JP5920943B2 - 受け台用横梁及びこれを適用した基板処理装置 - Google Patents
受け台用横梁及びこれを適用した基板処理装置 Download PDFInfo
- Publication number
- JP5920943B2 JP5920943B2 JP2014085748A JP2014085748A JP5920943B2 JP 5920943 B2 JP5920943 B2 JP 5920943B2 JP 2014085748 A JP2014085748 A JP 2014085748A JP 2014085748 A JP2014085748 A JP 2014085748A JP 5920943 B2 JP5920943 B2 JP 5920943B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- workpiece
- cradle
- horizontal beam
- long side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Description
110 板材状第1加工物
120 板材状第2加工物
130 板材状第3加工物
140 板材状第4加工物
150 線状溝
200 補強材
Claims (8)
- 複数の板材状加工物を組み合わせて製造された四角柱状の金属製の筒状構造物と、
前記筒状構造物の長手方向の長さと同じ幅を有し、前記筒状構造物の左側面、上部面、右側面及び下部面それぞれの全面の外部を囲むように複数回巻回して重ね合わせた補強材と、
を備え、
前記筒状構造物の左側面及び右側面のうちの少なくとも片面に線状溝が形成され、前記筒状構造物に巻回される前記補強材が、前記線状溝の形状に対応して貫通されて前記線状溝が外部に露出されることを特徴とする受け台用横梁。 - 前記筒状構造物は、
長辺である第1長辺と短辺である第1短辺とからなる矩形板材状を呈するものであって、前記第1長辺が前記第1短辺よりも長い板材状第1加工物と、
長辺である第2長辺と短辺である第2短辺とからなる矩形板材状を呈するものであって、前記第2長辺が前記第2短辺よりも長い板材状第2加工物と、
長辺である第3長辺と短辺である第3短辺とからなる矩形板材状を呈するものであって、前記第3長辺が前記第3短辺よりも長い板材状第3加工物と、
長辺である第4長辺と短辺である第4短辺とからなる矩形板材状を呈するものであって、前記第4長辺が前記第4短辺よりも長い板材状第4加工物と、
を備えていて、前記板材状第1加工物が左側面、前記板材状第2加工物が上部面、前記板材状第3加工物が右側面、前記板材状第4加工物が下部面にそれぞれ配設されて組み合わせられて四角柱状を呈することを特徴とする請求項1に記載の受け台用横梁。 - 前記板材状第1加工物、板材状第2加工物、板材状第3加工物及び板材状第4加工物の各長辺及び短辺の長さは、前記受け台用横梁の大きさに応じて決定されることを特徴とする請求項2に記載の受け台用横梁。
- 各板材状加工物の短辺の長さが、長辺の長さの1/10よりも大きく形成されることを特徴とする請求項2に記載の受け台用横梁。
- 前記補強材は、炭素繊維とエポキシとが配合された炭素繊維強化材(CFRP)であることを特徴とする請求項1に記載の受け台用横梁。
- 前記線状溝に、金属製の受け台が係合されることを特徴とする請求項1に記載の受け台用横梁。
- 前記筒状構造物の左側面、上部面、右側面及び下部面を、前記筒状構造物の内部において支持する金属製の補強桟をさらに備えることを特徴とする請求項1に記載の受け台用横梁。
- 基板を処理する基板処理装置であって、
基板が載置される基板ステージと、
前記基板ステージの上部に沿って移動する受け台用横梁と、
を備え、
前記受け台用横梁は、請求項1乃至請求項7のうちのいずれか一項に記載の受け台用横梁であることを特徴とする基板処理装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0042929 | 2013-04-18 | ||
KR20130042929 | 2013-04-18 | ||
KR10-2013-0069626 | 2013-06-18 | ||
KR20130069626A KR101494756B1 (ko) | 2013-04-18 | 2013-06-18 | 지지대용 빔 및 이를 적용한 기판처리장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014210432A JP2014210432A (ja) | 2014-11-13 |
JP5920943B2 true JP5920943B2 (ja) | 2016-05-18 |
Family
ID=51709431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014085748A Expired - Fee Related JP5920943B2 (ja) | 2013-04-18 | 2014-04-17 | 受け台用横梁及びこれを適用した基板処理装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5920943B2 (ja) |
CN (1) | CN104112689A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018089897A (ja) * | 2016-12-06 | 2018-06-14 | 帝人株式会社 | 木質集成材 |
JP7015632B2 (ja) * | 2016-12-06 | 2022-02-03 | 帝人株式会社 | 集成材の製造方法 |
CN106938371A (zh) * | 2017-03-16 | 2017-07-11 | 广东工业大学 | 一种高精度激光切割机及其横梁 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000094188A (ja) * | 1998-09-17 | 2000-04-04 | Kawatetsu Metal Fab Kk | 角形鋼管柱製造用の角溶接エンドタブ |
JP2001269996A (ja) * | 2000-03-24 | 2001-10-02 | Nippon Shokubai Co Ltd | 管状物の補強方法及び管状物用補強材 |
CN202108160U (zh) * | 2011-06-01 | 2012-01-11 | 南京锋晖复合材料有限公司 | 一种纤维增强树脂筋材 |
EP2729427A1 (en) * | 2011-07-06 | 2014-05-14 | Renishaw PLC | Method of manufacture and apparatus therefor |
CN102979964A (zh) * | 2011-09-07 | 2013-03-20 | 上海启鹏工程材料科技有限公司 | 一种frp材料复合不锈钢管及其制备工艺 |
-
2014
- 2014-04-17 CN CN201410156015.7A patent/CN104112689A/zh active Pending
- 2014-04-17 JP JP2014085748A patent/JP5920943B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104112689A (zh) | 2014-10-22 |
JP2014210432A (ja) | 2014-11-13 |
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