JP5972486B1 - 銅箔、銅張積層板、および基板 - Google Patents

銅箔、銅張積層板、および基板 Download PDF

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Publication number
JP5972486B1
JP5972486B1 JP2015559749A JP2015559749A JP5972486B1 JP 5972486 B1 JP5972486 B1 JP 5972486B1 JP 2015559749 A JP2015559749 A JP 2015559749A JP 2015559749 A JP2015559749 A JP 2015559749A JP 5972486 B1 JP5972486 B1 JP 5972486B1
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copper foil
frequency
protrusion
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Japanese (ja)
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JPWO2016035876A1 (ja
Inventor
井上　大輔
大輔 井上
裕子 奥野
裕子 奥野
岳夫 宇野
岳夫 宇野
鳥光　悟
悟 鳥光
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2015559749A 2014-09-05 2015-09-04 銅箔、銅張積層板、および基板 Active JP5972486B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014181180 2014-09-05
JP2014181180 2014-09-05
PCT/JP2015/075173 WO2016035876A1 (ja) 2014-09-05 2015-09-04 銅箔、銅張積層板、および基板

Publications (2)

Publication Number Publication Date
JP5972486B1 true JP5972486B1 (ja) 2016-08-17
JPWO2016035876A1 JPWO2016035876A1 (ja) 2017-04-27

Family

ID=55439931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015559749A Active JP5972486B1 (ja) 2014-09-05 2015-09-04 銅箔、銅張積層板、および基板

Country Status (5)

Country Link
JP (1) JP5972486B1 (zh)
KR (1) KR101912765B1 (zh)
CN (1) CN106574389B (zh)
TW (1) TWI601835B (zh)
WO (1) WO2016035876A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200033852A (ko) 2017-07-24 2020-03-30 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판
KR20200094740A (ko) 2017-12-05 2020-08-07 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7492807B2 (ja) * 2016-12-06 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110832120B (zh) * 2017-03-30 2022-01-11 古河电气工业株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及印刷电路布线板
CN110505753B (zh) * 2019-08-12 2021-02-12 隽美经纬电路有限公司 一种应用于高频高速柔性线路板的cop材料及其制备方法和应用
CN113099605B (zh) * 2021-06-08 2022-07-12 广州方邦电子股份有限公司 金属箔、带载体金属箔、覆铜层叠板及印刷线路板
CN116240601B (zh) * 2022-12-28 2024-08-02 深圳惠科新材料股份有限公司 复合铜箔及其制备方法和电池
CN116612951B (zh) * 2023-06-27 2024-02-27 广州方邦电子股份有限公司 一种薄膜电阻和电路板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555746A (ja) * 1991-08-29 1993-03-05 Hitachi Chem Co Ltd 高周波用銅張り積層板及びプリント配線板
JP2005064110A (ja) * 2003-08-08 2005-03-10 Tdk Corp 電子部品用部材並びにこれを用いた電子部品
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
JP2010013738A (ja) * 2004-02-06 2010-01-21 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法
US20100156572A1 (en) * 2008-12-19 2010-06-24 Askey Computer Corp. Carrier for transmitting high frequency signal and carrier layout method thereof
WO2011090175A1 (ja) * 2010-01-22 2011-07-28 古河電気工業株式会社 粗化処理銅箔、その製造方法、銅張積層板及びプリント配線板
WO2013047272A1 (ja) * 2011-09-30 2013-04-04 Jx日鉱日石金属株式会社 樹脂との密着性に優れた銅箔及びその製造方法並びに該電解銅箔を用いたプリント配線板又は電池用負極材
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524908A (en) 1975-06-30 1977-01-14 Nissan Motor Co Ltd Torch ignition type internal combustion engine
JP3476264B2 (ja) 1993-12-24 2003-12-10 三井金属鉱業株式会社 プリント回路内層用銅箔およびその製造方法
JP5864417B2 (ja) * 2009-07-16 2016-02-17 マリンクロッド エルエルシー トール様受容体９のアンタゴニストとしての（＋）−モルフィナンおよびその治療的使用
CN102238805A (zh) * 2010-04-22 2011-11-09 富葵精密组件(深圳)有限公司 电路板及其制作方法
JP5871426B2 (ja) * 2012-01-31 2016-03-01 古河電気工業株式会社 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555746A (ja) * 1991-08-29 1993-03-05 Hitachi Chem Co Ltd 高周波用銅張り積層板及びプリント配線板
JP2005064110A (ja) * 2003-08-08 2005-03-10 Tdk Corp 電子部品用部材並びにこれを用いた電子部品
JP2010013738A (ja) * 2004-02-06 2010-01-21 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
US20100156572A1 (en) * 2008-12-19 2010-06-24 Askey Computer Corp. Carrier for transmitting high frequency signal and carrier layout method thereof
WO2011090175A1 (ja) * 2010-01-22 2011-07-28 古河電気工業株式会社 粗化処理銅箔、その製造方法、銅張積層板及びプリント配線板
WO2013047272A1 (ja) * 2011-09-30 2013-04-04 Jx日鉱日石金属株式会社 樹脂との密着性に優れた銅箔及びその製造方法並びに該電解銅箔を用いたプリント配線板又は電池用負極材
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200033852A (ko) 2017-07-24 2020-03-30 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판
KR20200094740A (ko) 2017-12-05 2020-08-07 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판

Also Published As

Publication number Publication date
TWI601835B (zh) 2017-10-11
JPWO2016035876A1 (ja) 2017-04-27
WO2016035876A1 (ja) 2016-03-10
CN106574389B (zh) 2018-09-21
KR101912765B1 (ko) 2018-10-29
CN106574389A (zh) 2017-04-19
TW201615852A (zh) 2016-05-01
KR20170039084A (ko) 2017-04-10

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