JP5941023B2 - 基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体 - Google Patents

基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体 Download PDF

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Publication number
JP5941023B2
JP5941023B2 JP2013171286A JP2013171286A JP5941023B2 JP 5941023 B2 JP5941023 B2 JP 5941023B2 JP 2013171286 A JP2013171286 A JP 2013171286A JP 2013171286 A JP2013171286 A JP 2013171286A JP 5941023 B2 JP5941023 B2 JP 5941023B2
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Japan
Prior art keywords
substrate
liquid
cleaning
nozzle
liquid nozzle
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JP2013171286A
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English (en)
Japanese (ja)
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JP2015041672A (ja
Inventor
行志 牟田
行志 牟田
京田　秀治
秀治 京田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2013171286A priority Critical patent/JP5941023B2/ja
Priority to TW103127957A priority patent/TWI578391B/zh
Priority to KR1020140106991A priority patent/KR102115041B1/ko
Publication of JP2015041672A publication Critical patent/JP2015041672A/ja
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Publication of JP5941023B2 publication Critical patent/JP5941023B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013171286A 2013-08-21 2013-08-21 基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体 Active JP5941023B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013171286A JP5941023B2 (ja) 2013-08-21 2013-08-21 基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体
TW103127957A TWI578391B (zh) 2013-08-21 2014-08-14 基板清洗裝置、基板清洗方法及電腦可讀取記錄媒體
KR1020140106991A KR102115041B1 (ko) 2013-08-21 2014-08-18 기판 세정 장치, 기판 세정 방법, 및 컴퓨터 판독 가능한 기록 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013171286A JP5941023B2 (ja) 2013-08-21 2013-08-21 基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体

Publications (2)

Publication Number Publication Date
JP2015041672A JP2015041672A (ja) 2015-03-02
JP5941023B2 true JP5941023B2 (ja) 2016-06-29

Family

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JP2013171286A Active JP5941023B2 (ja) 2013-08-21 2013-08-21 基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体

Country Status (3)

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JP (1) JP5941023B2 (zh)
KR (1) KR102115041B1 (zh)
TW (1) TWI578391B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6740028B2 (ja) 2015-07-29 2020-08-12 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
WO2017018481A1 (ja) * 2015-07-29 2017-02-02 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP6569574B2 (ja) * 2016-03-24 2019-09-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6784546B2 (ja) * 2016-09-08 2020-11-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN108122813A (zh) * 2017-12-14 2018-06-05 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶圆背面清洗干燥装置、晶圆背面清洗干燥系统及方法
CN114361059A (zh) * 2020-10-13 2022-04-15 长鑫存储技术有限公司 晶圆清洗设备和清洗方法
CN114653706A (zh) * 2020-12-24 2022-06-24 中国科学院微电子研究所 半导体单片式清洗装置及方法
WO2024014346A1 (ja) * 2022-07-14 2024-01-18 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び基板処理プログラム
CN117423644B (zh) * 2023-12-18 2024-03-05 北京青禾晶元半导体科技有限责任公司 晶圆清洗方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69832567T2 (de) * 1997-09-24 2007-01-18 Interuniversitair Micro-Electronica Centrum Vzw Verfahren und Vorrichtung zum Entfernen von einer Flüssigkeit von der Oberfläche eines rotierenden Substrats
KR100493849B1 (ko) * 2002-09-30 2005-06-08 삼성전자주식회사 웨이퍼 건조 장치
JP5151629B2 (ja) 2008-04-03 2013-02-27 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体
JP5191273B2 (ja) * 2008-05-15 2013-05-08 川崎重工業株式会社 高圧水噴射洗浄装置
JP2012114409A (ja) 2010-11-04 2012-06-14 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置及び基板洗浄用記憶媒体
US20130052360A1 (en) * 2011-08-30 2013-02-28 Tadashi Maegawa Substrate processing apparatus, substrate processing method, and nozzle
JP5632860B2 (ja) * 2012-01-05 2014-11-26 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置及び基板洗浄用記憶媒体

Also Published As

Publication number Publication date
KR20150021893A (ko) 2015-03-03
TWI578391B (zh) 2017-04-11
KR102115041B1 (ko) 2020-05-25
JP2015041672A (ja) 2015-03-02
TW201530639A (zh) 2015-08-01

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