JP5927946B2 - 多層配線板の製造方法 - Google Patents

多層配線板の製造方法 Download PDF

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Publication number
JP5927946B2
JP5927946B2 JP2012019842A JP2012019842A JP5927946B2 JP 5927946 B2 JP5927946 B2 JP 5927946B2 JP 2012019842 A JP2012019842 A JP 2012019842A JP 2012019842 A JP2012019842 A JP 2012019842A JP 5927946 B2 JP5927946 B2 JP 5927946B2
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sheet
wiring board
resin
multilayer wiring
press plate
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Japanese (ja)
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JP2012186451A (ja
JP2012186451A5 (enrdf_load_stackoverflow
Inventor
千阪　俊介
俊介 千阪
優輝 伊藤
優輝 伊藤
元郎 加藤
元郎 加藤
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2012019842A 2011-02-14 2012-02-01 多層配線板の製造方法 Active JP5927946B2 (ja)

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JP2012019842A JP5927946B2 (ja) 2011-02-14 2012-02-01 多層配線板の製造方法

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JP2011028244 2011-02-14
JP2011028244 2011-02-14
JP2012019842A JP5927946B2 (ja) 2011-02-14 2012-02-01 多層配線板の製造方法

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JP2014175997A Division JP5820915B2 (ja) 2011-02-14 2014-08-29 多層配線板の製造方法

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JP2012186451A JP2012186451A (ja) 2012-09-27
JP2012186451A5 JP2012186451A5 (enrdf_load_stackoverflow) 2014-10-30
JP5927946B2 true JP5927946B2 (ja) 2016-06-01

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JP2014175997A Active JP5820915B2 (ja) 2011-02-14 2014-08-29 多層配線板の製造方法

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6004078B2 (ja) * 2013-02-15 2016-10-05 株式会社村田製作所 積層回路基板、積層回路基板の製造方法
EP2827359B1 (en) * 2013-07-17 2019-06-12 Applied Materials, Inc. Cleaning method for thin-film processing applications and apparatus for use therein
JP7201371B2 (ja) * 2018-03-08 2023-01-10 株式会社クラレ 熱可塑性液晶ポリマー多層構造体の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739614Y2 (ja) * 1993-04-12 1995-09-13 日本ピラー工業株式会社 クッション材
JP2002176258A (ja) * 2000-12-08 2002-06-21 Toshiba Chem Corp プリント配線板の製造方法
WO2003098984A1 (fr) * 2002-05-21 2003-11-27 Daiwa Co., Ltd. Structure d'interconnexion entre couches et procede de fabrication associe
JP3867673B2 (ja) * 2003-01-28 2007-01-10 松下電工株式会社 多層プリント配線板の製造方法
JP2007266165A (ja) * 2006-03-28 2007-10-11 Matsushita Electric Ind Co Ltd 多層配線基板の製造方法
DE112008003252T5 (de) * 2007-12-05 2011-05-05 Mitsubishi Plastics, Inc. Vielschichtiges Leitungssubstrat mit einem Hohlraumbereich
JP4998414B2 (ja) * 2008-09-05 2012-08-15 株式会社デンソー 多層基板の製造方法
JP2010283300A (ja) * 2009-06-08 2010-12-16 Panasonic Corp 突起電極付き配線基板及び突起電極付き配線基板の製造方法
JP5051260B2 (ja) * 2010-03-26 2012-10-17 日立化成工業株式会社 プレス装置、多層基板の製造方法、および多層基板

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JP2012186451A (ja) 2012-09-27
JP2014220544A (ja) 2014-11-20
JP5820915B2 (ja) 2015-11-24

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