JP5927946B2 - 多層配線板の製造方法 - Google Patents
多層配線板の製造方法 Download PDFInfo
- Publication number
- JP5927946B2 JP5927946B2 JP2012019842A JP2012019842A JP5927946B2 JP 5927946 B2 JP5927946 B2 JP 5927946B2 JP 2012019842 A JP2012019842 A JP 2012019842A JP 2012019842 A JP2012019842 A JP 2012019842A JP 5927946 B2 JP5927946 B2 JP 5927946B2
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- Prior art keywords
- sheet
- wiring board
- resin
- multilayer wiring
- press plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2012019842A JP5927946B2 (ja) | 2011-02-14 | 2012-02-01 | 多層配線板の製造方法 |
Applications Claiming Priority (3)
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JP2011028244 | 2011-02-14 | ||
JP2011028244 | 2011-02-14 | ||
JP2012019842A JP5927946B2 (ja) | 2011-02-14 | 2012-02-01 | 多層配線板の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014175997A Division JP5820915B2 (ja) | 2011-02-14 | 2014-08-29 | 多層配線板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012186451A JP2012186451A (ja) | 2012-09-27 |
JP2012186451A5 JP2012186451A5 (ko) | 2014-10-30 |
JP5927946B2 true JP5927946B2 (ja) | 2016-06-01 |
Family
ID=47016202
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012019842A Active JP5927946B2 (ja) | 2011-02-14 | 2012-02-01 | 多層配線板の製造方法 |
JP2014175997A Active JP5820915B2 (ja) | 2011-02-14 | 2014-08-29 | 多層配線板の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014175997A Active JP5820915B2 (ja) | 2011-02-14 | 2014-08-29 | 多層配線板の製造方法 |
Country Status (1)
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JP (2) | JP5927946B2 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204994111U (zh) | 2013-02-15 | 2016-01-20 | 株式会社村田制作所 | 层叠电路基板 |
EP2827359B1 (en) * | 2013-07-17 | 2019-06-12 | Applied Materials, Inc. | Cleaning method for thin-film processing applications and apparatus for use therein |
JP7201371B2 (ja) * | 2018-03-08 | 2023-01-10 | 株式会社クラレ | 熱可塑性液晶ポリマー多層構造体の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0739614Y2 (ja) * | 1993-04-12 | 1995-09-13 | 日本ピラー工業株式会社 | クッション材 |
JP2002176258A (ja) * | 2000-12-08 | 2002-06-21 | Toshiba Chem Corp | プリント配線板の製造方法 |
AU2002367949A1 (en) * | 2002-05-21 | 2003-12-02 | Daiwa Co., Ltd. | Interlayer connection structure and its building method |
JP3867673B2 (ja) * | 2003-01-28 | 2007-01-10 | 松下電工株式会社 | 多層プリント配線板の製造方法 |
JP2007266165A (ja) * | 2006-03-28 | 2007-10-11 | Matsushita Electric Ind Co Ltd | 多層配線基板の製造方法 |
JP4881445B2 (ja) * | 2007-12-05 | 2012-02-22 | 三菱樹脂株式会社 | キャビティー部を有する多層配線基板 |
JP4998414B2 (ja) * | 2008-09-05 | 2012-08-15 | 株式会社デンソー | 多層基板の製造方法 |
JP2010283300A (ja) * | 2009-06-08 | 2010-12-16 | Panasonic Corp | 突起電極付き配線基板及び突起電極付き配線基板の製造方法 |
JP5051260B2 (ja) * | 2010-03-26 | 2012-10-17 | 日立化成工業株式会社 | プレス装置、多層基板の製造方法、および多層基板 |
-
2012
- 2012-02-01 JP JP2012019842A patent/JP5927946B2/ja active Active
-
2014
- 2014-08-29 JP JP2014175997A patent/JP5820915B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012186451A (ja) | 2012-09-27 |
JP2014220544A (ja) | 2014-11-20 |
JP5820915B2 (ja) | 2015-11-24 |
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