JP5863643B2 - 冷却される電子システム - Google Patents

冷却される電子システム Download PDF

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Publication number
JP5863643B2
JP5863643B2 JP2012510362A JP2012510362A JP5863643B2 JP 5863643 B2 JP5863643 B2 JP 5863643B2 JP 2012510362 A JP2012510362 A JP 2012510362A JP 2012510362 A JP2012510362 A JP 2012510362A JP 5863643 B2 JP5863643 B2 JP 5863643B2
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Prior art keywords
coolant
conductive surface
heat
passage
heat transfer
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JP2012510362A
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English (en)
Japanese (ja)
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JP2012527109A5 (enExample
JP2012527109A (ja
Inventor
ダニエル チェスター
ダニエル チェスター
ピーター ホプトン
ピーター ホプトン
ジェーソン ベント
ジェーソン ベント
キース ディーキン
キース ディーキン
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アイセオトープ リミテッド
アイセオトープ リミテッド
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Priority claimed from GB0908156A external-priority patent/GB2467805C/en
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Publication of JP2012527109A publication Critical patent/JP2012527109A/ja
Publication of JP2012527109A5 publication Critical patent/JP2012527109A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012510362A 2009-05-12 2010-05-12 冷却される電子システム Active JP5863643B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US17754809P 2009-05-12 2009-05-12
GB0908156.3 2009-05-12
US61/177,548 2009-05-12
GB0908156A GB2467805C (en) 2009-05-12 2009-05-12 Cooled electronic system
PCT/GB2010/000950 WO2010130993A2 (en) 2009-05-12 2010-05-12 Cooled electronic system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015189870A Division JP6485808B2 (ja) 2009-05-12 2015-09-28 冷却される電子システム

Publications (3)

Publication Number Publication Date
JP2012527109A JP2012527109A (ja) 2012-11-01
JP2012527109A5 JP2012527109A5 (enExample) 2013-06-27
JP5863643B2 true JP5863643B2 (ja) 2016-02-16

Family

ID=42357687

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2012510362A Active JP5863643B2 (ja) 2009-05-12 2010-05-12 冷却される電子システム
JP2015189870A Active JP6485808B2 (ja) 2009-05-12 2015-09-28 冷却される電子システム
JP2017146149A Active JP6604999B2 (ja) 2009-05-12 2017-07-28 冷却される電子システム

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015189870A Active JP6485808B2 (ja) 2009-05-12 2015-09-28 冷却される電子システム
JP2017146149A Active JP6604999B2 (ja) 2009-05-12 2017-07-28 冷却される電子システム

Country Status (4)

Country Link
EP (2) EP2430893B1 (enExample)
JP (3) JP5863643B2 (enExample)
CN (3) CN110072368B (enExample)
WO (1) WO2010130993A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR101821931B1 (ko) * 2017-08-22 2018-01-24 제니퍼 동 데이터 센터를 위한 랙 마운트 서버 냉각 시스템

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Publication number Priority date Publication date Assignee Title
KR101821931B1 (ko) * 2017-08-22 2018-01-24 제니퍼 동 데이터 센터를 위한 랙 마운트 서버 냉각 시스템

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Publication number Publication date
EP2430893A2 (en) 2012-03-21
EP3846601B1 (en) 2024-12-11
JP2017204300A (ja) 2017-11-16
JP2016015167A (ja) 2016-01-28
CN110072368B (zh) 2021-09-28
WO2010130993A2 (en) 2010-11-18
CN105491858A (zh) 2016-04-13
JP6604999B2 (ja) 2019-11-13
EP2430893B1 (en) 2020-12-16
CN105491858B (zh) 2018-12-18
JP2012527109A (ja) 2012-11-01
CN110072368A (zh) 2019-07-30
WO2010130993A3 (en) 2011-04-28
CN102626006B (zh) 2016-02-03
JP6485808B2 (ja) 2019-03-20
EP3846601A1 (en) 2021-07-07
CN102626006A (zh) 2012-08-01

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