SG11201408295UA - Lid opening/closing device - Google Patents

Lid opening/closing device

Info

Publication number
SG11201408295UA
SG11201408295UA SG11201408295UA SG11201408295UA SG11201408295UA SG 11201408295U A SG11201408295U A SG 11201408295UA SG 11201408295U A SG11201408295U A SG 11201408295UA SG 11201408295U A SG11201408295U A SG 11201408295UA SG 11201408295U A SG11201408295U A SG 11201408295UA
Authority
SG
Singapore
Prior art keywords
lock mechanism
locking
unlocking
moving sections
sections
Prior art date
Application number
SG11201408295UA
Inventor
Noriyuki KURATSU
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11201408295UA publication Critical patent/SG11201408295UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00—Closures not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Closures For Containers (AREA)

Abstract

(i2) mwu ft iz s-5 iv x m £ titz s issaj n (19) ##Mnttffi*r*t«lllS IHMMi _ (4T» HIB^gfl n tz^y 2013# 12 fll9 0(19.12.2013) w , PO tpCT (10) WO 2013/187104 A1 (51) H01L 21/677 (2006.01) B65D 55/02 (2006.01) (21) (22) (25) g|@ttii0>Wi§: (26) HI®4>§f]CDl rfE. I DP . B65D 85/86 (2006.01) H01L 21/673 (2006.01) PCT/JP2013/058840 2013 ^ 3 M 26 0(26.03.2013) a^ig (30) fiBfefix — 4#Jgi 2012-134830 2012 ^6^ 14 8(14.06.2012) JP (71) t±i SI A : H H M # tt (MURATA MA­ CHINERY, LTD.) [JP/JP]; T 6018326 Kyoto (JP). (72) ^ BJ #: 5t ;t • ® ^ (KURATSU Noriyuki); T 5160005 SIR^S9'rfT'rt\" / 'T W-®7 1 0 0§tt!j fct Ba«|«tt3C^a#»¥llRfrrt Mie (JP). (74) ftllA: 5?lit, ^(HASEGAWA Yoshiki et al.); T 1000005 E^LCO fa ~ T g 1 # MY PLAZA tf;u) 9® Tokyo (JP). (8i) (^ro&i^PBy, IS ^ PJ ft): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) ii£H (asrofci^isy > ±T(Dmm(Dfcm% 11^ nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3. — =j V T (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). - 21 £(3)) (54) Title: LID OPENING/CLOSING DEVICE (54) |: SMISSS •t o i-H l> 00 i-H en i-H o CJ o & ( , 36 1 ^ 35 3b 34- --34 35 36 _37 37_ 36 ^,35 34-' - - 34 36 3,9 35 30 3c (57) Abstract: A lid opening/closing device (1) is provided with: a device body (2) on which a pod (70) is placed that comprises a container body (71), a lid (72) that forms lower a section that can be opened and closed relative to the container body, and a lock mechanism (74) for locking and unlocking the lid relative to the container body; plurality of moving a sections (31) that, by causing an engagement pin (35) that engages with the lock mechanism to move, carry out an unlocking operation for unlocking the lock mechanism, and a locking operation for locking the lock mechanism; a linking section (32) that, when unlocking the lock mechanism, links the plurality of moving sections and causes the plurality of moving sections to carry out the unlock­ ing operation, and when locking the lock mechanism, links the plurality of moving sections and causes the plurality of moving sections to carry out the locking operation; and one air cylinder (33) that simultaneously drives the moving sections and the linking section. (57)®ift:SMfflgS (1) l£> (7 1 (7 2) (7 0) (2 (35) \\~mm !£-^l mici t. 02) t ) t > 4) t, ) <t> £$1 t \"£\ ^ mmmmiz mn (31) »a>if£SljSP£ mmmmiz £-t±rlig&a> (3 3) t.
SG11201408295UA 2012-06-14 2013-03-26 Lid opening/closing device SG11201408295UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012134830 2012-06-14
PCT/JP2013/058840 WO2013187104A1 (en) 2012-06-14 2013-03-26 Lid opening/closing device

Publications (1)

Publication Number Publication Date
SG11201408295UA true SG11201408295UA (en) 2015-01-29

Family

ID=49757943

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408295UA SG11201408295UA (en) 2012-06-14 2013-03-26 Lid opening/closing device

Country Status (8)

Country Link
US (1) US9517868B2 (en)
EP (1) EP2863423B1 (en)
JP (1) JP5854136B2 (en)
KR (1) KR101650530B1 (en)
CN (1) CN104285289B (en)
SG (1) SG11201408295UA (en)
TW (1) TWI616386B (en)
WO (1) WO2013187104A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6375186B2 (en) * 2014-09-05 2018-08-15 株式会社Ｓｃｒｅｅｎホールディングス Substrate storage container, load port device, and substrate processing apparatus
US10358284B2 (en) 2016-06-16 2019-07-23 Sigma Phase, Corp. System for providing a single serving of a frozen confection
US10503082B2 (en) 2017-07-31 2019-12-10 Taiwan Semiconductor Manufacturing Company, Ltd. Optical reticle load port
US11018037B2 (en) 2017-07-31 2021-05-25 Taiwan Semiconductor Manufacturing Company, Ltd. Optical reticle load port
CN109659259B (en) * 2018-12-12 2020-06-12 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Film box taking and placing mechanism and semiconductor wet process soaking tank shaking device
TWI693671B (en) * 2019-04-16 2020-05-11 家登精密工業股份有限公司 Reticle pod and gripping unit thereof
CN115108139A (en) * 2022-05-30 2022-09-27 零双仙 Paediatrics has blood storage device of antidetonation function

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674939A (en) * 1984-07-30 1987-06-23 Asyst Technologies Sealed standard interface apparatus
US4746256A (en) 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
JPH03180600A (en) 1989-12-06 1991-08-06 Nisshinbo Ind Inc Paper towel and production thereof
JP3180600B2 (en) 1995-01-09 2001-06-25 神鋼電機株式会社 Closed container
US5967571A (en) 1995-10-13 1999-10-19 Empak, Inc. Vacuum actuated mechanical latch
KR100418107B1 (en) * 1995-10-13 2004-05-20 엠팍 인코포레이티드 Container with vacuum-actuated mechanical latch and graffiti
US5727685A (en) * 1995-10-19 1998-03-17 Svg Lithography Systems, Inc. Reticle container with corner holding
JPH11278514A (en) * 1998-03-31 1999-10-12 Nifco Inc Open/close structure of cover member
DE60043699D1 (en) 1999-07-14 2010-03-04 Tokyo Electron Ltd ON / OFF DEVICE FOR ON / OFF LID OF STORAGE CONTAINER FOR UNHANDED THINGS AND TREATMENT SYSTEM FOR UNAUTHORIZED THINGS
AU2002227395A1 (en) * 2000-12-13 2002-06-24 Entergris Cayman Ltd. System for preventing improper insertion of foup door into foup
US6880718B2 (en) * 2002-01-15 2005-04-19 Entegris, Inc. Wafer carrier door and spring biased latching mechanism
US6772612B2 (en) * 2002-01-29 2004-08-10 Intel Corporation Door-in-door front opening unified pod
KR20030075838A (en) * 2002-03-21 2003-09-26 주식회사 하이워크 process for painting a paved road
DE10240771B3 (en) * 2002-08-30 2004-03-11 Infineon Technologies Ag Container for semiconductor discs or flat image screen elements used for transporting discs between successive treatment stations during manufacturing process
US7674083B2 (en) * 2003-05-15 2010-03-09 Tdk Corporation Clean device with clean box-opening/closing device
JP4851445B2 (en) * 2005-05-31 2012-01-11 三甲株式会社 Opening and closing structure of thin plate container
JP4841383B2 (en) * 2006-10-06 2011-12-21 信越ポリマー株式会社 Lid and substrate storage container
TWI317339B (en) * 2006-12-22 2009-11-21 Ind Tech Res Inst A latch mechanism of clean container
JP5273245B2 (en) * 2009-05-12 2013-08-28 村田機械株式会社 Purge apparatus and purge method
JP2011100983A (en) * 2009-10-07 2011-05-19 Shin Etsu Polymer Co Ltd Wafer storage container
EP2863422B1 (en) * 2012-06-14 2020-06-24 Murata Machinery, Ltd. Lid-opening/closing device

Also Published As

Publication number Publication date
CN104285289B (en) 2016-10-26
EP2863423A1 (en) 2015-04-22
TWI616386B (en) 2018-03-01
KR20150006446A (en) 2015-01-16
KR101650530B1 (en) 2016-08-23
EP2863423B1 (en) 2019-09-11
CN104285289A (en) 2015-01-14
JP5854136B2 (en) 2016-02-09
TW201404688A (en) 2014-02-01
EP2863423A4 (en) 2016-03-02
JPWO2013187104A1 (en) 2016-02-04
US20150166227A1 (en) 2015-06-18
WO2013187104A1 (en) 2013-12-19
US9517868B2 (en) 2016-12-13

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