TW200801853A - Treating device and manufacturing method for substrate - Google Patents

Treating device and manufacturing method for substrate

Info

Publication number
TW200801853A
TW200801853A TW96113892A TW96113892A TW200801853A TW 200801853 A TW200801853 A TW 200801853A TW 96113892 A TW96113892 A TW 96113892A TW 96113892 A TW96113892 A TW 96113892A TW 200801853 A TW200801853 A TW 200801853A
Authority
TW
Taiwan
Prior art keywords
substrate
treatment solution
treatment
ozone bubble
manufacturing
Prior art date
Application number
TW96113892A
Other languages
Chinese (zh)
Inventor
Hajime Ando
Kiyoshi Ohtake
Yutaka Mikami
Original Assignee
Zenkyo Corp
Roki Techno Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zenkyo Corp, Roki Techno Co Ltd filed Critical Zenkyo Corp
Publication of TW200801853A publication Critical patent/TW200801853A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Provided are a substrate treatment apparatus (1) and a substrate manufacturing method by which process management is facilitated and the structure is simplified. A substrate (W) is stored in a treatment tank (2) to be impregnated with a treatment solution (F), the treatment solution (F) sucked from the inside of the treatment tank (2) is heated up to 55 DEG C by a heater (6), then, an ozone bubble treatment solution (FB) is generated by mixing ozone gas. Then, the ozone bubble treatment solution (FB) is supplied to a film (Wa) (subject to be treated) in a high-speed water flow status by jetting the ozone bubble treatment solution by an ozone bubble jetting section (9).
TW96113892A 2006-04-20 2007-04-20 Treating device and manufacturing method for substrate TW200801853A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006116400 2006-04-20

Publications (1)

Publication Number Publication Date
TW200801853A true TW200801853A (en) 2008-01-01

Family

ID=38625098

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96113892A TW200801853A (en) 2006-04-20 2007-04-20 Treating device and manufacturing method for substrate

Country Status (3)

Country Link
JP (1) JPWO2007123198A1 (en)
TW (1) TW200801853A (en)
WO (1) WO2007123198A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011000861A1 (en) * 2011-02-22 2012-08-23 Rena Gmbh Method for treating an object, in particular a solar cell substrate, and device for carrying out the method
JP6032623B2 (en) * 2012-07-31 2016-11-30 パナソニックＩｐマネジメント株式会社 Manufacturing method of solar cell
JP6016174B2 (en) 2012-07-31 2016-10-26 パナソニックＩｐマネジメント株式会社 Manufacturing method of solar cell
JP7202632B2 (en) * 2019-01-24 2023-01-12 株式会社ジェイ・イー・ティ SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001269631A (en) * 2000-03-27 2001-10-02 Dainippon Screen Mfg Co Ltd Substrate cleaning device
JP4444557B2 (en) * 2002-08-29 2010-03-31 月島環境エンジニアリング株式会社 Ozone water heat treatment method and heat treatment apparatus
JP2004266000A (en) * 2003-02-28 2004-09-24 Dainippon Screen Mfg Co Ltd Method and apparatus for processing substrate

Also Published As

Publication number Publication date
WO2007123198A1 (en) 2007-11-01
JPWO2007123198A1 (en) 2009-09-03

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