en) 2016-11-02
US20150170949A1 (en) 2015-06-18
KR20150023636A (en) 2015-03-05
JPWO2013187121A1 (en) 2016-02-04
KR101657595B1 (en) 2016-09-19
US9514973B2 (en) 2016-12-06
EP2863422A4 (en) 2016-02-10
CN104380455A (en) 2015-02-25
CN104380455B (en) 2016-10-12
EP2863422A1 (en) 2015-04-22
TW201404687A (en) 2014-02-01
TWI567005B (en) 2017-01-21
WO2013187121A1 (en) 2013-12-19
EP2863422B1 (en) 2020-06-24

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