JP5870923B2 - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP5870923B2
JP5870923B2 JP2012529551A JP2012529551A JP5870923B2 JP 5870923 B2 JP5870923 B2 JP 5870923B2 JP 2012529551 A JP2012529551 A JP 2012529551A JP 2012529551 A JP2012529551 A JP 2012529551A JP 5870923 B2 JP5870923 B2 JP 5870923B2
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light
light emitting
emitting device
manufacturing
nozzle
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Expired - Fee Related
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JP2012529551A
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Japanese (ja)
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JPWO2012023424A1 (ja
Inventor
小嶋　健
健 小嶋
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Konica Minolta Inc
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Konica Minolta Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

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  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2012529551A 2010-08-17 2011-08-02 発光装置の製造方法 Expired - Fee Related JP5870923B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012529551A JP5870923B2 (ja) 2010-08-17 2011-08-02 発光装置の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010182211 2010-08-17
JP2010182211 2010-08-17
JP2012529551A JP5870923B2 (ja) 2010-08-17 2011-08-02 発光装置の製造方法
PCT/JP2011/067634 WO2012023424A1 (ja) 2010-08-17 2011-08-02 発光装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2012023424A1 JPWO2012023424A1 (ja) 2013-10-28
JP5870923B2 true JP5870923B2 (ja) 2016-03-01

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Family Applications (3)

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JP2012529551A Expired - Fee Related JP5870923B2 (ja) 2010-08-17 2011-08-02 発光装置の製造方法
JP2012529552A Expired - Fee Related JP5299577B2 (ja) 2010-08-17 2011-08-02 発光装置の製造方法
JP2013129097A Expired - Fee Related JP5900425B2 (ja) 2010-08-17 2013-06-20 発光装置の製造方法

Family Applications After (2)

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JP2012529552A Expired - Fee Related JP5299577B2 (ja) 2010-08-17 2011-08-02 発光装置の製造方法
JP2013129097A Expired - Fee Related JP5900425B2 (ja) 2010-08-17 2013-06-20 発光装置の製造方法

Country Status (6)

Country Link
US (3) US8835192B2 (https=)
EP (1) EP2608284A1 (https=)
JP (3) JP5870923B2 (https=)
KR (1) KR101478472B1 (https=)
CN (2) CN104576899A (https=)
WO (2) WO2012023424A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5310699B2 (ja) * 2010-10-27 2013-10-09 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
JP5310700B2 (ja) * 2010-10-27 2013-10-09 パナソニック株式会社 Ｌｅｄパッケージ製造システムおよびｌｅｄパッケージ製造システムにおける樹脂塗布方法
US9260654B2 (en) * 2011-03-11 2016-02-16 Konica Minolta, Inc. Manufacturing method for light emitting device and phosphor mixture
JP5413404B2 (ja) * 2011-05-30 2014-02-12 パナソニック株式会社 Ｌｅｄパッケージ製造システムおよびｌｅｄパッケージ製造システムにおける樹脂塗布方法
JP5413405B2 (ja) 2011-05-30 2014-02-12 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
US9318646B2 (en) 2011-10-07 2016-04-19 Konica Minolta, Inc. LED device manufacturing method and fluorescent material-dispersed solution used in same
WO2013121646A1 (ja) * 2012-02-16 2013-08-22 コニカミノルタ株式会社 発光装置の製造方法及び蛍光体塗布装置
JP2013258339A (ja) * 2012-06-13 2013-12-26 Konica Minolta Inc 発光装置及びその製造方法
EP2853577A4 (en) 2012-08-13 2016-01-06 Konica Minolta Inc METHOD FOR PRODUCING A PHOSPHORDISPERSION LIQUID AND METHOD FOR PRODUCING AN LED DEVICE
DE102012112316A1 (de) * 2012-12-14 2014-06-18 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Herstellung eines Strahlung emittierenden Halbleiterbauelements und Strahlung emittierendes Halbleiterbauelement
JP5994628B2 (ja) * 2012-12-26 2016-09-21 日亜化学工業株式会社 発光装置の製造方法およびスプレーコーティング装置
EP2940744A4 (en) * 2012-12-27 2016-06-29 Konica Minolta Inc PHOSPHORDISPERSION, LED DEVICE AND METHOD FOR THE PRODUCTION THEREOF
WO2014199926A1 (ja) * 2013-06-13 2014-12-18 旭硝子株式会社 蛍光体分散シートの色度座標検査方法、蛍光体分散シートの製造方法、光変換部材の製造方法およびｌｅｄパッケージの製造方法
KR101474376B1 (ko) * 2013-11-28 2014-12-18 주식회사 말콤 온도표시기능을 구비하는 led패키지용 시린지 및 이를 이용하는 led패키지 제조방법
CN103840068B (zh) * 2013-12-31 2017-09-19 杨毅 波长转换装置和发光装置
TWI575778B (zh) * 2014-05-07 2017-03-21 新世紀光電股份有限公司 發光二極體封裝結構
KR102237112B1 (ko) * 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
KR20180011398A (ko) 2016-07-21 2018-02-01 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN107611241A (zh) * 2017-10-23 2018-01-19 苏州创思得新材料有限公司 一种多相复合的Re,Ce:YAG陶瓷荧光片及其制备方法
KR102053614B1 (ko) * 2018-06-19 2019-12-09 주식회사 네모엘텍 퀀텀닷 led 조명 및 제조 장치
CN108962798B (zh) * 2018-08-03 2024-07-05 华南理工大学 三基色rgb-led全自动荧光粉胶高速智能涂覆设备及方法
JP7711143B2 (ja) 2023-10-20 2025-07-22 Ckd株式会社 Ｌｅｄ検査装置及びｌｅｄ製造装置並びにｌｅｄ検査方法及びｌｅｄ製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11106685A (ja) * 1997-10-02 1999-04-20 Nemoto Tokushu Kagaku Kk 蓄光性塗料及びこの塗料を用いた表示体
JPH11251640A (ja) * 1998-02-27 1999-09-17 Sanken Electric Co Ltd 半導体発光装置
JP2001181614A (ja) * 1999-12-24 2001-07-03 Teikoku Tsushin Kogyo Co Ltd Ｅｌ素子用蛍光体ペースト及びその製造方法
JP2004153109A (ja) * 2002-10-31 2004-05-27 Matsushita Electric Works Ltd 発光装置及びその製造方法
JP2007123417A (ja) * 2005-10-26 2007-05-17 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2008227458A (ja) * 2007-03-13 2008-09-25 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージの製造方法。
JP2009256670A (ja) * 2008-03-28 2009-11-05 Mitsubishi Chemicals Corp 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置
JP2010080588A (ja) * 2008-09-25 2010-04-08 Fujikura Ltd 発光装置の製造方法および製造装置

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JP3614776B2 (ja) 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
JP4101468B2 (ja) 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
WO2003034508A1 (fr) * 2001-10-12 2003-04-24 Nichia Corporation Dispositif d'emission de lumiere et procede de fabrication de celui-ci
US6789874B1 (en) * 2003-02-28 2004-09-14 Eastman Kodak Company Method of cleaning nozzles in inkjet printhead
JP2005064233A (ja) * 2003-08-12 2005-03-10 Stanley Electric Co Ltd 波長変換型ｌｅｄ
JP4451178B2 (ja) 2004-03-25 2010-04-14 スタンレー電気株式会社 発光デバイス
JP5167582B2 (ja) * 2005-10-28 2013-03-21 住友大阪セメント株式会社 ジルコニア透明分散液及び透明複合体並びに透明複合体の製造方法
KR101408450B1 (ko) 2007-03-28 2014-06-17 가부시키가이샤 구라레 Ｍ-ｃ-ｎ-ｏ계 형광체
CN101494271A (zh) * 2009-02-20 2009-07-29 隆达电子股份有限公司 发光二极管装置的制造方法及喷涂设备

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11106685A (ja) * 1997-10-02 1999-04-20 Nemoto Tokushu Kagaku Kk 蓄光性塗料及びこの塗料を用いた表示体
JPH11251640A (ja) * 1998-02-27 1999-09-17 Sanken Electric Co Ltd 半導体発光装置
JP2001181614A (ja) * 1999-12-24 2001-07-03 Teikoku Tsushin Kogyo Co Ltd Ｅｌ素子用蛍光体ペースト及びその製造方法
JP2004153109A (ja) * 2002-10-31 2004-05-27 Matsushita Electric Works Ltd 発光装置及びその製造方法
JP2007123417A (ja) * 2005-10-26 2007-05-17 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2008227458A (ja) * 2007-03-13 2008-09-25 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージの製造方法。
JP2009256670A (ja) * 2008-03-28 2009-11-05 Mitsubishi Chemicals Corp 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置
JP2010080588A (ja) * 2008-09-25 2010-04-08 Fujikura Ltd 発光装置の製造方法および製造装置

Also Published As

Publication number Publication date
WO2012023424A1 (ja) 2012-02-23
JP5900425B2 (ja) 2016-04-06
JP5299577B2 (ja) 2013-09-25
JPWO2012023424A1 (ja) 2013-10-28
US20140349419A1 (en) 2014-11-27
KR101478472B1 (ko) 2014-12-31
WO2012023425A1 (ja) 2012-02-23
US8835192B2 (en) 2014-09-16
CN103081142B (zh) 2015-01-14
KR20130028148A (ko) 2013-03-18
US9306130B2 (en) 2016-04-05
CN104576899A (zh) 2015-04-29
CN103081142A (zh) 2013-05-01
US20130143343A1 (en) 2013-06-06
EP2608284A1 (en) 2013-06-26
US20130149801A1 (en) 2013-06-13
JPWO2012023425A1 (ja) 2013-10-28
US9153752B2 (en) 2015-10-06
JP2013229621A (ja) 2013-11-07

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