JP5955766B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP5955766B2
JP5955766B2 JP2012288326A JP2012288326A JP5955766B2 JP 5955766 B2 JP5955766 B2 JP 5955766B2 JP 2012288326 A JP2012288326 A JP 2012288326A JP 2012288326 A JP2012288326 A JP 2012288326A JP 5955766 B2 JP5955766 B2 JP 5955766B2
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Japan
Prior art keywords
liquid
temperature adjustment
substrate
adjustment liquid
organic solvent
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JP2012288326A
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English (en)
Japanese (ja)
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JP2014130940A (ja
JP2014130940A5 (enExample
Inventor
島 孝 之 戸
島 孝 之 戸
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012288326A priority Critical patent/JP5955766B2/ja
Priority to KR1020130164205A priority patent/KR102007043B1/ko
Publication of JP2014130940A publication Critical patent/JP2014130940A/ja
Publication of JP2014130940A5 publication Critical patent/JP2014130940A5/ja
Application granted granted Critical
Publication of JP5955766B2 publication Critical patent/JP5955766B2/ja
Priority to KR1020180027058A priority patent/KR101987582B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2012288326A 2012-12-28 2012-12-28 基板処理装置および基板処理方法 Active JP5955766B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012288326A JP5955766B2 (ja) 2012-12-28 2012-12-28 基板処理装置および基板処理方法
KR1020130164205A KR102007043B1 (ko) 2012-12-28 2013-12-26 기판 처리 장치 및 기판 처리 방법
KR1020180027058A KR101987582B1 (ko) 2012-12-28 2018-03-07 기판 처리 장치 및 기판 처리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012288326A JP5955766B2 (ja) 2012-12-28 2012-12-28 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2014130940A JP2014130940A (ja) 2014-07-10
JP2014130940A5 JP2014130940A5 (enExample) 2015-04-30
JP5955766B2 true JP5955766B2 (ja) 2016-07-20

Family

ID=51409084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012288326A Active JP5955766B2 (ja) 2012-12-28 2012-12-28 基板処理装置および基板処理方法

Country Status (2)

Country Link
JP (1) JP5955766B2 (enExample)
KR (2) KR102007043B1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6586697B2 (ja) * 2015-12-25 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6613181B2 (ja) * 2016-03-17 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101935949B1 (ko) * 2016-10-07 2019-01-08 세메스 주식회사 기판 처리 장치 및 방법
JP6815873B2 (ja) 2017-01-18 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6901944B2 (ja) * 2017-09-20 2021-07-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6843089B2 (ja) * 2018-04-09 2021-03-17 東京エレクトロン株式会社 結露防止方法および処理装置
JP7250566B2 (ja) * 2019-02-26 2023-04-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN115881578A (zh) * 2021-09-29 2023-03-31 盛美半导体设备(上海)股份有限公司 基板处理装置
US20240091823A1 (en) * 2022-09-20 2024-03-21 Applied Materials, Inc. Fluid vapor mixing and delivery system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058498A (ja) * 1998-08-17 2000-02-25 Seiko Epson Corp ウェハ乾燥方法及び乾燥槽及び洗浄槽及び洗浄装置
JP2002085943A (ja) * 2000-09-14 2002-03-26 Sony Corp ウエハ乾燥装置
JP2007227764A (ja) * 2006-02-24 2007-09-06 Dainippon Screen Mfg Co Ltd 基板表面処理装置、基板表面処理方法および基板処理装置
JP2008034428A (ja) * 2006-07-26 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008034612A (ja) 2006-07-28 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
WO2008143476A1 (en) * 2007-05-23 2008-11-27 Semes Co., Ltd. Apparatus and method for drying substrates
KR20120034948A (ko) * 2010-10-04 2012-04-13 삼성전자주식회사 기판 건조 장치 및 이를 이용한 기판 건조 방법
JP5523502B2 (ja) * 2012-05-21 2014-06-18 大日本スクリーン製造株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
KR101987582B1 (ko) 2019-09-30
JP2014130940A (ja) 2014-07-10
KR20140086885A (ko) 2014-07-08
KR20180029219A (ko) 2018-03-20
KR102007043B1 (ko) 2019-08-02

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