JP5955766B2 - 基板処理装置および基板処理方法 - Google Patents
基板処理装置および基板処理方法 Download PDFInfo
- Publication number
- JP5955766B2 JP5955766B2 JP2012288326A JP2012288326A JP5955766B2 JP 5955766 B2 JP5955766 B2 JP 5955766B2 JP 2012288326 A JP2012288326 A JP 2012288326A JP 2012288326 A JP2012288326 A JP 2012288326A JP 5955766 B2 JP5955766 B2 JP 5955766B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- temperature adjustment
- substrate
- adjustment liquid
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012545 processing Methods 0.000 title claims description 86
- 239000000758 substrate Substances 0.000 title claims description 85
- 238000003672 processing method Methods 0.000 title claims 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 318
- 239000007788 liquid Substances 0.000 claims description 280
- 239000003960 organic solvent Substances 0.000 claims description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 38
- 230000007246 mechanism Effects 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims 4
- 238000007599 discharging Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 description 35
- 239000007789 gas Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 13
- 239000012530 fluid Substances 0.000 description 12
- 239000010815 organic waste Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 4
- 239000010808 liquid waste Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012288326A JP5955766B2 (ja) | 2012-12-28 | 2012-12-28 | 基板処理装置および基板処理方法 |
KR1020130164205A KR102007043B1 (ko) | 2012-12-28 | 2013-12-26 | 기판 처리 장치 및 기판 처리 방법 |
KR1020180027058A KR101987582B1 (ko) | 2012-12-28 | 2018-03-07 | 기판 처리 장치 및 기판 처리 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012288326A JP5955766B2 (ja) | 2012-12-28 | 2012-12-28 | 基板処理装置および基板処理方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014130940A JP2014130940A (ja) | 2014-07-10 |
JP2014130940A5 JP2014130940A5 (ko) | 2015-04-30 |
JP5955766B2 true JP5955766B2 (ja) | 2016-07-20 |
Family
ID=51409084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012288326A Active JP5955766B2 (ja) | 2012-12-28 | 2012-12-28 | 基板処理装置および基板処理方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5955766B2 (ko) |
KR (2) | KR102007043B1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6586697B2 (ja) * | 2015-12-25 | 2019-10-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6613181B2 (ja) * | 2016-03-17 | 2019-11-27 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
KR101935949B1 (ko) * | 2016-10-07 | 2019-01-08 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
JP6815873B2 (ja) | 2017-01-18 | 2021-01-20 | 株式会社Screenホールディングス | 基板処理装置 |
JP6901944B2 (ja) * | 2017-09-20 | 2021-07-14 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP7250566B2 (ja) * | 2019-02-26 | 2023-04-03 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
CN115881578A (zh) * | 2021-09-29 | 2023-03-31 | 盛美半导体设备(上海)股份有限公司 | 基板处理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000058498A (ja) * | 1998-08-17 | 2000-02-25 | Seiko Epson Corp | ウェハ乾燥方法及び乾燥槽及び洗浄槽及び洗浄装置 |
JP2002085943A (ja) * | 2000-09-14 | 2002-03-26 | Sony Corp | ウエハ乾燥装置 |
JP2007227764A (ja) * | 2006-02-24 | 2007-09-06 | Dainippon Screen Mfg Co Ltd | 基板表面処理装置、基板表面処理方法および基板処理装置 |
JP2008034428A (ja) * | 2006-07-26 | 2008-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2008034612A (ja) | 2006-07-28 | 2008-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
US8793898B2 (en) * | 2007-05-23 | 2014-08-05 | Semes Co., Ltd. | Apparatus and method for drying substrates |
KR20120034948A (ko) * | 2010-10-04 | 2012-04-13 | 삼성전자주식회사 | 기판 건조 장치 및 이를 이용한 기판 건조 방법 |
JP5523502B2 (ja) * | 2012-05-21 | 2014-06-18 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
-
2012
- 2012-12-28 JP JP2012288326A patent/JP5955766B2/ja active Active
-
2013
- 2013-12-26 KR KR1020130164205A patent/KR102007043B1/ko active IP Right Grant
-
2018
- 2018-03-07 KR KR1020180027058A patent/KR101987582B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20140086885A (ko) | 2014-07-08 |
JP2014130940A (ja) | 2014-07-10 |
KR20180029219A (ko) | 2018-03-20 |
KR101987582B1 (ko) | 2019-09-30 |
KR102007043B1 (ko) | 2019-08-02 |
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