JP7278180B2 - 基板貼合装置 - Google Patents
基板貼合装置 Download PDFInfo
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- JP7278180B2 JP7278180B2 JP2019166284A JP2019166284A JP7278180B2 JP 7278180 B2 JP7278180 B2 JP 7278180B2 JP 2019166284 A JP2019166284 A JP 2019166284A JP 2019166284 A JP2019166284 A JP 2019166284A JP 7278180 B2 JP7278180 B2 JP 7278180B2
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- marking
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- pressing member
- bonding apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/306—Applying a mark during joining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第1の実施形態にかかる基板貼合装置は、2枚の基板(例えば、2枚のウエハ)を2つの吸着ステージで吸着し、2枚の基板を貼りあわせる。このとき、2枚の基板を適切に貼り合せることが望まれる。
次に、第2の実施形態にかかる基板貼合装置201について説明する。以下では、第1の実施形態と異なる部分を中心に説明する。
第1の基板を吸着する第1の吸着ステージと、
前記第1の基板に対向して配され、第2の基板を吸着する第2の吸着ステージと、
前記第1の吸着ステージに吸着された前記第1の基板を前記第2の吸着ステージ側へ凸になるように変形可能であり、マーキング構造を先端側に有する押圧部材と、
を備えた基板貼合装置。
(付記2)
前記マーキング構造は、前記第1の基板に接触すべき先端面にマーキングパターンを有するマーキング部を有する
付記1に記載の基板貼合装置。
(付記3)
前記マーキングパターンは、平面視において、格子状、十字状、又は放射状に延びている
付記2に記載の基板貼合装置。
(付記4)
前記押圧部材の前記第2の吸着ステージの表面の法線からの傾斜角を所定の方向に調整する調整機構をさらに備え、
前記マーキング部は、平面視において、前記所定の方向に向かって角ばった形状を有する
付記2に記載の基板貼合装置。
(付記5)
前記マーキングパターンは、平面視において、矩形状の外輪郭を有し、前記外輪郭の辺に沿って格子状に延びている
付記4に記載の基板貼合装置。
(付記6)
前記マーキングパターンは、平面視において、矩形状の外輪郭を有し、前記外輪郭の対角線に沿って格子状に延びている
付記4に記載の基板貼合装置。
(付記7)
前記マーキングパターンは、平面視において、前記所定の方向に沿ったパターンを含むように、格子状、十字状、又は放射状に延びている
付記4に記載の基板貼合装置。
(付記8)
前記マーキング構造は、前記マーキング部にマーキング液を供給する供給部をさらに有する
付記2から7のいずれか1項に記載の基板貼合装置。
(付記9)
前記供給部は、
前記マーキング液を貯えるタンクと、
前記タンクを前記マーキング部側に連通可能である供給路と、
前記供給路を開閉する開閉弁と、
を有する
付記8に記載の基板貼合装置。
(付記10)
前記マーキング部にマーキング液を塗布する塗布部をさらに備えた
付記2から7のいずれか1項に記載の基板貼合装置。
Claims (6)
- 第1の基板を吸着する第1の吸着ステージと、
前記第1の基板に対向して配され、第2の基板を吸着する第2の吸着ステージと、
前記第1の吸着ステージに吸着された前記第1の基板を前記第2の吸着ステージ側へ凸になるように変形可能であり、前記第1の基板に接触すべき先端面にマーキングパターンを有するマーキング部を含むマーキング構造を先端側に有する押圧部材と、
を備え、
前記第1の基板に形成される前記マーキングパターンに基づいて、前記押圧部材の位置及び角度の少なくとも一方を計測可能である
基板貼合装置。 - 前記第1の基板に形成される前記マーキングパターンの画像を取得可能である撮像部と、
前記撮像部で取得された前記マーキングパターンの画像に基づき、前記押圧部材の位置及び角度の少なくとも一方を計測可能であるコントローラと、
をさらに備えた
請求項1に記載の基板貼合装置。 - 前記マーキングパターンは、平面視において、格子状、十字状、又は放射状に延びている
請求項1に記載の基板貼合装置。 - 前記押圧部材の前記第2の吸着ステージの表面の法線からの傾斜角を所定の方向に調整する調整機構をさらに備え、
前記マーキング部は、平面視において、前記所定の方向に向かって角ばった形状を有する
請求項1に記載の基板貼合装置。 - 前記マーキング構造は、前記マーキング部にマーキング液を供給する供給部をさらに有する
請求項2から4のいずれか1項に記載の基板貼合装置。 - 前記マーキング部にマーキング液を塗布する塗布部をさらに備えた
請求項2から4のいずれか1項に記載の基板貼合装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019166284A JP7278180B2 (ja) | 2019-09-12 | 2019-09-12 | 基板貼合装置 |
US17/011,890 US11267237B2 (en) | 2019-09-12 | 2020-09-03 | Substrate bonding apparatus |
Applications Claiming Priority (1)
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JP2019166284A JP7278180B2 (ja) | 2019-09-12 | 2019-09-12 | 基板貼合装置 |
Publications (2)
Publication Number | Publication Date |
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JP2021044442A JP2021044442A (ja) | 2021-03-18 |
JP7278180B2 true JP7278180B2 (ja) | 2023-05-19 |
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JP2019166284A Active JP7278180B2 (ja) | 2019-09-12 | 2019-09-12 | 基板貼合装置 |
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JP (1) | JP7278180B2 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009259928A (ja) | 2008-04-15 | 2009-11-05 | Sumco Corp | マーク付き半導体基板及びその製造方法 |
JP2012160628A (ja) | 2011-02-02 | 2012-08-23 | Sony Corp | 基板の接合方法及び基板接合装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5838361A (en) * | 1996-01-11 | 1998-11-17 | Micron Technology, Inc. | Laser marking techniques |
JP6501447B2 (ja) | 2013-03-26 | 2019-04-17 | 芝浦メカトロニクス株式会社 | 貼合装置および貼合基板の製造方法 |
JP6598635B2 (ja) | 2015-10-29 | 2019-10-30 | 東京エレクトロン株式会社 | 基板押圧機構および接合装置 |
JP2018026415A (ja) | 2016-08-09 | 2018-02-15 | 東京エレクトロン株式会社 | 接合装置および接合システム |
JP6727069B2 (ja) | 2016-08-09 | 2020-07-22 | 東京エレクトロン株式会社 | 接合装置および接合システム |
US11077626B2 (en) * | 2017-10-06 | 2021-08-03 | Huber Engineered Woods Llc | Compression roller device |
-
2019
- 2019-09-12 JP JP2019166284A patent/JP7278180B2/ja active Active
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2020
- 2020-09-03 US US17/011,890 patent/US11267237B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009259928A (ja) | 2008-04-15 | 2009-11-05 | Sumco Corp | マーク付き半導体基板及びその製造方法 |
JP2012160628A (ja) | 2011-02-02 | 2012-08-23 | Sony Corp | 基板の接合方法及び基板接合装置 |
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Publication number | Publication date |
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JP2021044442A (ja) | 2021-03-18 |
US20210078317A1 (en) | 2021-03-18 |
US11267237B2 (en) | 2022-03-08 |
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