JP5936310B2 - パワー半導体モジュール及びその取り付け構造 - Google Patents

パワー半導体モジュール及びその取り付け構造 Download PDF

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Publication number
JP5936310B2
JP5936310B2 JP2011059259A JP2011059259A JP5936310B2 JP 5936310 B2 JP5936310 B2 JP 5936310B2 JP 2011059259 A JP2011059259 A JP 2011059259A JP 2011059259 A JP2011059259 A JP 2011059259A JP 5936310 B2 JP5936310 B2 JP 5936310B2
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JP
Japan
Prior art keywords
metal substrate
power semiconductor
semiconductor module
electrically insulating
resin package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011059259A
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English (en)
Japanese (ja)
Other versions
JP2012195492A (ja
JP2012195492A5 (https=
Inventor
晋助 浅田
晋助 浅田
雄悦 渡邊
雄悦 渡邊
浅尾　淑人
淑人 浅尾
健二郎 長尾
健二郎 長尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44763795&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5936310(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2011059259A priority Critical patent/JP5936310B2/ja
Priority to US13/204,226 priority patent/US8749977B2/en
Priority to EP11177061.6A priority patent/EP2500939B2/en
Priority to EP17187208.8A priority patent/EP3288075B1/en
Publication of JP2012195492A publication Critical patent/JP2012195492A/ja
Publication of JP2012195492A5 publication Critical patent/JP2012195492A5/ja
Application granted granted Critical
Publication of JP5936310B2 publication Critical patent/JP5936310B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07652—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/627—Multiple strap connectors having different structures or shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2011059259A 2011-03-17 2011-03-17 パワー半導体モジュール及びその取り付け構造 Expired - Fee Related JP5936310B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011059259A JP5936310B2 (ja) 2011-03-17 2011-03-17 パワー半導体モジュール及びその取り付け構造
US13/204,226 US8749977B2 (en) 2011-03-17 2011-08-05 Power semiconductor module and its attachment structure
EP11177061.6A EP2500939B2 (en) 2011-03-17 2011-08-10 Power semiconductor module attachment structure
EP17187208.8A EP3288075B1 (en) 2011-03-17 2011-08-10 Power semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011059259A JP5936310B2 (ja) 2011-03-17 2011-03-17 パワー半導体モジュール及びその取り付け構造

Publications (3)

Publication Number Publication Date
JP2012195492A JP2012195492A (ja) 2012-10-11
JP2012195492A5 JP2012195492A5 (https=) 2014-02-20
JP5936310B2 true JP5936310B2 (ja) 2016-06-22

Family

ID=44763795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011059259A Expired - Fee Related JP5936310B2 (ja) 2011-03-17 2011-03-17 パワー半導体モジュール及びその取り付け構造

Country Status (3)

Country Link
US (1) US8749977B2 (https=)
EP (2) EP3288075B1 (https=)
JP (1) JP5936310B2 (https=)

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JP6365322B2 (ja) * 2015-01-23 2018-08-01 三菱電機株式会社 半導体装置
JP6382784B2 (ja) * 2015-11-26 2018-08-29 株式会社Ｓｏｋｅｎ 半導体装置の製造方法
DE102015223599A1 (de) * 2015-11-27 2017-06-01 Robert Bosch Gmbh Leistungsmodul für einen Elektromotor
WO2017175612A1 (ja) * 2016-04-04 2017-10-12 三菱電機株式会社 パワーモジュール、パワー半導体装置及びパワーモジュール製造方法
JP6920790B2 (ja) * 2016-05-24 2021-08-18 ローム株式会社 インテリジェントパワーモジュール、電気自動車またはハイブリッドカー、およびインテリジェントパワーモジュールの組み立て方法
DE102016220553A1 (de) 2016-10-20 2018-04-26 Robert Bosch Gmbh Leistungsmodul
JP2019012767A (ja) 2017-06-30 2019-01-24 ルネサスエレクトロニクス株式会社 半導体モジュールの製造方法および半導体モジュール
CN111602239B (zh) * 2018-01-11 2023-10-24 阿莫善斯有限公司 功率半导体模块
JP6737306B2 (ja) * 2018-06-27 2020-08-05 三菱電機株式会社 半導体装置
JP7052689B2 (ja) 2018-11-21 2022-04-12 株式会社オートネットワーク技術研究所 回路構成体
JP7309553B2 (ja) * 2019-09-20 2023-07-18 スタンレー電気株式会社 光源ユニット、光源ユニットの製造方法及び車両用灯具
CN113013106B (zh) * 2019-12-19 2023-08-11 广东美的白色家电技术创新中心有限公司 智能功率模块及其制备方法、包含该智能功率模块的电器
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JP7509078B2 (ja) * 2021-04-23 2024-07-02 株式会社デンソー 半導体モジュール
US11791238B2 (en) 2021-06-23 2023-10-17 Infineon Technologies Austria Ag Semiconductor package with releasable isolation layer protection
US20230005822A1 (en) * 2021-07-01 2023-01-05 Hamilton Sundstrand Corporation Polyimide bonded bus bar for power device
CN114664766B (zh) * 2022-03-15 2025-10-03 广东汇芯半导体有限公司 一种功率模块
FR3158011A1 (fr) * 2023-12-31 2025-07-04 Valeo Eautomotive Germany Gmbh Système électrique avec un radiateur de refroidissement d’un dispositif électrique

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Also Published As

Publication number Publication date
EP2500939B2 (en) 2025-05-07
US20120236503A1 (en) 2012-09-20
EP3288075B1 (en) 2019-06-26
EP2500939A3 (en) 2013-05-15
US8749977B2 (en) 2014-06-10
EP3288075A1 (en) 2018-02-28
JP2012195492A (ja) 2012-10-11
EP2500939A2 (en) 2012-09-19
EP2500939B1 (en) 2018-12-26

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