JP5972260B2 - 発光デバイス及びその製造方法 - Google Patents
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Description
‐ 有機発光ダイオード構造体と、
‐ 少なくとも第一の無機層、有機層及び第二の無機層を有する光透過窓を備えた封止体とを備えた発光デバイスが提供され、有機層は、第二の構成要素によって埋め込まれた第一の有機構成要素が分散した領域を備え、第一及び第二の構成要素は相互に異なる屈折率を有し、有機層は第一の無機層と第二の無機層の間に挟まれる。
‐ 発光構造体を提供するステップと、
‐ 封止体を提供するステップとを備えた発光デバイスの製造方法が提供され、封止体を提供するステップは、
‐ 少なくとも第一の無機層を提供するステップと、
‐ 相互に異なる屈折率を有する第一及び第二の有機構成要素で少なくとも構成された有機層を提供するステップ(少なくとも第一の構成要素は、複合有機層中において少なくとも第二の構成要素によって埋め込まれた領域として分散している)と、
‐ 有機層を硬化させるステップと、
‐ 第二の無機層を提供するステップとによって光透過窓を提供するステップを備える。
第一の無機層22が適用される図5Dに示されるステップS4、
第一の有機層23が第一の無機層22に適用される図5Eに示されるステップS5、
第二の無機層24が第一の有機層23に適用される図5Fに示されるステップS6を備える。
第三の無機層31が適用される図5Hに示されるステップS8、
第二の有機層32が第三の無機層31に適用される図5Iに示されるステップS9を備える。第二の有機層32は、第一及び第二の相互に非混合性の透明有機物質の分散体として適用される。この分散体において、第一の透明有機物質は、二種のエポキシシリコン樹脂の混合物(90.5w%)を備え、第二の透明有機物質は、脂環式エポキシ樹脂(7.5w%)である。更に、分散体は、2w%の光開始剤を備える。これら成分は、磁気撹拌機(Heidolph MR Hei‐End)を用いて、500rpmで略10分間撹拌することによって、同時に混合される。その後、その処方物を、プラスチックピペットを用いてバーコーター(RK Controlコーター)に適用して、100マイクロメートルのワイヤバーを用いてフィルムとして適用した。撹拌後において、相対的に低いシリコン含有量を有するアイランド相32aが、相対的に高いシリコン含有量を有するシー相32b内に細かく分布した。細かく分布したアイランド相32aは、1から10μmの範囲の直径を有するマイクロレンズを形成する。より長い時間撹拌することによって、より細かな分布が得られる。より短い時間の撹拌は、より粗い分布を生じさせる。
20 第一の障壁構造体
21 追加の有機層
22 第一の無機層
23 第一の有機層
24 第二の無機層
30 第二の障壁構造体
31 第三の無機層
32 第二の有機層
33 第四の無機層
50 基板
51 リリース層
Claims (12)
- 有機発光ダイオード構造体(10)と、
少なくとも第一の無機層(31)、有機層(32)及び第二の無機層(33)を有する光透過窓(30)を備えた封止体(20、30)とを備えた発光デバイスであって、
前記有機層(32)が、第二の有機構成要素(32b)によって埋め込まれた第一の有機構成要素の分散した領域(32a)を備え、前記第一の有機構成要素及び前記第二の有機構成要素が相互に異なる屈折率を有し、前記有機層(32)が、前記第一の無機層(31)と前記第二の無機層(33)との間に挟まれている、発光デバイス。 - 前記領域(32a)がレンズ状素子を形成している、請求項1に記載の発光デバイス。
- 前記レンズ状素子(32a)が、0.5μmから20μmの範囲内の直径を実質的に有する、請求項2に記載の発光デバイス。
- 前記有機層(32)が5μmから100μmの間の厚さを有する、請求項1に記載の発光デバイス。
- 前記第一の無機層(31)及び前記第二の無機層(33)が10nmから1000nmの範囲内の厚さを有する、請求項1に記載の発光デバイス。
- 前記第一の無機層(31)及び前記第二の無機層(33)が100nmから300nmの範囲内の厚さを有する、請求項5に記載の発光デバイス。
- 前記有機層が、
(メタ)アクリレート、エポキシ、オキセタンから選択された重合物質Aと
シリコン(メタ)アクリレート、シリコンエポキシ、フッ化(メタ)アクリレート、フッ化エポキシから選択された重合物質Bとを備える、請求項1に記載の発光デバイス。 - 前記第一の有機構成要素中のシリコン含有量が、前記第二の有機構成要素中のシリコン含有量よりも低い、請求項1に記載の発光デバイス。
- 発光デバイスを製造するための方法であって、
発光構造体を提供するステップ(S7)と、
封止体を提供するステップとを備え、前記封止体を提供するステップが、
少なくとも第一の無機層を提供するステップ(S8)と、
相互に異なる屈折率を有する第一の有機構成要素及び第二の有機構成要素から少なくとも構成された有機層を提供するステップ(S9)と、
前記有機層を硬化させるステップ(S10)と、
第二の無機層を提供するステップ(S11)によって、光透過窓を提供するステップを備え、
少なくとも前記第一の有機構成要素が、複合有機層中において少なくとも前記第二の有機構成要素によって埋め込まれた領域として分散している、方法。 - 前記有機層を提供するステップ(S9)が、少なくとも第二の液体有機物質中に少なくとも第一の液体有機物質の分散体を調製するステップと、前記分散体を少なくとも前記第一の無機層に適用するステップとを備え、前記第一の液体有機物質及び前記第二の液体有機物質が相互に非混合性である、請求項9に記載の方法。
- 前記有機層を硬化させるステップ(S10)が、前記第二の有機構成要素によって埋め込まれた前記第一の有機構成要素の領域の形成を生じさせる、請求項9に記載の方法。
- 前記第一の有機構成要素中のシリコン含有量が、前記第二の有機構成要素中のシリコン含有量よりも低い、請求項9に記載の方法。
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EP10161526A EP2383817A1 (en) | 2010-04-29 | 2010-04-29 | Light-emitting device and method for manufacturing the same |
PCT/NL2011/050294 WO2011136653A1 (en) | 2010-04-29 | 2011-04-29 | Light-emitting device and method for manufacturing the same |
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EP (2) | EP2383817A1 (ja) |
JP (1) | JP5972260B2 (ja) |
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CN (1) | CN102870250B (ja) |
CA (1) | CA2797840A1 (ja) |
MA (1) | MA34241B1 (ja) |
SG (1) | SG185093A1 (ja) |
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Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2924757A1 (en) * | 2014-03-28 | 2015-09-30 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Barrier film laminate and electronic device comprising such a laminate |
US10680194B2 (en) * | 2015-01-12 | 2020-06-09 | Massachusetts Institute Of Technology | Transparent luminescent displays enabled by electric-field-induced quenching of photoluminescent pixels |
DE102015103742A1 (de) * | 2015-03-13 | 2016-09-15 | Osram Oled Gmbh | Organisches optoelektronisches Bauelement und Verfahren zum Herstellen eines organischen optoelektronischen Bauelements |
KR101943688B1 (ko) | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
KR101893245B1 (ko) * | 2015-06-19 | 2018-08-30 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
KR101882559B1 (ko) * | 2015-06-19 | 2018-08-27 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
KR101943689B1 (ko) * | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
KR102486876B1 (ko) * | 2015-07-07 | 2023-01-11 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
US10608205B2 (en) | 2016-03-07 | 2020-03-31 | Pioneer Corporation | Sealing structure and light emitting device |
CN105789257A (zh) * | 2016-03-23 | 2016-07-20 | 京东方科技集团股份有限公司 | 薄膜封装结构及显示装置 |
CN106450031B (zh) | 2016-11-07 | 2019-02-26 | 武汉华星光电技术有限公司 | 薄膜封装的oled器件以及oled器件的薄膜封装方法 |
JP6885055B2 (ja) | 2016-12-26 | 2021-06-09 | 日亜化学工業株式会社 | 充填材、樹脂組成物、パッケージ、発光装置及びそれらの製造方法 |
US10305064B2 (en) | 2017-04-28 | 2019-05-28 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Flexible organic light emitting diode display and manufacturing method thereof |
CN107195800A (zh) * | 2017-04-28 | 2017-09-22 | 武汉华星光电技术有限公司 | 一种柔性有机发光二极管显示器及其制作方法 |
CN107331790A (zh) * | 2017-07-19 | 2017-11-07 | 京东方科技集团股份有限公司 | 一种oled显示面板及其封装方法、oled显示装置 |
JP7037034B2 (ja) * | 2017-08-31 | 2022-03-16 | 日亜化学工業株式会社 | 充填材、樹脂組成物、パッケージ、発光装置及びそれらの製造方法 |
CN111466037A (zh) * | 2017-12-19 | 2020-07-28 | 科迪华公司 | 具有改进光输出耦合的发光装置 |
CN108630732B (zh) * | 2018-04-25 | 2020-07-28 | 深圳市华星光电技术有限公司 | Oled显示面板及其制作方法 |
US11156790B2 (en) * | 2018-06-07 | 2021-10-26 | University College Cork | Fiber-less photonic system in an integrated package |
CN112585221B (zh) | 2018-08-22 | 2022-10-25 | 3M创新有限公司 | 用于形成光散射层的可固化组合物 |
CN112310302A (zh) * | 2019-07-30 | 2021-02-02 | 陕西坤同半导体科技有限公司 | 一种有机发光器件 |
WO2021156713A1 (en) * | 2020-02-07 | 2021-08-12 | 3M Innovative Properties Company | Curable compositions for forming light scattering layers |
US11953737B2 (en) * | 2020-05-01 | 2024-04-09 | Smiths Interconnect Canada Inc. | Systems and methods for coupling light |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0747622B2 (ja) | 1990-11-30 | 1995-05-24 | 信越化学工業株式会社 | エポキシ樹脂組成物及びその硬化物 |
CA2353506A1 (en) | 1998-11-02 | 2000-05-11 | 3M Innovative Properties Company | Transparent conductive oxides for plastic flat panel displays |
JP4399887B2 (ja) * | 1999-03-15 | 2010-01-20 | 凸版印刷株式会社 | 反射型液晶表示装置用電極基板の製造方法およびそれを用いた反射型液晶表示装置用電極基板 |
US7198832B2 (en) | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US7233026B2 (en) | 2000-03-23 | 2007-06-19 | Emagin Corporation | Light extraction from color changing medium layers in organic light emitting diode devices |
KR20040027940A (ko) * | 2001-08-20 | 2004-04-01 | 노바-플라즈마 인크. | 기체 및 증기 침투율이 낮은 코팅층 |
US7012363B2 (en) | 2002-01-10 | 2006-03-14 | Universal Display Corporation | OLEDs having increased external electroluminescence quantum efficiencies |
TW587395B (en) | 2002-05-28 | 2004-05-11 | Ritdisplay Corp | Full color organic light-emitting display device |
TW576124B (en) | 2002-05-28 | 2004-02-11 | Ritdisplay Corp | Full color organic light-emitting display device |
US6965197B2 (en) | 2002-10-01 | 2005-11-15 | Eastman Kodak Company | Organic light-emitting device having enhanced light extraction efficiency |
JP4350996B2 (ja) | 2002-11-26 | 2009-10-28 | 日東電工株式会社 | 有機エレクトロルミネッセンス素子、面光源および表示装置 |
WO2004084323A1 (de) | 2003-03-19 | 2004-09-30 | Osram Opto Semiconductors Gmbh | Organische leuchtdiode mit verbesserter lichteffizienz |
US20050023974A1 (en) * | 2003-08-01 | 2005-02-03 | Universal Display Corporation | Protected organic electronic devices and methods for making the same |
KR20050029426A (ko) | 2003-09-22 | 2005-03-28 | 삼성에스디아이 주식회사 | 칼라필터층 또는 색변환층을 갖는 풀칼라 유기전계발광소자 |
US7052355B2 (en) | 2003-10-30 | 2006-05-30 | General Electric Company | Organic electro-optic device and method for making the same |
KR100556086B1 (ko) | 2003-11-15 | 2006-03-07 | 한국전자통신연구원 | 엔캡슐레이션된 유기 발광 디스플레이 판넬 및 그의 제작방법 |
CN1638585A (zh) * | 2003-12-26 | 2005-07-13 | 日东电工株式会社 | 电致发光装置,平面光源和使用该平面光源的显示器 |
JP5005164B2 (ja) * | 2004-03-03 | 2012-08-22 | 株式会社ジャパンディスプレイイースト | 発光素子,発光型表示装置及び照明装置 |
US8405193B2 (en) * | 2004-04-02 | 2013-03-26 | General Electric Company | Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
EP1766703A1 (fr) | 2004-05-17 | 2007-03-28 | THOMSON Licensing | Diode electroluminescente organique (oled ) a extraction de lumiere amerlioree, afficheur correspondant |
KR20070024487A (ko) * | 2004-05-26 | 2007-03-02 | 닛산 가가쿠 고교 가부시키 가이샤 | 면발광체 |
KR20070085321A (ko) | 2004-10-12 | 2007-08-27 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 전계 발광 광원 |
KR100635575B1 (ko) | 2004-11-17 | 2006-10-17 | 삼성에스디아이 주식회사 | 풀 칼라 유기 전계 발광 표시 소자 및 그 제조방법 |
JP4736433B2 (ja) | 2005-01-11 | 2011-07-27 | セイコーエプソン株式会社 | 発光装置、その製造方法、画像形成装置、および画像読み取り装置 |
US7432649B2 (en) | 2005-02-22 | 2008-10-07 | Corning, Incorporated | Coupled waveguides for light extraction |
US10690847B2 (en) * | 2005-06-15 | 2020-06-23 | Braggone Oy | Method of making a photonic crystal device and photonic crystal device |
US7321193B2 (en) | 2005-10-31 | 2008-01-22 | Osram Opto Semiconductors Gmbh | Device structure for OLED light device having multi element light extraction and luminescence conversion layer |
US8330348B2 (en) | 2005-10-31 | 2012-12-11 | Osram Opto Semiconductors Gmbh | Structured luminescence conversion layer |
US7420323B2 (en) | 2005-10-31 | 2008-09-02 | Osram Opto Semiconductors Gmbh | Electroluminescent apparatus having a structured luminescence conversion layer |
US20070201056A1 (en) | 2006-02-24 | 2007-08-30 | Eastman Kodak Company | Light-scattering color-conversion material layer |
US7791271B2 (en) | 2006-02-24 | 2010-09-07 | Global Oled Technology Llc | Top-emitting OLED device with light-scattering layer and color-conversion |
JP5536977B2 (ja) * | 2007-03-30 | 2014-07-02 | パナソニック株式会社 | 面発光体 |
KR20090019752A (ko) * | 2007-08-21 | 2009-02-25 | 후지필름 가부시키가이샤 | 산란 부재 및 그것을 사용하는 유기 일렉트로루미네선스 표시 장치 |
EP2091096A1 (en) * | 2008-02-15 | 2009-08-19 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Encapsulated electronic device and method of manufacturing |
KR101964265B1 (ko) * | 2008-04-09 | 2019-07-31 | 에이전시 포 사이언스, 테크놀로지 앤드 리서치 | 산소 및/또는 수분 민감성 전자 소자들을 밀봉하는 다층막 |
KR101318072B1 (ko) * | 2008-06-04 | 2013-10-15 | 엘지디스플레이 주식회사 | 유기발광다이오드 표시장치 및 이의 제조 방법 |
JP5117422B2 (ja) * | 2008-07-15 | 2013-01-16 | 富士フイルム株式会社 | 発光装置及びその製造方法 |
KR101002659B1 (ko) * | 2008-12-23 | 2010-12-20 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
CA2796076A1 (en) * | 2010-04-29 | 2011-11-03 | Huntsman Advanced Materials (Switzerland) Gmbh | Curable composition |
EP2445028A1 (en) * | 2010-10-25 | 2012-04-25 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Opto-electric device and method of manufacturing an opto-electric device |
KR20120115841A (ko) * | 2011-04-11 | 2012-10-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
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2010
- 2010-04-29 EP EP10161526A patent/EP2383817A1/en not_active Withdrawn
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2011
- 2011-04-26 TW TW100114374A patent/TWI556472B/zh not_active IP Right Cessation
- 2011-04-29 KR KR1020127031391A patent/KR101843481B1/ko active IP Right Grant
- 2011-04-29 WO PCT/NL2011/050294 patent/WO2011136653A1/en active Application Filing
- 2011-04-29 CA CA2797840A patent/CA2797840A1/en not_active Abandoned
- 2011-04-29 JP JP2013507900A patent/JP5972260B2/ja not_active Expired - Fee Related
- 2011-04-29 CN CN201180021214.1A patent/CN102870250B/zh not_active Expired - Fee Related
- 2011-04-29 US US13/643,153 patent/US9093666B2/en not_active Expired - Fee Related
- 2011-04-29 MA MA35382A patent/MA34241B1/fr unknown
- 2011-04-29 SG SG2012080065A patent/SG185093A1/en unknown
- 2011-04-29 EP EP11720203A patent/EP2564444A1/en not_active Ceased
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TWI556472B (zh) | 2016-11-01 |
US20130207083A1 (en) | 2013-08-15 |
TW201205887A (en) | 2012-02-01 |
KR101843481B1 (ko) | 2018-05-14 |
EP2383817A1 (en) | 2011-11-02 |
WO2011136653A1 (en) | 2011-11-03 |
CN102870250A (zh) | 2013-01-09 |
JP2013527570A (ja) | 2013-06-27 |
EP2564444A1 (en) | 2013-03-06 |
KR20130106767A (ko) | 2013-09-30 |
SG185093A1 (en) | 2012-12-28 |
CN102870250B (zh) | 2017-04-05 |
US9093666B2 (en) | 2015-07-28 |
MA34241B1 (fr) | 2013-05-02 |
CA2797840A1 (en) | 2011-11-03 |
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