JP4843751B2 - 部品実装装置 - Google Patents
部品実装装置 Download PDFInfo
- Publication number
- JP4843751B2 JP4843751B2 JP2011532399A JP2011532399A JP4843751B2 JP 4843751 B2 JP4843751 B2 JP 4843751B2 JP 2011532399 A JP2011532399 A JP 2011532399A JP 2011532399 A JP2011532399 A JP 2011532399A JP 4843751 B2 JP4843751 B2 JP 4843751B2
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- Japan
- Prior art keywords
- axis direction
- fastener
- rail
- reinforcing member
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003014 reinforcing effect Effects 0.000 claims description 68
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 22
- 239000004917 carbon fiber Substances 0.000 claims description 22
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 22
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 230000002787 reinforcement Effects 0.000 claims description 8
- 239000011295 pitch Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 230000035882 stress Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
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- 238000002474 experimental method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
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- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Machine Tool Units (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
101 ヘッド
102 レール
103 Xビーム
104 Yビーム
105 補強部材
106 基台
111 保持手段
122 第二締結具
151 第一締結具
152 挟持部材
153 止めねじ
200 基板
300 部品
Claims (5)
- ヘッドをX軸方向に摺動自在に案内するX軸方向に延びて配置されるレールと、
前記レールがY軸方向の一端部に取り付けられ、X軸方向に延びて配置される棒形状のXビームと、
前記XビームをY軸方向に摺動自在に案内するY軸方向に延びて配置されるYビームとを備える部品実装装置であって、
前記レールの熱膨張と前記Xビームの熱膨張との差によって発生する前記Xビームの反りに抗する補強部材であって、炭素繊維強化樹脂からなり、第一締結具によりX軸方向に並ぶ3箇所以上で前記XビームのY軸方向の他端部に締結される補強部材とを備え、
前記レールは、前記Xビームに対し第二締結具によりX軸方向に並ぶ3箇所以上で前記XビームのY軸方向の一端部に締結され、
前記補強部材を前記Xビームに締結する前記第一締結具のX軸方向の配置ピッチは、前記レールを前記Xビームに締結する前記第二締結具のX軸方向の配置ピッチ以下である
部品実装装置。 - 前記補強部材を前記Xビームに締結する前記第一締結具のX軸方向の配置ピッチは、前記レールを前記Xビームに締結する前記第二締結具のX軸方向の配置ピッチの1/n倍(nは自然数)である
請求項1に記載の部品実装装置。 - 前記第一締結具のX軸方向の位置は、前記第二締結具のX軸方向の位置と一致する
請求項2に記載の部品実装装置。 - 前記第一締結具は、ボルトを備え、
前記補強部材は、前記ボルトを挿通する挿通孔を備える
請求項1に記載の部品実装装置。 - ヘッドをX軸方向に摺動自在に案内するX軸方向に延びて配置されるレールと、
前記レールがY軸方向の一端部に取り付けられ、X軸方向に延びて配置される棒形状のXビームと、
前記XビームをY軸方向に摺動自在に案内するY軸方向に延びて配置されるYビームとを備える部品実装装置であって、
前記レールの熱膨張と前記Xビームの熱膨張との差によって発生する前記Xビームの反りに抗する補強部材であって、炭素繊維強化樹脂からなり、第一締結具によりX軸方向に並ぶ3箇所以上で前記XビームのY軸方向の他端部に締結される補強部材とを備え、
前記補強部材を前記Xビームに締結する前記第一締結具のX軸方向の配置ピッチは70mm以下である
部品実装装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011532399A JP4843751B2 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010075959 | 2010-03-29 | ||
JP2010075959 | 2010-03-29 | ||
JP2011532399A JP4843751B2 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
PCT/JP2011/001851 WO2011121992A1 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4843751B2 true JP4843751B2 (ja) | 2011-12-21 |
JPWO2011121992A1 JPWO2011121992A1 (ja) | 2013-07-04 |
Family
ID=44711754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011532399A Active JP4843751B2 (ja) | 2010-03-29 | 2011-03-29 | 部品実装装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8826521B2 (ja) |
JP (1) | JP4843751B2 (ja) |
KR (1) | KR20120132301A (ja) |
CN (1) | CN102342197B (ja) |
DE (1) | DE112011101138T5 (ja) |
WO (1) | WO2011121992A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012129317A (ja) * | 2010-12-14 | 2012-07-05 | Panasonic Corp | 部品実装装置 |
KR20140142632A (ko) * | 2013-06-04 | 2014-12-12 | 삼성테크윈 주식회사 | 부품 실장기 및 부품 실장기의 설계 방법 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012134716A2 (en) | 2011-03-25 | 2012-10-04 | Exxonmobil Chemical Patents Inc., A Corporation Of The State Of Deleware | Block copolymers from silylated vinyl terminated macromers |
DE102013103125B4 (de) * | 2013-03-27 | 2021-10-14 | Asm Assembly Systems Gmbh & Co. Kg | Portalsystem und Verfahren zur Herstellung eines Portalsystems zur Positionierung von wenigstens einem Bestückkopf in einer SMT-Bestückmaschine |
KR101994288B1 (ko) * | 2014-02-03 | 2019-06-28 | 한화정밀기계 주식회사 | 부품 실장 장치 |
KR102041340B1 (ko) * | 2014-10-15 | 2019-11-27 | 한화정밀기계 주식회사 | 겐트리 모듈 |
CN107530846B (zh) * | 2015-04-20 | 2020-02-21 | 株式会社富士 | 制造作业机 |
JP6978340B2 (ja) * | 2018-02-19 | 2021-12-08 | ファスフォードテクノロジ株式会社 | 実装装置および半導体装置の製造方法 |
CN108500487B (zh) * | 2018-04-25 | 2024-04-19 | 武汉凯奇冶金焊接设备制造有限责任公司 | 用于带钢在线激光焊机的导轨装置 |
DE102022105746A1 (de) | 2022-03-11 | 2023-09-14 | ASMPT GmbH & Co. KG | Räumlich verteilte Temperaturmessung entlang einer Komponente eines Positioniersystems für einen Bestückkopf eines Bestückautomaten |
CN115432588A (zh) * | 2022-09-07 | 2022-12-06 | 中国建筑土木建设有限公司 | 用于龙门吊碳纤维桁架与外导轨的安装装置及方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002176294A (ja) * | 2000-12-08 | 2002-06-21 | Matsushita Electric Ind Co Ltd | ヘッド直動装置 |
JP2003168898A (ja) * | 2001-11-30 | 2003-06-13 | Juki Corp | Xy位置決め装置及び電子部品搭載装置 |
JP2004321568A (ja) * | 2003-04-25 | 2004-11-18 | Canon Inc | 放射線画像撮影装置 |
JP2009295823A (ja) * | 2008-06-05 | 2009-12-17 | Sumitomo Heavy Ind Ltd | 吸着盤 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1322319C (en) * | 1988-05-19 | 1993-09-21 | David John Lewis | Portable saw mill |
JP2001352200A (ja) | 2000-06-07 | 2001-12-21 | Juki Corp | 電子部品搭載機 |
JP2004186308A (ja) | 2002-12-02 | 2004-07-02 | Matsushita Electric Ind Co Ltd | 部品実装装置及び方法 |
WO2004052072A1 (ja) | 2002-12-02 | 2004-06-17 | Matsushita Electric Industrial Co., Ltd. | 部品実装装置及び方法 |
DE10309879B4 (de) * | 2003-03-06 | 2006-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
JP4128156B2 (ja) | 2004-06-03 | 2008-07-30 | 松下電器産業株式会社 | 部品実装方法及び装置 |
-
2011
- 2011-03-29 CN CN201180001291.0A patent/CN102342197B/zh active Active
- 2011-03-29 WO PCT/JP2011/001851 patent/WO2011121992A1/ja active Application Filing
- 2011-03-29 JP JP2011532399A patent/JP4843751B2/ja active Active
- 2011-03-29 KR KR1020117020096A patent/KR20120132301A/ko not_active Application Discontinuation
- 2011-03-29 DE DE112011101138T patent/DE112011101138T5/de not_active Withdrawn
- 2011-03-29 US US13/254,487 patent/US8826521B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002176294A (ja) * | 2000-12-08 | 2002-06-21 | Matsushita Electric Ind Co Ltd | ヘッド直動装置 |
JP2003168898A (ja) * | 2001-11-30 | 2003-06-13 | Juki Corp | Xy位置決め装置及び電子部品搭載装置 |
JP2004321568A (ja) * | 2003-04-25 | 2004-11-18 | Canon Inc | 放射線画像撮影装置 |
JP2009295823A (ja) * | 2008-06-05 | 2009-12-17 | Sumitomo Heavy Ind Ltd | 吸着盤 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012129317A (ja) * | 2010-12-14 | 2012-07-05 | Panasonic Corp | 部品実装装置 |
KR20140142632A (ko) * | 2013-06-04 | 2014-12-12 | 삼성테크윈 주식회사 | 부품 실장기 및 부품 실장기의 설계 방법 |
KR101864325B1 (ko) | 2013-06-04 | 2018-06-05 | 한화에어로스페이스 주식회사 | 부품 실장기 및 부품 실장기의 설계 방법 |
Also Published As
Publication number | Publication date |
---|---|
US20120045299A1 (en) | 2012-02-23 |
WO2011121992A1 (ja) | 2011-10-06 |
JPWO2011121992A1 (ja) | 2013-07-04 |
CN102342197A (zh) | 2012-02-01 |
DE112011101138T5 (de) | 2013-01-17 |
US8826521B2 (en) | 2014-09-09 |
KR20120132301A (ko) | 2012-12-05 |
CN102342197B (zh) | 2015-04-01 |
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