JP6008088B2 - 電子デバイス、電子デバイスの製造方法および電子機器 - Google Patents

電子デバイス、電子デバイスの製造方法および電子機器 Download PDF

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Publication number
JP6008088B2
JP6008088B2 JP2012079642A JP2012079642A JP6008088B2 JP 6008088 B2 JP6008088 B2 JP 6008088B2 JP 2012079642 A JP2012079642 A JP 2012079642A JP 2012079642 A JP2012079642 A JP 2012079642A JP 6008088 B2 JP6008088 B2 JP 6008088B2
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lid
hole
metal
base body
metal porous
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JP2013211358A (ja
JP2013211358A5 (enExample
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賢 三上
賢 三上
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Seiko Epson Corp
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Seiko Epson Corp
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JP2012079642A 2012-03-30 2012-03-30 電子デバイス、電子デバイスの製造方法および電子機器 Expired - Fee Related JP6008088B2 (ja)

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JP2012079642A JP6008088B2 (ja) 2012-03-30 2012-03-30 電子デバイス、電子デバイスの製造方法および電子機器

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JP2012079642A JP6008088B2 (ja) 2012-03-30 2012-03-30 電子デバイス、電子デバイスの製造方法および電子機器

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JP2013211358A JP2013211358A (ja) 2013-10-10
JP2013211358A5 JP2013211358A5 (enExample) 2015-04-30
JP6008088B2 true JP6008088B2 (ja) 2016-10-19

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018135650A1 (ja) * 2017-01-19 2018-07-26 株式会社村田製作所 電子部品及び電子部品の製造方法
JP6738760B2 (ja) 2017-04-13 2020-08-12 田中貴金属工業株式会社 貫通孔の封止構造及び封止方法、並びに、貫通孔を封止するための転写基板
CN115378391B (zh) * 2022-08-25 2025-09-09 铜陵市晶汇电子有限公司 一种全金属封装晶体谐振器及其封装工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194553A (ja) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd 回路基板とその製造方法
JP5065718B2 (ja) * 2006-06-20 2012-11-07 田中貴金属工業株式会社 圧電素子の気密封止方法、及び、圧電デバイスの製造方法
JP2008277954A (ja) * 2007-04-26 2008-11-13 Fujitsu Media Device Kk パッケージデバイス
JP5076166B2 (ja) * 2008-05-16 2012-11-21 セイコーエプソン株式会社 圧電デバイス及びその封止方法
JP2010057081A (ja) * 2008-08-29 2010-03-11 Kyocera Kinseki Corp 圧電振動子の製造方法
JP5485714B2 (ja) * 2010-01-07 2014-05-07 セイコーインスツル株式会社 パッケージの製造方法
JP4795483B1 (ja) * 2010-04-12 2011-10-19 ニホンハンダ株式会社 金属製部材接合体の製造方法および金属製部材接合体

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