JPWO2011121992A1 - 部品実装装置 - Google Patents
部品実装装置 Download PDFInfo
- Publication number
- JPWO2011121992A1 JPWO2011121992A1 JP2011532399A JP2011532399A JPWO2011121992A1 JP WO2011121992 A1 JPWO2011121992 A1 JP WO2011121992A1 JP 2011532399 A JP2011532399 A JP 2011532399A JP 2011532399 A JP2011532399 A JP 2011532399A JP WO2011121992 A1 JPWO2011121992 A1 JP WO2011121992A1
- Authority
- JP
- Japan
- Prior art keywords
- axis direction
- fastener
- rail
- reinforcing member
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Machine Tool Units (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
101 ヘッド
102 レール
103 Xビーム
104 Yビーム
105 補強部材
106 基台
111 保持手段
122 第二締結具
151 第一締結具
152 挟持部材
153 止めねじ
200 基板
300 部品
101 ヘッド
102 レール
103 Xビーム
104 Yビーム
105 補強部材
106 基台
111 保持手段
122 第二締結具
151 第一締結具
152 挟持部材
153 止めねじ
200 基板
300 部品
Claims (7)
- ヘッドをX軸方向に摺動自在に案内するX軸方向に延びて配置されるレールと、
前記レールがY軸方向の一端部に取り付けられ、X軸方向に延びて配置される棒形状のXビームと、
前記XビームをY軸方向に摺動自在に案内するY軸方向に延びて配置されるYビームとを備える部品実装装置であって、
前記レールの熱膨張と前記Xビームの熱膨張との差によって発生する前記Xビームの反りに抗する補強部材であって、炭素繊維強化樹脂からなり、第一締結具によりX軸方向に並ぶ3箇所以上で前記XビームのY軸方向の他端部に締結される補強部材
を備える部品実装装置。 - 前記レールは、前記Xビームに対し第二締結具によりX軸方向に並ぶ3箇所以上で前記XビームのY軸方向の一端部に締結され、
前記補強部材を前記Xビームに締結する前記第一締結具のX軸方向の配置ピッチは、前記レールを前記Xビームに締結する前記第二締結具のX軸方向の配置ピッチ以下である
請求項1に記載の部品実装装置。 - 前記補強部材を前記Xビームに締結する前記第一締結具のX軸方向の配置ピッチは、前記レールを前記Xビームに締結する前記第二締結具のX軸方向の配置ピッチの1/n倍(nは自然数)である
請求項2に記載の部品実装装置。 - 前記第一締結具のX軸方向の位置は、前記第二締結具のX軸方向の位置と一致する
請求項3に記載の部品実装装置。 - 前記第一締結具は、ボルトを備え、
前記補強部材は、前記ボルトを挿通する挿通孔を備える
請求項1に記載の部品実装装置。 - 前記補強部材を前記Xビームに締結する前記第一締結具のX軸方向の配置ピッチは70mm以下である
請求項1に記載の部品実装装置。 - 前記XビームのYZ断面の形状は、Y軸方向の他端部に至るまで徐々にZ軸方向の間隔がY軸対称で狭くなる形状を有する
請求項1に記載の部品実装装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011532399A JP4843751B2 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010075959 | 2010-03-29 | ||
JP2010075959 | 2010-03-29 | ||
JP2011532399A JP4843751B2 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
PCT/JP2011/001851 WO2011121992A1 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4843751B2 JP4843751B2 (ja) | 2011-12-21 |
JPWO2011121992A1 true JPWO2011121992A1 (ja) | 2013-07-04 |
Family
ID=44711754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011532399A Active JP4843751B2 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8826521B2 (ja) |
JP (1) | JP4843751B2 (ja) |
KR (1) | KR20120132301A (ja) |
CN (1) | CN102342197B (ja) |
DE (1) | DE112011101138T5 (ja) |
WO (1) | WO2011121992A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012129317A (ja) * | 2010-12-14 | 2012-07-05 | Panasonic Corp | 部品実装装置 |
CN103443133B (zh) | 2011-03-25 | 2015-01-07 | 埃克森美孚化学专利公司 | 来自甲硅烷基化乙烯基封端的大分子单体的嵌段共聚物 |
DE102013103125B4 (de) * | 2013-03-27 | 2021-10-14 | Asm Assembly Systems Gmbh & Co. Kg | Portalsystem und Verfahren zur Herstellung eines Portalsystems zur Positionierung von wenigstens einem Bestückkopf in einer SMT-Bestückmaschine |
KR101864325B1 (ko) * | 2013-06-04 | 2018-06-05 | 한화에어로스페이스 주식회사 | 부품 실장기 및 부품 실장기의 설계 방법 |
KR101994288B1 (ko) * | 2014-02-03 | 2019-06-28 | 한화정밀기계 주식회사 | 부품 실장 장치 |
KR102041340B1 (ko) * | 2014-10-15 | 2019-11-27 | 한화정밀기계 주식회사 | 겐트리 모듈 |
US10167988B2 (en) * | 2015-04-20 | 2019-01-01 | Fuji Corporation | Manufacturing work machine |
JP6978340B2 (ja) * | 2018-02-19 | 2021-12-08 | ファスフォードテクノロジ株式会社 | 実装装置および半導体装置の製造方法 |
CN108500487B (zh) * | 2018-04-25 | 2024-04-19 | 武汉凯奇冶金焊接设备制造有限责任公司 | 用于带钢在线激光焊机的导轨装置 |
DE102022105746A1 (de) | 2022-03-11 | 2023-09-14 | ASMPT GmbH & Co. KG | Räumlich verteilte Temperaturmessung entlang einer Komponente eines Positioniersystems für einen Bestückkopf eines Bestückautomaten |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1322319C (en) * | 1988-05-19 | 1993-09-21 | David John Lewis | Portable saw mill |
JP2001352200A (ja) | 2000-06-07 | 2001-12-21 | Juki Corp | 電子部品搭載機 |
JP4510276B2 (ja) | 2000-12-08 | 2010-07-21 | パナソニック株式会社 | ヘッド直動装置 |
JP3904224B2 (ja) | 2001-11-30 | 2007-04-11 | Juki株式会社 | Xy位置決め装置及び電子部品搭載装置 |
EP1583412A4 (en) | 2002-12-02 | 2007-08-15 | Matsushita Electric Ind Co Ltd | DEVICE AND METHOD FOR PARTS ASSEMBLY |
JP2004186308A (ja) | 2002-12-02 | 2004-07-02 | Matsushita Electric Ind Co Ltd | 部品実装装置及び方法 |
DE10309879B4 (de) * | 2003-03-06 | 2006-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
JP3848288B2 (ja) | 2003-04-25 | 2006-11-22 | キヤノン株式会社 | 放射線画像撮影装置 |
JP4128156B2 (ja) * | 2004-06-03 | 2008-07-30 | 松下電器産業株式会社 | 部品実装方法及び装置 |
JP5047883B2 (ja) | 2008-06-05 | 2012-10-10 | 住友重機械工業株式会社 | 吸着盤 |
-
2011
- 2011-03-29 KR KR1020117020096A patent/KR20120132301A/ko not_active Application Discontinuation
- 2011-03-29 DE DE112011101138T patent/DE112011101138T5/de not_active Withdrawn
- 2011-03-29 US US13/254,487 patent/US8826521B2/en active Active
- 2011-03-29 JP JP2011532399A patent/JP4843751B2/ja active Active
- 2011-03-29 CN CN201180001291.0A patent/CN102342197B/zh active Active
- 2011-03-29 WO PCT/JP2011/001851 patent/WO2011121992A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE112011101138T5 (de) | 2013-01-17 |
KR20120132301A (ko) | 2012-12-05 |
US20120045299A1 (en) | 2012-02-23 |
WO2011121992A1 (ja) | 2011-10-06 |
JP4843751B2 (ja) | 2011-12-21 |
CN102342197B (zh) | 2015-04-01 |
CN102342197A (zh) | 2012-02-01 |
US8826521B2 (en) | 2014-09-09 |
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