JP5832480B2 - 離型フィルム - Google Patents

離型フィルム Download PDF

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Publication number
JP5832480B2
JP5832480B2 JP2013119193A JP2013119193A JP5832480B2 JP 5832480 B2 JP5832480 B2 JP 5832480B2 JP 2013119193 A JP2013119193 A JP 2013119193A JP 2013119193 A JP2013119193 A JP 2013119193A JP 5832480 B2 JP5832480 B2 JP 5832480B2
Authority
JP
Japan
Prior art keywords
release film
film
polybutylene terephthalate
release
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013119193A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014098138A (ja
Inventor
三代　裕介
裕介 三代
清水　勝
勝 清水
健二 志摩
健二 志摩
田口　栄一
栄一 田口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Tohcello Inc
Original Assignee
Mitsui Chemicals Tohcello Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Tohcello Inc
Priority to JP2013119193A priority Critical patent/JP5832480B2/ja
Priority to PCT/JP2013/075248 priority patent/WO2014061392A1/ja
Priority to KR1020157011925A priority patent/KR101764035B1/ko
Priority to CN201380053850.1A priority patent/CN104781318B/zh
Priority to TW102137455A priority patent/TWI602862B/zh
Publication of JP2014098138A publication Critical patent/JP2014098138A/ja
Application granted granted Critical
Publication of JP5832480B2 publication Critical patent/JP5832480B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials Engineering (AREA)
JP2013119193A 2012-10-19 2013-06-05 離型フィルム Active JP5832480B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013119193A JP5832480B2 (ja) 2012-10-19 2013-06-05 離型フィルム
PCT/JP2013/075248 WO2014061392A1 (ja) 2012-10-19 2013-09-19 離型フィルム
KR1020157011925A KR101764035B1 (ko) 2012-10-19 2013-09-19 이형 필름
CN201380053850.1A CN104781318B (zh) 2012-10-19 2013-09-19 脱模膜
TW102137455A TWI602862B (zh) 2012-10-19 2013-10-17 Release film

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012232307 2012-10-19
JP2012232307 2012-10-19
JP2013119193A JP5832480B2 (ja) 2012-10-19 2013-06-05 離型フィルム

Publications (2)

Publication Number Publication Date
JP2014098138A JP2014098138A (ja) 2014-05-29
JP5832480B2 true JP5832480B2 (ja) 2015-12-16

Family

ID=50487967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013119193A Active JP5832480B2 (ja) 2012-10-19 2013-06-05 離型フィルム

Country Status (5)

Country Link
JP (1) JP5832480B2 (zh)
KR (1) KR101764035B1 (zh)
CN (1) CN104781318B (zh)
TW (1) TWI602862B (zh)
WO (1) WO2014061392A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5874768B2 (ja) * 2013-04-30 2016-03-02 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP5874774B2 (ja) * 2013-06-06 2016-03-02 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP6159207B2 (ja) * 2013-09-20 2017-07-05 三井化学東セロ株式会社 多層離型フィルム
JP6481396B2 (ja) * 2015-02-09 2019-03-13 住友ベークライト株式会社 離型フィルム
JP2017205902A (ja) * 2016-05-16 2017-11-24 三井化学東セロ株式会社 多層プリント配線板の製造に好適な離型フィルム
US20220001581A1 (en) * 2018-10-04 2022-01-06 Nitto Denko Corporation Heat-resistant release sheet and thermocompression bonding method
KR102435977B1 (ko) 2020-09-01 2022-08-25 율촌화학 주식회사 엠보 이형 필름 및 그 제조 방법
WO2023132116A1 (ja) * 2022-01-06 2023-07-13 興人フィルム＆ケミカルズ株式会社 離型フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100346703B1 (ko) * 1999-07-29 2002-08-01 삼성전자 주식회사 인쇄기의 광주사시스템 및 그 구동방법
TWI476103B (zh) * 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
JP2007175885A (ja) * 2005-12-27 2007-07-12 Asahi Kasei Chemicals Corp 離型フィルム
JP4992626B2 (ja) * 2007-09-14 2012-08-08 三菱エンジニアリングプラスチックス株式会社 熱プレス成形用離型フィルム
JP4332204B2 (ja) * 2007-09-21 2009-09-16 積水化学工業株式会社 離型フィルム
JP2011088352A (ja) * 2009-10-22 2011-05-06 Unitika Ltd 離型フィルム
JP5790025B2 (ja) * 2010-03-04 2015-10-07 東レ株式会社 二軸延伸ポリエステルフィルム
KR20130018237A (ko) * 2010-03-31 2013-02-20 스미또모 베이크라이트 가부시키가이샤 이형 필름

Also Published As

Publication number Publication date
TW201431661A (zh) 2014-08-16
CN104781318A (zh) 2015-07-15
JP2014098138A (ja) 2014-05-29
WO2014061392A1 (ja) 2014-04-24
TWI602862B (zh) 2017-10-21
CN104781318B (zh) 2018-10-16
KR20150067320A (ko) 2015-06-17
KR101764035B1 (ko) 2017-08-01

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