JP5865771B2 - 多層配線基板 - Google Patents
多層配線基板 Download PDFInfo
- Publication number
- JP5865771B2 JP5865771B2 JP2012101907A JP2012101907A JP5865771B2 JP 5865771 B2 JP5865771 B2 JP 5865771B2 JP 2012101907 A JP2012101907 A JP 2012101907A JP 2012101907 A JP2012101907 A JP 2012101907A JP 5865771 B2 JP5865771 B2 JP 5865771B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- conformal
- layer
- hole
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012101907A JP5865771B2 (ja) | 2012-04-26 | 2012-04-26 | 多層配線基板 |
PCT/JP2013/001885 WO2013161181A1 (ja) | 2012-04-26 | 2013-03-20 | 多層配線基板 |
KR1020147011034A KR101579019B1 (ko) | 2012-04-26 | 2013-03-20 | 다층배선기판 |
CN201380003001.5A CN103797902A (zh) | 2012-04-26 | 2013-03-20 | 多层布线基板 |
US14/240,153 US9066419B2 (en) | 2012-04-26 | 2013-03-20 | Multilayer wiring substrate |
TW102114752A TW201401964A (zh) | 2012-04-26 | 2013-04-25 | 多層配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012101907A JP5865771B2 (ja) | 2012-04-26 | 2012-04-26 | 多層配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013229525A JP2013229525A (ja) | 2013-11-07 |
JP5865771B2 true JP5865771B2 (ja) | 2016-02-17 |
Family
ID=49482538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012101907A Expired - Fee Related JP5865771B2 (ja) | 2012-04-26 | 2012-04-26 | 多層配線基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9066419B2 (zh) |
JP (1) | JP5865771B2 (zh) |
KR (1) | KR101579019B1 (zh) |
CN (1) | CN103797902A (zh) |
TW (1) | TW201401964A (zh) |
WO (1) | WO2013161181A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105247972A (zh) * | 2013-04-26 | 2016-01-13 | 株式会社电装 | 多层基板、使用多层基板的电子装置、多层基板的制造方法、基板以及使用基板的电子装置 |
JP2015159240A (ja) * | 2014-02-25 | 2015-09-03 | 矢崎総業株式会社 | フレキシブルフラット回路体 |
KR20190012485A (ko) * | 2017-07-27 | 2019-02-11 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
KR102531762B1 (ko) | 2017-09-29 | 2023-05-12 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
US10347507B2 (en) * | 2017-09-29 | 2019-07-09 | Lg Innotek Co., Ltd. | Printed circuit board |
CN112514544B (zh) * | 2018-07-31 | 2024-04-19 | 京瓷株式会社 | 印刷布线板及印刷布线板的制造方法 |
JP7159059B2 (ja) * | 2019-01-09 | 2022-10-24 | 新光電気工業株式会社 | 積層基板及び積層基板製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1027968A (ja) * | 1996-07-09 | 1998-01-27 | Kyocera Corp | 多層配線基板 |
JP3645780B2 (ja) * | 2000-03-10 | 2005-05-11 | Necインフロンティア株式会社 | ビルドアップ多層プリント配線板とその製造方法 |
EP1357773A3 (en) * | 2002-04-25 | 2005-11-30 | Matsushita Electric Industrial Co., Ltd. | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
JP4323303B2 (ja) * | 2003-12-17 | 2009-09-02 | 株式会社フジクラ | 基板の製造方法 |
JP2006093438A (ja) * | 2004-09-24 | 2006-04-06 | Denso Corp | プリント基板及びその製造方法 |
JP5021216B2 (ja) * | 2006-02-22 | 2012-09-05 | イビデン株式会社 | プリント配線板およびその製造方法 |
JP4267660B2 (ja) | 2006-12-05 | 2009-05-27 | 日本特殊陶業株式会社 | 多層配線基板及び素子搭載装置 |
JP5284147B2 (ja) * | 2008-03-13 | 2013-09-11 | 日本特殊陶業株式会社 | 多層配線基板 |
US8431833B2 (en) * | 2008-12-29 | 2013-04-30 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
US8304657B2 (en) | 2010-03-25 | 2012-11-06 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
-
2012
- 2012-04-26 JP JP2012101907A patent/JP5865771B2/ja not_active Expired - Fee Related
-
2013
- 2013-03-20 CN CN201380003001.5A patent/CN103797902A/zh active Pending
- 2013-03-20 WO PCT/JP2013/001885 patent/WO2013161181A1/ja active Application Filing
- 2013-03-20 KR KR1020147011034A patent/KR101579019B1/ko not_active IP Right Cessation
- 2013-03-20 US US14/240,153 patent/US9066419B2/en not_active Expired - Fee Related
- 2013-04-25 TW TW102114752A patent/TW201401964A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US9066419B2 (en) | 2015-06-23 |
KR20140065474A (ko) | 2014-05-29 |
WO2013161181A1 (ja) | 2013-10-31 |
KR101579019B1 (ko) | 2015-12-18 |
US20140216796A1 (en) | 2014-08-07 |
TW201401964A (zh) | 2014-01-01 |
CN103797902A (zh) | 2014-05-14 |
JP2013229525A (ja) | 2013-11-07 |
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