JP5850056B2 - 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス - Google Patents

樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス Download PDF

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Publication number
JP5850056B2
JP5850056B2 JP2013530974A JP2013530974A JP5850056B2 JP 5850056 B2 JP5850056 B2 JP 5850056B2 JP 2013530974 A JP2013530974 A JP 2013530974A JP 2013530974 A JP2013530974 A JP 2013530974A JP 5850056 B2 JP5850056 B2 JP 5850056B2
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Japan
Prior art keywords
resin
epoxy resin
resin sheet
cured
resin composition
Prior art date
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Active
Application number
JP2013530974A
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English (en)
Japanese (ja)
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JPWO2013030998A1 (ja
Inventor
高橋　裕之
裕之 高橋
智雄 西山
智雄 西山
敏明 白坂
敏明 白坂
桑野　敦司
敦司 桑野
竹澤　由高
由高 竹澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Publication of JPWO2013030998A1 publication Critical patent/JPWO2013030998A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
JP2013530974A 2011-08-31 2011-08-31 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス Active JP5850056B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/069845 WO2013030998A1 (ja) 2011-08-31 2011-08-31 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015237364A Division JP6222209B2 (ja) 2015-12-04 2015-12-04 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2013030998A1 JPWO2013030998A1 (ja) 2015-03-23
JP5850056B2 true JP5850056B2 (ja) 2016-02-03

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JP2013530974A Active JP5850056B2 (ja) 2011-08-31 2011-08-31 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス

Country Status (5)

Country Link
JP (1) JP5850056B2 (zh)
KR (3) KR102081876B1 (zh)
CN (1) CN103764713B (zh)
TW (2) TWI548692B (zh)
WO (1) WO2013030998A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016104862A (ja) * 2015-12-04 2016-06-09 日立化成株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス

Families Citing this family (14)

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JP5373215B1 (ja) * 2013-03-28 2013-12-18 日東電工株式会社 システム、製造条件決定装置および製造管理装置
CN103959488B (zh) * 2013-03-28 2015-09-30 日东电工株式会社 系统、制造条件决定装置以及制造管理装置
CN105895788A (zh) * 2014-05-08 2016-08-24 罗冠杰 片式白光发光二极管、制备片式白光发光二极管的方法及封装胶材
WO2016002846A1 (ja) * 2014-07-02 2016-01-07 住友ベークライト株式会社 半導体装置
JP6536045B2 (ja) * 2015-01-28 2019-07-03 日立化成株式会社 樹脂組成物、樹脂シート及び樹脂シート硬化物
JP6616344B2 (ja) * 2017-03-24 2019-12-04 株式会社豊田中央研究所 熱伝導性複合材料
CN107958857B (zh) * 2017-11-28 2024-03-19 北方电子研究院安徽有限公司 一种压块触发装置和环氧树脂真空低压封装工艺方法
EP3816237A4 (en) * 2018-06-26 2022-03-23 Kyocera Corporation ORGANIC SUBSTRATE, METAL CLAD LAMINATE AND TERMINAL BOARD
EP3858885B1 (en) * 2018-09-28 2024-05-08 FUJIFILM Corporation Composition for forming heat conductive materials, heat conductive material, heat conductive sheet, device with heat conductive layer, and film
EP3733753A1 (en) * 2019-05-03 2020-11-04 3M Innovative Properties Company Film usable for roll-to-roll processing of flexible electronic devices comprising a composite material of a polymer and boron nitride
JP7424168B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP7424167B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
WO2023189609A1 (ja) * 2022-03-31 2023-10-05 デンカ株式会社 樹脂組成物、絶縁性樹脂硬化体、積層体、及び回路基板
WO2023189610A1 (ja) * 2022-03-31 2023-10-05 デンカ株式会社 樹脂組成物、絶縁性樹脂硬化体、積層体、及び回路基板

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JPH03258829A (ja) * 1990-03-07 1991-11-19 Mitsui Toatsu Chem Inc 高耐熱性エポキシ樹脂組成物
JPH03258830A (ja) * 1990-03-08 1991-11-19 Mitsui Toatsu Chem Inc 半導体封止用エポキシ樹脂組成物
JP3151826B2 (ja) * 1990-11-07 2001-04-03 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料
JPH09328610A (ja) * 1996-06-12 1997-12-22 Nitto Denko Corp 耐熱樹脂製管状物
US6645612B2 (en) * 2001-08-07 2003-11-11 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
JP5010112B2 (ja) * 2004-07-26 2012-08-29 新神戸電機株式会社 プリプレグの製造法、積層板およびプリント配線板の製造法
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KR101683355B1 (ko) * 2009-09-29 2016-12-06 히타치가세이가부시끼가이샤 다층 수지 시트 및 그 제조 방법, 다층 수지 시트 경화물의 제조 방법, 그리고, 고열전도 수지 시트 적층체 및 그 제조 방법
CN103755921B (zh) * 2009-09-29 2017-06-23 日立化成工业株式会社 树脂组合物、树脂片以及树脂固化物及其制造方法

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JP2016104862A (ja) * 2015-12-04 2016-06-09 日立化成株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス

Also Published As

Publication number Publication date
TW201319158A (zh) 2013-05-16
TW201625735A (zh) 2016-07-16
WO2013030998A1 (ja) 2013-03-07
KR20180012343A (ko) 2018-02-05
KR102081876B1 (ko) 2020-02-26
TWI548692B (zh) 2016-09-11
JPWO2013030998A1 (ja) 2015-03-23
CN103764713B (zh) 2016-08-24
KR101825259B1 (ko) 2018-02-02
KR20140071377A (ko) 2014-06-11
CN103764713A (zh) 2014-04-30
TWI585147B (zh) 2017-06-01
KR20190042109A (ko) 2019-04-23
KR101970771B1 (ko) 2019-04-22

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