JP5892282B1 - 導電性接着剤、導電性接着シート、および配線デバイス - Google Patents

導電性接着剤、導電性接着シート、および配線デバイス Download PDF

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Publication number
JP5892282B1
JP5892282B1 JP2015090211A JP2015090211A JP5892282B1 JP 5892282 B1 JP5892282 B1 JP 5892282B1 JP 2015090211 A JP2015090211 A JP 2015090211A JP 2015090211 A JP2015090211 A JP 2015090211A JP 5892282 B1 JP5892282 B1 JP 5892282B1
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Prior art keywords
conductive adhesive
conductive
parts
silane coupling
resin
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JP2015090211A
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Japanese (ja)
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JP2016204567A (ja
Inventor
努 早坂
努 早坂
聡 西之原
聡 西之原
英宣 小林
英宣 小林
和規 松戸
和規 松戸
加奈子 山田
加奈子 山田
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Artience Co Ltd
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Toyo Ink SC Holdings Co Ltd
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Application filed by Toyo Ink SC Holdings Co Ltd filed Critical Toyo Ink SC Holdings Co Ltd
Priority to JP2015090211A priority Critical patent/JP5892282B1/ja
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Publication of JP5892282B1 publication Critical patent/JP5892282B1/ja
Priority to KR1020160049070A priority patent/KR101789082B1/ko
Priority to TW105112902A priority patent/TWI621686B/zh
Priority to CN201610266764.4A priority patent/CN106085274B/zh
Publication of JP2016204567A publication Critical patent/JP2016204567A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/08—Polyurethanes from polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
JP2015090211A 2015-04-27 2015-04-27 導電性接着剤、導電性接着シート、および配線デバイス Active JP5892282B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015090211A JP5892282B1 (ja) 2015-04-27 2015-04-27 導電性接着剤、導電性接着シート、および配線デバイス
KR1020160049070A KR101789082B1 (ko) 2015-04-27 2016-04-22 도전성 접착제, 도전성 접착 시트, 및 배선 디바이스
TW105112902A TWI621686B (zh) 2015-04-27 2016-04-26 導電性接著劑、導電性接著片及配線元件
CN201610266764.4A CN106085274B (zh) 2015-04-27 2016-04-26 导电性粘合剂、导电性粘合片及配线元件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015090211A JP5892282B1 (ja) 2015-04-27 2015-04-27 導電性接着剤、導電性接着シート、および配線デバイス

Related Child Applications (1)

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JP2016017663A Division JP6508078B2 (ja) 2016-02-02 2016-02-02 導電性接着剤、導電性接着シート、および配線デバイス

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JP5892282B1 true JP5892282B1 (ja) 2016-03-23
JP2016204567A JP2016204567A (ja) 2016-12-08

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JP (1) JP5892282B1 (zh)
KR (1) KR101789082B1 (zh)
CN (1) CN106085274B (zh)
TW (1) TWI621686B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016204628A (ja) * 2016-02-02 2016-12-08 東洋インキＳｃホールディングス株式会社 導電性接着剤、導電性接着シート、および配線デバイス
KR20180016270A (ko) * 2016-08-05 2018-02-14 후지모리 고교 가부시키가이샤 Fpc용 도전성 접착 시트 및 fpc
JP2018078263A (ja) * 2016-11-09 2018-05-17 エヌトリウム インコーポレイテッド 電磁波遮蔽用電子部品パッケージ、およびその製造方法
US10800949B1 (en) * 2019-04-02 2020-10-13 National Chung-Shan Institute Of Science And Technology Development of graphene composite conductive ink formulation technology

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CN110121533B (zh) * 2017-02-06 2022-06-21 尤尼吉可株式会社 聚酯树脂组合物、粘接剂和层叠体
JP6388064B2 (ja) * 2017-02-10 2018-09-12 東洋インキＳｃホールディングス株式会社 電子部品搭載基板、積層体、電磁波遮蔽シートおよび電子機器
WO2018147355A1 (ja) * 2017-02-10 2018-08-16 東洋インキＳｃホールディングス株式会社 部品搭載基板およびその製造方法、積層体、電磁波遮蔽シートおよび電子機器
TWI727167B (zh) * 2017-08-07 2021-05-11 日商拓自達電線股份有限公司 導電性接著劑
TWI713845B (zh) * 2017-08-07 2020-12-21 日商拓自達電線股份有限公司 導電性接著劑
CN109959475B (zh) * 2017-12-22 2021-11-23 南昌欧菲显示科技有限公司 导电薄膜及薄膜电阻应变式压力传感器
TWI796476B (zh) * 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片
JP6904464B2 (ja) * 2019-06-12 2021-07-14 東洋インキＳｃホールディングス株式会社 プリント配線板
JP2021105135A (ja) * 2019-12-26 2021-07-26 住友金属鉱山株式会社 熱伝導性組成物
KR20230113757A (ko) * 2020-12-10 2023-08-01 아지노모토 가부시키가이샤 도전성 접착 필름
TW202344182A (zh) * 2022-03-29 2023-11-01 日商拓自達電線股份有限公司 電磁波屏蔽膜
WO2024101068A1 (ja) * 2022-11-08 2024-05-16 東亞合成株式会社 樹脂組成物、接着剤組成物、接着剤層付き積層体、カバーレイフィルム、ボンディングシート、電磁波シールド材、複合体、ポリウレタン及び組成物

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JP2004052044A (ja) * 2002-07-19 2004-02-19 Mitsui Mining & Smelting Co Ltd 銀コート銅粉及びその製造方法
JP2004217952A (ja) * 2003-01-09 2004-08-05 Mitsui Mining & Smelting Co Ltd 表面処理銅粉並びにその表面処理銅粉の製造方法及びその表面処理銅粉を用いた導電性ペースト
JP2005281494A (ja) * 2004-03-30 2005-10-13 Yokohama Rubber Co Ltd:The 光学材料用接着剤組成物
JP2007211040A (ja) * 2006-02-07 2007-08-23 Auto Kagaku Kogyo Kk 一液型湿気硬化性組成物、シーリング材組成物及び接着剤組成物
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JP2012211256A (ja) * 2011-03-31 2012-11-01 Toyo Ink Sc Holdings Co Ltd 導電性樹脂組成物および導電性接着シ−ト
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JP4825830B2 (ja) 2008-03-11 2011-11-30 住友電気工業株式会社 金属補強板を備えたフレキシブルプリント配線板

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Publication number Priority date Publication date Assignee Title
JP2004052044A (ja) * 2002-07-19 2004-02-19 Mitsui Mining & Smelting Co Ltd 銀コート銅粉及びその製造方法
JP2004217952A (ja) * 2003-01-09 2004-08-05 Mitsui Mining & Smelting Co Ltd 表面処理銅粉並びにその表面処理銅粉の製造方法及びその表面処理銅粉を用いた導電性ペースト
JP2005281494A (ja) * 2004-03-30 2005-10-13 Yokohama Rubber Co Ltd:The 光学材料用接着剤組成物
JP2007211040A (ja) * 2006-02-07 2007-08-23 Auto Kagaku Kogyo Kk 一液型湿気硬化性組成物、シーリング材組成物及び接着剤組成物
JP2009110913A (ja) * 2007-10-30 2009-05-21 Cheil Industries Inc 半熱硬化性異方導電性フィルム組成物
JP2009290195A (ja) * 2008-04-30 2009-12-10 Toyo Ink Mfg Co Ltd 硬化性電磁波シールド性接着性フィルムおよびその製造方法
JP2012211256A (ja) * 2011-03-31 2012-11-01 Toyo Ink Sc Holdings Co Ltd 導電性樹脂組成物および導電性接着シ−ト
WO2012164925A1 (ja) * 2011-05-31 2012-12-06 東洋インキＳｃホールディングス株式会社 導電性シート及びその製造方法、並びに電子部品
WO2014010524A1 (ja) * 2012-07-11 2014-01-16 タツタ電線株式会社 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016204628A (ja) * 2016-02-02 2016-12-08 東洋インキＳｃホールディングス株式会社 導電性接着剤、導電性接着シート、および配線デバイス
KR20180016270A (ko) * 2016-08-05 2018-02-14 후지모리 고교 가부시키가이샤 Fpc용 도전성 접착 시트 및 fpc
KR101970484B1 (ko) * 2016-08-05 2019-04-19 후지모리 고교 가부시키가이샤 Fpc용 도전성 접착 시트 및 fpc
KR20190042510A (ko) * 2016-08-05 2019-04-24 후지모리 고교 가부시키가이샤 Fpc용 도전성 접착 시트 및 fpc
KR102088165B1 (ko) * 2016-08-05 2020-03-12 후지모리 고교 가부시키가이샤 Fpc용 도전성 접착 시트 및 fpc
JP2018078263A (ja) * 2016-11-09 2018-05-17 エヌトリウム インコーポレイテッド 電磁波遮蔽用電子部品パッケージ、およびその製造方法
US10800949B1 (en) * 2019-04-02 2020-10-13 National Chung-Shan Institute Of Science And Technology Development of graphene composite conductive ink formulation technology

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