JP5810914B2 - 基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法 - Google Patents

基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法 Download PDF

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Publication number
JP5810914B2
JP5810914B2 JP2011523552A JP2011523552A JP5810914B2 JP 5810914 B2 JP5810914 B2 JP 5810914B2 JP 2011523552 A JP2011523552 A JP 2011523552A JP 2011523552 A JP2011523552 A JP 2011523552A JP 5810914 B2 JP5810914 B2 JP 5810914B2
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Japan
Prior art keywords
substrate
substrate holder
contact
coupled
coupling member
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Expired - Fee Related
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JP2011523552A
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English (en)
Japanese (ja)
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JPWO2011010452A1 (ja
Inventor
功 菅谷
功 菅谷
純一 長南
純一 長南
栄裕 前田
栄裕 前田
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Nikon Corp
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Nikon Corp
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Priority to JP2011523552A priority Critical patent/JP5810914B2/ja
Publication of JPWO2011010452A1 publication Critical patent/JPWO2011010452A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP2011523552A 2009-07-21 2010-07-21 基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法 Expired - Fee Related JP5810914B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011523552A JP5810914B2 (ja) 2009-07-21 2010-07-21 基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2009170513 2009-07-21
JP2009170513 2009-07-21
JP2009253438 2009-11-04
JP2009253438 2009-11-04
JP2011523552A JP5810914B2 (ja) 2009-07-21 2010-07-21 基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法
PCT/JP2010/004659 WO2011010452A1 (ja) 2009-07-21 2010-07-21 基板ホルダシステム、基板接合装置およびデバイスの製造方法

Publications (2)

Publication Number Publication Date
JPWO2011010452A1 JPWO2011010452A1 (ja) 2012-12-27
JP5810914B2 true JP5810914B2 (ja) 2015-11-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011523552A Expired - Fee Related JP5810914B2 (ja) 2009-07-21 2010-07-21 基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法

Country Status (8)

Country Link
US (1) US9054140B2 (enExample)
EP (1) EP2458628A4 (enExample)
JP (1) JP5810914B2 (enExample)
KR (1) KR20120037999A (enExample)
CN (1) CN102498559B (enExample)
IN (1) IN2012DN01481A (enExample)
TW (1) TW201131689A (enExample)
WO (1) WO2011010452A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011115498A1 (de) * 2011-10-11 2012-12-20 Carl Zeiss Smt Gmbh Lagervorrichtung zur Lagerung eines Substrats und mikrolithographische Projektionsbelichtungsanlage mit einer solchen Lagervorrichtung
WO2014154272A1 (de) 2013-03-27 2014-10-02 Ev Group E. Thallner Gmbh Aufnahmeeinrichtung, vorrichtung und verfahren zur handhabung von substratstapeln
US9947637B2 (en) 2013-11-01 2018-04-17 Nikon Corporation System and method for clamping wafers together in alignment using pressure
EP3312871B1 (de) * 2014-02-03 2024-09-25 EV Group E. Thallner GmbH Aufnahmeeinrichtung zur aufnahme eines substratstapels
JP6378942B2 (ja) 2014-06-12 2018-08-22 東京エレクトロン株式会社 載置台及びプラズマ処理装置
SG11201603148VA (en) * 2014-12-18 2016-07-28 Ev Group E Thallner Gmbh Method for bonding substrates
CN115954300A (zh) 2016-09-29 2023-04-11 Ev 集团 E·索尔纳有限责任公司 用于结合两个基板的装置和方法
JP6516889B2 (ja) * 2018-01-29 2019-05-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板スタックを取り扱うための、収容システム及び装置及び方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JP2673239B2 (ja) * 1988-11-07 1997-11-05 東京エレクトロン株式会社 処理装置
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
JP3296108B2 (ja) * 1994-08-08 2002-06-24 神鋼電機株式会社 電子基板用コンテナ
JPH11261000A (ja) 1998-03-13 1999-09-24 Japan Science & Technology Corp ３次元半導体集積回路装置の製造方法
JP3693972B2 (ja) * 2002-03-19 2005-09-14 富士通株式会社 貼合せ基板製造装置及び基板貼合せ方法
CN1325981C (zh) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 粘合机中的工作台结构及其控制方法
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
KR20040073087A (ko) * 2003-02-13 2004-08-19 삼성전자주식회사 웨이퍼 홀더
JP4626160B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
JP4465225B2 (ja) * 2004-05-28 2010-05-19 有限会社都波岐精工 基板接合装置、基板接合方法および記録ディスク製造方法
JP4548239B2 (ja) * 2005-06-21 2010-09-22 パナソニック株式会社 基板接合方法および基板接合装置
JP4107316B2 (ja) 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー 基板貼合装置
JP2007115978A (ja) 2005-10-21 2007-05-10 Nikon Corp 加圧装置及び半導体装置の製造方法
US7245350B2 (en) * 2005-11-11 2007-07-17 Canon Kabushiki Kaisha Exposure apparatus
JP2008087847A (ja) * 2006-10-05 2008-04-17 Clean Surface Gijutsu:Kk 基板収納ケース
JP2008140986A (ja) * 2006-12-01 2008-06-19 Murata Mach Ltd 枚葉搬送用トレイ
TWI471971B (zh) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method

Also Published As

Publication number Publication date
JPWO2011010452A1 (ja) 2012-12-27
CN102498559B (zh) 2016-03-02
US9054140B2 (en) 2015-06-09
EP2458628A4 (en) 2016-12-21
US20120205024A1 (en) 2012-08-16
EP2458628A1 (en) 2012-05-30
TW201131689A (en) 2011-09-16
WO2011010452A1 (ja) 2011-01-27
IN2012DN01481A (enExample) 2015-06-05
CN102498559A (zh) 2012-06-13
KR20120037999A (ko) 2012-04-20

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