JP5973461B2 - 拡張型半導体チップ及び半導体装置 - Google Patents
拡張型半導体チップ及び半導体装置 Download PDFInfo
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- JP5973461B2 JP5973461B2 JP2013544090A JP2013544090A JP5973461B2 JP 5973461 B2 JP5973461 B2 JP 5973461B2 JP 2013544090 A JP2013544090 A JP 2013544090A JP 2013544090 A JP2013544090 A JP 2013544090A JP 5973461 B2 JP5973461 B2 JP 5973461B2
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Description
本発明の第1の実施形態について図1(a)〜図1(c)を参照しながら説明する。
図3は第1の実施形態の第1変形例に係る半導体装置の平面構成を示している。図3に示すように、第1変形例に係る半導体装置1は、第1半導体チップ2の複数の第1電極21が、該第1半導体チップ2のほぼ中央部に、Y方向に長い行列状に配置され、且つX方向の間隔が比較的に大きくなるように配置されている。複数の第1電極21がこのように配置されている場合は、拡張型半導体チップ3を、第2半導体チップ31、第3半導体チップ32及び第4半導体チップ36の3つのチップで構成する。従って、例えば、第2半導体チップ31と第3半導体チップ32との間に第4半導体チップ36が挟まれるように配置する。
図4は第1の実施形態の第2変形例に係る半導体装置の平面構成を示している。図4に示すように、第2変形例に係る半導体装置1は、第1半導体チップ2の複数の第1電極21が、該第1半導体チップ2のほぼ中央部に集中して平面十字状に配置されている。複数の第1電極21がこのように配置されている場合は、拡張型半導体チップ3を、第2半導体チップ31、第3半導体チップ32、第4半導体チップ36及び第5半導体チップ37の4つのチップで構成する。従って、例えば、各半導体チップ31、32、36及び37を2行2列に配置し、その対向する側面同士の間に樹脂拡張部33を配置する。
図5(a)及び図5(b)は第1の実施形態の第3変形例に係る半導体装置の平面構成及び断面構成を示している。図5(a)に示すように、第3変形例に係る半導体装置1は、第1半導体チップ2の複数の第1電極21が、該第1半導体チップ2の対向する2つの側部の近傍に一列ずつ配置されている。複数の第1電極21がこのように配置されている場合は、拡張型半導体チップ3を第2半導体チップ31でのみ形成する。さらに、第2半導体チップ31の4つの側面のすべてに、すなわち第2半導体チップ31の周囲に樹脂拡張部33を設け、第2半導体チップ31と一体に形成する。さらに、樹脂拡張部33の上に各第1電極21が対向するように、拡張型半導体チップ3の第2電極35をそれぞれ形成する。
図6(a)及び図6(b)は第1の実施形態の第4変形例に係る半導体装置の平面構成及び断面構成を示している。図6(a)及び図6(b)に示すように、第4変形例に係る半導体装置1は、一例として、図4に示した第2変形例に係る半導体装置1と同様に、拡張型半導体チップ3を4つの半導体チップ31、32、36及び37から構成している。
以下、本発明の第2の実施形態について図7(a)〜図7(c)を参照しながら説明する。
2 第1半導体チップ
21 第1電極
3 拡張型半導体チップ
31 第2半導体チップ
32 第3半導体チップ
311 第1チップ電極
321 第2チップ電極
33 樹脂拡張部
33a 貫通孔
34 再配線層
341 配線
35 第2電極
36 第3半導体チップ
37 第4半導体チップ
4 金属突起
5 半導体装置
6 アンダーフィル材
7 半導体装置
8 拡張型半導体チップ
81 第1半導体チップ
82 第2半導体チップ
811 第1チップ電極
821 第2チップ電極
83 樹脂拡張部
84 再配線層
841 配線
85 第1電極
9 樹脂基板
91 第2電極
Claims (7)
- 表面に第1の電極及び第1の素子が形成された第1の半導体チップと、
第2の半導体チップ及び該第2の半導体チップの少なくとも1つの側面から外方に形成された拡張部を有し、表面に第2の電極及び第2の素子が形成された拡張型半導体チップとを備え、
前記第1の半導体チップと前記拡張型半導体チップとは、前記第1の電極及び前記第1の素子の形成面と前記第2の電極及び前記第2の素子の形成面同士を対向させて、前記第1の電極と前記第2の電極とを互いに接続し、
前記拡張型半導体チップにおける前記第2の電極のうち、前記第1の電極と接続された第2の電極は、前記拡張部の上にのみ形成されている半導体装置。 - 請求項1において、
前記第2の半導体チップは複数の半導体チップであり、
前記拡張型半導体チップの前記拡張部は、前記第2の半導体チップにおける互いに隣接する側面同士の間に形成されている半導体装置。 - 請求項1において、
前記拡張型半導体チップの前記拡張部は、前記第2の半導体チップの周囲に形成されている半導体装置。 - 請求項1〜3のいずれか1項において、
前記拡張型半導体チップには、前記拡張部の表面に形成された前記第2の電極と前記第2の半導体チップの素子形成面の上に形成された第3の電極とを接続する配線が形成されている半導体装置。 - 請求項1〜4のいずれか1項において、
前記拡張部には、前記第1の半導体チップと対向する領域に貫通孔が形成されており、
前記第1の半導体チップと前記拡張型半導体チップとの間には、前記貫通孔を含め、封止用樹脂材が充填されている半導体装置。 - 表面に第1の電極が形成された配線基板と、
半導体チップ及び該半導体チップの少なくとも1つの側面から外方に形成された拡張部を有し、表面に第2の電極及び素子が形成された拡張型半導体チップとを備え、
前記配線基板と前記拡張型半導体チップとは、前記第1の電極の形成面と前記第2の電極及び前記素子の形成面同士を対向させて、前記第1の電極と前記第2の電極とを互いに接続し、
前記拡張型半導体チップにおける前記第2の電極のうち、前記第1の電極と接続された第2の電極は、前記拡張部の上にのみ形成されている半導体装置。 - 請求項6において、
前記半導体チップは複数の半導体チップであり、
前記拡張型半導体チップの前記拡張部は、前記半導体チップにおける互いに隣接する側面同士の間に形成されている半導体装置。
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