JP2014130940A5 - - Google Patents

Download PDF

Info

Publication number
JP2014130940A5
JP2014130940A5 JP2012288326A JP2012288326A JP2014130940A5 JP 2014130940 A5 JP2014130940 A5 JP 2014130940A5 JP 2012288326 A JP2012288326 A JP 2012288326A JP 2012288326 A JP2012288326 A JP 2012288326A JP 2014130940 A5 JP2014130940 A5 JP 2014130940A5
Authority
JP
Japan
Prior art keywords
temperature adjustment
liquid
substrate
organic solvent
adjustment liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012288326A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014130940A (ja
JP5955766B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012288326A priority Critical patent/JP5955766B2/ja
Priority claimed from JP2012288326A external-priority patent/JP5955766B2/ja
Priority to KR1020130164205A priority patent/KR102007043B1/ko
Publication of JP2014130940A publication Critical patent/JP2014130940A/ja
Publication of JP2014130940A5 publication Critical patent/JP2014130940A5/ja
Application granted granted Critical
Publication of JP5955766B2 publication Critical patent/JP5955766B2/ja
Priority to KR1020180027058A priority patent/KR101987582B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012288326A 2012-12-28 2012-12-28 基板処理装置および基板処理方法 Active JP5955766B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012288326A JP5955766B2 (ja) 2012-12-28 2012-12-28 基板処理装置および基板処理方法
KR1020130164205A KR102007043B1 (ko) 2012-12-28 2013-12-26 기판 처리 장치 및 기판 처리 방법
KR1020180027058A KR101987582B1 (ko) 2012-12-28 2018-03-07 기판 처리 장치 및 기판 처리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012288326A JP5955766B2 (ja) 2012-12-28 2012-12-28 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2014130940A JP2014130940A (ja) 2014-07-10
JP2014130940A5 true JP2014130940A5 (enExample) 2015-04-30
JP5955766B2 JP5955766B2 (ja) 2016-07-20

Family

ID=51409084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012288326A Active JP5955766B2 (ja) 2012-12-28 2012-12-28 基板処理装置および基板処理方法

Country Status (2)

Country Link
JP (1) JP5955766B2 (enExample)
KR (2) KR102007043B1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6586697B2 (ja) * 2015-12-25 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6613181B2 (ja) * 2016-03-17 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101935949B1 (ko) * 2016-10-07 2019-01-08 세메스 주식회사 기판 처리 장치 및 방법
JP6815873B2 (ja) 2017-01-18 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6901944B2 (ja) * 2017-09-20 2021-07-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6843089B2 (ja) * 2018-04-09 2021-03-17 東京エレクトロン株式会社 結露防止方法および処理装置
JP7250566B2 (ja) * 2019-02-26 2023-04-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN115881578A (zh) * 2021-09-29 2023-03-31 盛美半导体设备(上海)股份有限公司 基板处理装置
US20240091823A1 (en) * 2022-09-20 2024-03-21 Applied Materials, Inc. Fluid vapor mixing and delivery system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058498A (ja) * 1998-08-17 2000-02-25 Seiko Epson Corp ウェハ乾燥方法及び乾燥槽及び洗浄槽及び洗浄装置
JP2002085943A (ja) * 2000-09-14 2002-03-26 Sony Corp ウエハ乾燥装置
JP2007227764A (ja) * 2006-02-24 2007-09-06 Dainippon Screen Mfg Co Ltd 基板表面処理装置、基板表面処理方法および基板処理装置
JP2008034428A (ja) * 2006-07-26 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008034612A (ja) 2006-07-28 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
WO2008143476A1 (en) * 2007-05-23 2008-11-27 Semes Co., Ltd. Apparatus and method for drying substrates
KR20120034948A (ko) * 2010-10-04 2012-04-13 삼성전자주식회사 기판 건조 장치 및 이를 이용한 기판 건조 방법
JP5523502B2 (ja) * 2012-05-21 2014-06-18 大日本スクリーン製造株式会社 基板処理方法および基板処理装置

Similar Documents

Publication Publication Date Title
JP2014130940A5 (enExample)
US9337065B2 (en) Systems and methods for drying a rotating substrate
TWI509721B (zh) 半導體晶圓之乾燥方法與設備
DE602007003506D1 (de) Flüssigkeitsverarbeitungsvorrichtung
RU2015104563A (ru) Стиральная машина с устройством для получения водяных капель и способ эксплуатации такой стиральной машины
KR101987582B1 (ko) 기판 처리 장치 및 기판 처리 방법
RU2013140721A (ru) Способ и устройство для обработки белья
JP2015092538A5 (enExample)
TWI615895B (zh) 自基板移除碳物質之製程
JP2011512645A5 (enExample)
RU2014120401A (ru) Устройства для повторной обработки инструментов, системы и способы
WO2005015625A1 (ja) 基板処理方法及び基板処理装置
JP2016512163A5 (enExample)
TW201341070A (zh) 液體管理系統及清洗液之回收再生裝置
RU2014131275A (ru) Гранулированное вещество для контроля пенообразования для цикла полоскания с использованием силоксанового воска
JP2007049176A5 (enExample)
TW201222173A (en) Method for removal of photoresist
KR102030681B1 (ko) 기판 액처리 장치 및 기판 액처리 방법
RU2019117209A (ru) Портативное устройство для удаления загрязнений
TW200703498A (en) Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas environment including a drying enhancement substance
WO2008155196A3 (de) Verfahren zur behandlung von wäschestücken sowie hierzu geeignete waschmaschine
GB2465931A (en) Vapour delivery system
JP2015191972A5 (enExample)
JP2011014935A5 (enExample)
TW200801853A (en) Treating device and manufacturing method for substrate