IT1401386B1 - Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni - Google Patents

Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni

Info

Publication number
IT1401386B1
IT1401386B1 ITUD2010A000157A ITUD20100157A IT1401386B1 IT 1401386 B1 IT1401386 B1 IT 1401386B1 IT UD2010A000157 A ITUD2010A000157 A IT UD2010A000157A IT UD20100157 A ITUD20100157 A IT UD20100157A IT 1401386 B1 IT1401386 B1 IT 1401386B1
Authority
IT
Italy
Prior art keywords
cooling device
high performance
processing units
liquid cooling
performance processing
Prior art date
Application number
ITUD2010A000157A
Other languages
English (en)
Inventor
Giampietro Tecchiolli
Pierfrancesco Zuccato
Mauro Rossi
Original Assignee
Eurotech S P A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eurotech S P A filed Critical Eurotech S P A
Priority to ITUD2010A000157A priority Critical patent/IT1401386B1/it
Priority to US13/813,192 priority patent/US9253920B2/en
Priority to PCT/IB2011/001755 priority patent/WO2012014058A1/en
Priority to EP11761118.6A priority patent/EP2599371B1/en
Priority to JP2013521241A priority patent/JP5877834B2/ja
Publication of ITUD20100157A1 publication Critical patent/ITUD20100157A1/it
Application granted granted Critical
Publication of IT1401386B1 publication Critical patent/IT1401386B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
ITUD2010A000157A 2010-07-30 2010-07-30 Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni IT1401386B1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITUD2010A000157A IT1401386B1 (it) 2010-07-30 2010-07-30 Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni
US13/813,192 US9253920B2 (en) 2010-07-30 2011-07-29 Cooling device with liquid for electronic cards, in particular for high performance processing units
PCT/IB2011/001755 WO2012014058A1 (en) 2010-07-30 2011-07-29 Cooling device with liquid for electronic cards, in particular for high performance processing units
EP11761118.6A EP2599371B1 (en) 2010-07-30 2011-07-29 Cooling device with liquid for electronic cards, in particular for high performance processing units
JP2013521241A JP5877834B2 (ja) 2010-07-30 2011-07-29 特に高性能処理装置用の電子カードのための液体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2010A000157A IT1401386B1 (it) 2010-07-30 2010-07-30 Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni

Publications (2)

Publication Number Publication Date
ITUD20100157A1 ITUD20100157A1 (it) 2012-01-31
IT1401386B1 true IT1401386B1 (it) 2013-07-18

Family

ID=43639875

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2010A000157A IT1401386B1 (it) 2010-07-30 2010-07-30 Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni

Country Status (5)

Country Link
US (1) US9253920B2 (it)
EP (1) EP2599371B1 (it)
JP (1) JP5877834B2 (it)
IT (1) IT1401386B1 (it)
WO (1) WO2012014058A1 (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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CN102711414B (zh) 2012-04-20 2015-07-08 华为技术有限公司 一种液冷装置
US9144178B2 (en) * 2013-03-01 2015-09-22 International Business Machines Corporation Selective clamping of electronics card to coolant-cooled structure
ITVI20130273A1 (it) * 2013-11-14 2015-05-15 Eurotech S P A Scheda elettronica per supercalcolo refrigerata e procedimento per produrla
ITUD20130151A1 (it) * 2013-11-15 2015-05-16 Eurotech S P A Architettura di supercalcolo modulare
US20170303431A1 (en) * 2014-11-22 2017-10-19 Gerald Ho Kim Silicon Cooling Plate With An Integrated PCB
JP6717080B2 (ja) * 2016-06-30 2020-07-01 富士通株式会社 情報処理装置、及び冷却ユニット
IT201700034642A1 (it) * 2017-03-29 2018-09-29 Poseico S P A Piastra di raffreddamento per circuiti di elettronica di potenza e combinazione di circuito di elettronica di potenza con detta piastra
JP6888469B2 (ja) 2017-08-04 2021-06-16 富士通株式会社 情報処理装置
CN108495516B (zh) * 2018-04-26 2023-12-19 湖北三江航天万峰科技发展有限公司 一种基于流体介质散热的板卡组件及安装板卡组件的设备
US10869403B2 (en) * 2018-09-17 2020-12-15 Quanta Computer Inc. Elastomer design for computing device chassis
US10782749B2 (en) 2018-10-10 2020-09-22 Hewlett Packard Enterprise Development Lp Compute assembly for high speed ultra dense compute blades
EP3730348A1 (en) * 2019-04-25 2020-10-28 Volkswagen Aktiengesellschaft Automobile electronic system
DE102020208053A1 (de) * 2020-04-03 2021-10-07 Volkswagen Aktiengesellschaft Fahrzeug, zentrale recheneinheit, module, herstellungsverfahren und fahrzeug, kühllamelle, taschenmodul, hauptrahmen
CN115399083A (zh) * 2020-04-03 2022-11-25 大众汽车股份公司 载具及用于安装和连接载具部件的主框架

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US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
US4268850A (en) * 1979-05-11 1981-05-19 Electric Power Research Institute Forced vaporization heat sink for semiconductor devices
JPS58180692A (ja) 1982-04-10 1983-10-22 高橋　勝昭 パルプ材の脱リグニン方法
JPS58180692U (ja) * 1982-05-27 1983-12-02 住友電気工業株式会社 プリント板
JPH02166755A (ja) 1988-12-21 1990-06-27 Nec Corp 伝熱シート
US5177666A (en) * 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
US5414592A (en) * 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
EP0701455B1 (en) * 1993-06-04 2001-03-14 Biotime, Inc. Plasma-like solution
JP2001177017A (ja) * 1999-12-15 2001-06-29 Hitachi Ltd 電子機器冷却装置
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6807056B2 (en) 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
JP2004246615A (ja) * 2003-02-13 2004-09-02 Hitachi Ltd 電子装置とその筐体、並びにそのための電子モジュール
JP2005191474A (ja) * 2003-12-26 2005-07-14 Honda Motor Co Ltd 回路基板の冷却装置
FI117590B (fi) * 2004-06-11 2006-11-30 Abb Oy Jäähdytyselementti
JP2006165186A (ja) * 2004-12-06 2006-06-22 Mitsubishi Electric Corp パワー半導体装置
CA2575817A1 (en) 2005-03-25 2006-10-05 Mitsubishi Electric Corporation Cooling structure of power conversion equipment
US7312987B1 (en) * 2005-12-09 2007-12-25 Storage Technology Corporation Adaptable thin plate modular heat exchanger blade for cooling electronic equipment
US20070177356A1 (en) 2006-02-01 2007-08-02 Jeffrey Panek Three-dimensional cold plate and method of manufacturing same
WO2010130993A2 (en) * 2009-05-12 2010-11-18 Iceotope Limited Cooled electronic system
US7978472B2 (en) * 2009-06-10 2011-07-12 International Business Machines Corporation Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
US7961465B2 (en) * 2009-07-14 2011-06-14 International Business Machines Corporation Low cost liquid cooling

Also Published As

Publication number Publication date
WO2012014058A1 (en) 2012-02-02
US20130128460A1 (en) 2013-05-23
EP2599371A1 (en) 2013-06-05
EP2599371B1 (en) 2017-09-20
JP2013533635A (ja) 2013-08-22
JP5877834B2 (ja) 2016-03-08
ITUD20100157A1 (it) 2012-01-31
US9253920B2 (en) 2016-02-02

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