JP5940283B2 - ペリクル - Google Patents
ペリクル Download PDFInfo
- Publication number
- JP5940283B2 JP5940283B2 JP2011242344A JP2011242344A JP5940283B2 JP 5940283 B2 JP5940283 B2 JP 5940283B2 JP 2011242344 A JP2011242344 A JP 2011242344A JP 2011242344 A JP2011242344 A JP 2011242344A JP 5940283 B2 JP5940283 B2 JP 5940283B2
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- frame
- pellicle frame
- resin
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 49
- 239000011347 resin Substances 0.000 claims description 49
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 43
- 239000004917 carbon fiber Substances 0.000 claims description 43
- 238000004519 manufacturing process Methods 0.000 claims description 28
- 238000005520 cutting process Methods 0.000 claims description 27
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- 239000011162 core material Substances 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000006229 carbon black Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 18
- 238000004804 winding Methods 0.000 description 16
- 239000012790 adhesive layer Substances 0.000 description 14
- 239000000428 dust Substances 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 8
- 238000010030 laminating Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000013007 heat curing Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- ZEASXVYVFFXULL-UHFFFAOYSA-N amezinium metilsulfate Chemical compound COS([O-])(=O)=O.COC1=CC(N)=CN=[N+]1C1=CC=CC=C1 ZEASXVYVFFXULL-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011242344A JP5940283B2 (ja) | 2011-11-04 | 2011-11-04 | ペリクル |
KR1020120110013A KR102028374B1 (ko) | 2011-11-04 | 2012-10-04 | 펠리클 |
TW101140616A TWI452422B (zh) | 2011-11-04 | 2012-11-01 | 防塵薄膜組件 |
CN2012104361743A CN103091975A (zh) | 2011-11-04 | 2012-11-05 | 防尘薄膜组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011242344A JP5940283B2 (ja) | 2011-11-04 | 2011-11-04 | ペリクル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013097308A JP2013097308A (ja) | 2013-05-20 |
JP5940283B2 true JP5940283B2 (ja) | 2016-06-29 |
Family
ID=48204723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011242344A Active JP5940283B2 (ja) | 2011-11-04 | 2011-11-04 | ペリクル |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5940283B2 (ko) |
KR (1) | KR102028374B1 (ko) |
CN (1) | CN103091975A (ko) |
TW (1) | TWI452422B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5746662B2 (ja) * | 2012-05-11 | 2015-07-08 | 信越化学工業株式会社 | ペリクルフレーム |
CN103279008A (zh) * | 2013-05-23 | 2013-09-04 | 上海华力微电子有限公司 | 掩膜板覆盖膜设计方法 |
JP6293041B2 (ja) * | 2014-12-01 | 2018-03-14 | 信越化学工業株式会社 | ペリクルフレームおよびこれを用いたペリクル |
KR102254103B1 (ko) * | 2015-01-07 | 2021-05-20 | 삼성전자주식회사 | 지지 층을 이용한 펠리클 제조 방법 |
JP6519190B2 (ja) * | 2015-01-16 | 2019-05-29 | 日本軽金属株式会社 | ペリクル用支持枠 |
JP2016139103A (ja) * | 2015-01-29 | 2016-08-04 | 日本軽金属株式会社 | ペリクル用支持枠 |
CN107615739A (zh) * | 2015-12-30 | 2018-01-19 | 深圳市大富科技股份有限公司 | 手机、手机框架及其制造方法 |
KR102237878B1 (ko) * | 2017-02-17 | 2021-04-07 | 미쯔이가가꾸가부시끼가이샤 | 펠리클, 노광 원판, 노광 장치 및 반도체 장치의 제조 방법 |
TWM622366U (zh) * | 2020-06-04 | 2022-01-21 | 日商信越化學工業股份有限公司 | 防護薄膜框架、防護薄膜、帶防護薄膜的曝光原版、曝光裝置、曝光系統、半導體的製造系統及液晶顯示板的製造系統 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6380257A (ja) * | 1986-09-24 | 1988-04-11 | Hitachi Micro Comput Eng Ltd | ホトマスク |
JP3027073B2 (ja) * | 1993-07-28 | 2000-03-27 | 信越化学工業株式会社 | ペリクル |
JPH10209340A (ja) * | 1997-01-16 | 1998-08-07 | Toray Ind Inc | Ic封止枠体およびその製造方法 |
JP2001291757A (ja) * | 2000-02-03 | 2001-10-19 | Nippon Mitsubishi Oil Corp | 加工面を被覆処理したcfrp製搬送用部材およびその処理方法 |
JP4458315B2 (ja) * | 2000-06-02 | 2010-04-28 | 旭化成イーマテリアルズ株式会社 | ペリクル |
JP4286194B2 (ja) | 2004-08-18 | 2009-06-24 | 信越化学工業株式会社 | ペリクルフレーム、および該フレームを用いたフォトリソグラフィー用ペリクル |
JP4459824B2 (ja) * | 2005-01-26 | 2010-04-28 | 中西金属工業株式会社 | 転がり軸受用保持器 |
JP4577069B2 (ja) | 2005-03-31 | 2010-11-10 | 日本軽金属株式会社 | ペリクル用支持枠、ペリクル用枠体およびペリクル用枠体の製造方法 |
CN101208397B (zh) * | 2005-06-24 | 2012-01-11 | 日本化成株式会社 | 涂布用组合物及其制造方法和树脂成型体及其制造方法 |
JP2008183626A (ja) * | 2005-11-25 | 2008-08-14 | Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai | 超音波振動切削方法及びそれにより得られる繊維強化樹脂 |
JP2007333910A (ja) * | 2006-06-14 | 2007-12-27 | Shin Etsu Chem Co Ltd | ペリクル |
CN102681334B (zh) * | 2007-07-06 | 2015-09-30 | 旭化成电子材料株式会社 | 从容纳容器取出大型表膜构件的取出方法 |
JP2009139879A (ja) * | 2007-12-11 | 2009-06-25 | Toppan Printing Co Ltd | ペリクル |
JP5515238B2 (ja) * | 2008-06-05 | 2014-06-11 | 凸版印刷株式会社 | フォトマスクの曇り防止方法及び装置 |
CN101352928B (zh) * | 2008-09-05 | 2010-12-01 | 沈阳航空工业学院 | 聚芳醚砜酮树脂基复合材料的在线浸渍缠绕成型方法 |
JP5141485B2 (ja) * | 2008-10-03 | 2013-02-13 | 日本精工株式会社 | 高速回転用転がり軸受用保持器の製造方法 |
JP5133229B2 (ja) * | 2008-12-05 | 2013-01-30 | 信越ポリマー株式会社 | ペリクル収納容器 |
JP2011059446A (ja) * | 2009-09-10 | 2011-03-24 | Asahi Kasei E-Materials Corp | ペリクル枠体、ペリクル及びペリクル枠体の使用方法 |
JP4974389B2 (ja) * | 2009-10-30 | 2012-07-11 | 信越化学工業株式会社 | リソグラフィ用ペリクルフレーム及びリソグラフィ用ペリクル |
JP2011158585A (ja) * | 2010-01-29 | 2011-08-18 | Shin-Etsu Chemical Co Ltd | ペリクルおよびペリクルの製造方法 |
JP2012093595A (ja) * | 2010-10-28 | 2012-05-17 | Shin Etsu Chem Co Ltd | ペリクルフレームおよびペリクル |
JP5663376B2 (ja) * | 2011-04-04 | 2015-02-04 | 信越化学工業株式会社 | ペリクルフレーム、その製造方法、及びペリクル |
-
2011
- 2011-11-04 JP JP2011242344A patent/JP5940283B2/ja active Active
-
2012
- 2012-10-04 KR KR1020120110013A patent/KR102028374B1/ko active IP Right Grant
- 2012-11-01 TW TW101140616A patent/TWI452422B/zh active
- 2012-11-05 CN CN2012104361743A patent/CN103091975A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20130049719A (ko) | 2013-05-14 |
KR102028374B1 (ko) | 2019-10-04 |
CN103091975A (zh) | 2013-05-08 |
JP2013097308A (ja) | 2013-05-20 |
TW201339740A (zh) | 2013-10-01 |
TWI452422B (zh) | 2014-09-11 |
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