JP5946311B2 - Ledモジュール - Google Patents
Ledモジュール Download PDFInfo
- Publication number
- JP5946311B2 JP5946311B2 JP2012089929A JP2012089929A JP5946311B2 JP 5946311 B2 JP5946311 B2 JP 5946311B2 JP 2012089929 A JP2012089929 A JP 2012089929A JP 2012089929 A JP2012089929 A JP 2012089929A JP 5946311 B2 JP5946311 B2 JP 5946311B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- circuit
- current input
- input terminal
- partial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012089929A JP5946311B2 (ja) | 2012-04-11 | 2012-04-11 | Ledモジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012089929A JP5946311B2 (ja) | 2012-04-11 | 2012-04-11 | Ledモジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013219263A JP2013219263A (ja) | 2013-10-24 |
| JP2013219263A5 JP2013219263A5 (enExample) | 2014-12-18 |
| JP5946311B2 true JP5946311B2 (ja) | 2016-07-06 |
Family
ID=49591022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012089929A Expired - Fee Related JP5946311B2 (ja) | 2012-04-11 | 2012-04-11 | Ledモジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5946311B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3085067B2 (ja) | 1993-12-15 | 2000-09-04 | 松下電器産業株式会社 | 配線基板およびその製造方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6149727B2 (ja) | 2013-12-28 | 2017-06-21 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| KR101527430B1 (ko) * | 2014-06-17 | 2015-06-11 | (주)에너브레인 | 씨오비 타입 발광다이오드 램프 및 그 제조방법 |
| JP2016063030A (ja) * | 2014-09-17 | 2016-04-25 | シチズンホールディングス株式会社 | Led駆動回路 |
| JP6344720B2 (ja) * | 2014-10-09 | 2018-06-20 | パナソニックIpマネジメント株式会社 | 照明器具 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209338A (ja) * | 1997-01-22 | 1998-08-07 | Matsushita Electric Ind Co Ltd | 半導体回路装置とその製造方法 |
| JP2001035239A (ja) * | 1998-06-08 | 2001-02-09 | System Denki Sangyo Kk | 照明器具 |
| JP4529319B2 (ja) * | 2001-06-27 | 2010-08-25 | 日亜化学工業株式会社 | 半導体チップとその製造方法 |
| JP4902950B2 (ja) * | 2003-09-16 | 2012-03-21 | パナソニック株式会社 | Led照明光源 |
| JP2009099627A (ja) * | 2007-10-12 | 2009-05-07 | Panasonic Electric Works Co Ltd | Led照明器具 |
| JP5288161B2 (ja) * | 2008-02-14 | 2013-09-11 | 東芝ライテック株式会社 | 発光モジュール及び照明装置 |
| JP5216447B2 (ja) * | 2008-07-03 | 2013-06-19 | パナソニック株式会社 | ランプ |
| JP5263515B2 (ja) * | 2008-10-20 | 2013-08-14 | 東芝ライテック株式会社 | 照明装置 |
| JP5471330B2 (ja) * | 2009-07-14 | 2014-04-16 | 日亜化学工業株式会社 | 発光ダイオード駆動回路及び発光ダイオードの点灯制御方法 |
| JP3168487U (ja) * | 2011-03-14 | 2011-06-16 | 直美 大日向 | Led照明具 |
| US20130153938A1 (en) * | 2011-12-14 | 2013-06-20 | Zdenko Grajcar | Light Emitting System |
| JP2013214615A (ja) * | 2012-04-02 | 2013-10-17 | Citizen Holdings Co Ltd | Ledモジュール及びそれを用いたled光源ユニット |
-
2012
- 2012-04-11 JP JP2012089929A patent/JP5946311B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3085067B2 (ja) | 1993-12-15 | 2000-09-04 | 松下電器産業株式会社 | 配線基板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013219263A (ja) | 2013-10-24 |
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