JP5810758B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5810758B2
JP5810758B2 JP2011189814A JP2011189814A JP5810758B2 JP 5810758 B2 JP5810758 B2 JP 5810758B2 JP 2011189814 A JP2011189814 A JP 2011189814A JP 2011189814 A JP2011189814 A JP 2011189814A JP 5810758 B2 JP5810758 B2 JP 5810758B2
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JP
Japan
Prior art keywords
light emitting
light
emitting device
irradiation
irradiation region
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JP2011189814A
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English (en)
Japanese (ja)
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JP2013051375A (ja
JP2013051375A5 (enExample
Inventor
篤史 板東
篤史 板東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
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Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2011189814A priority Critical patent/JP5810758B2/ja
Publication of JP2013051375A publication Critical patent/JP2013051375A/ja
Publication of JP2013051375A5 publication Critical patent/JP2013051375A5/ja
Application granted granted Critical
Publication of JP5810758B2 publication Critical patent/JP5810758B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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  • Led Device Packages (AREA)
JP2011189814A 2011-08-31 2011-08-31 発光装置 Active JP5810758B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011189814A JP5810758B2 (ja) 2011-08-31 2011-08-31 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011189814A JP5810758B2 (ja) 2011-08-31 2011-08-31 発光装置

Publications (3)

Publication Number Publication Date
JP2013051375A JP2013051375A (ja) 2013-03-14
JP2013051375A5 JP2013051375A5 (enExample) 2014-09-25
JP5810758B2 true JP5810758B2 (ja) 2015-11-11

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ID=48013195

Family Applications (1)

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JP2011189814A Active JP5810758B2 (ja) 2011-08-31 2011-08-31 発光装置

Country Status (1)

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JP (1) JP5810758B2 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014022435A (ja) * 2012-07-13 2014-02-03 Toyoda Gosei Co Ltd 発光装置及びその製造方法
KR102085888B1 (ko) * 2013-05-08 2020-03-06 엘지이노텍 주식회사 발광 소자
JP6107415B2 (ja) * 2013-05-23 2017-04-05 日亜化学工業株式会社 発光装置
JP6098439B2 (ja) * 2013-08-28 2017-03-22 日亜化学工業株式会社 波長変換部材、発光装置、及び発光装置の製造方法
CN105164464B (zh) * 2013-12-17 2017-03-01 皇家飞利浦有限公司 固态发光器封装、光发射设备、柔性led条体以及灯具
KR102265771B1 (ko) * 2014-01-21 2021-06-16 루미리즈 홀딩 비.브이. 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈
JP6201904B2 (ja) 2014-06-10 2017-09-27 豊田合成株式会社 発光装置
USD751046S1 (en) 2014-06-16 2016-03-08 Citizen Electronics Co., Ltd. Light emitting diode
USD751045S1 (en) 2014-06-16 2016-03-08 Citizen Electronics Co., Ltd. Light emitting diode
USD751517S1 (en) 2014-06-16 2016-03-15 Citizen Electronics Co., Ltd. Light emitting diode
KR101527430B1 (ko) * 2014-06-17 2015-06-11 (주)에너브레인 씨오비 타입 발광다이오드 램프 및 그 제조방법
JP6515716B2 (ja) 2014-07-18 2019-05-22 日亜化学工業株式会社 発光装置およびその製造方法
JP6256699B2 (ja) * 2014-11-11 2018-01-10 豊田合成株式会社 発光装置
JP6827265B2 (ja) * 2015-01-05 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
JP6485243B2 (ja) * 2015-03-02 2019-03-20 豊田合成株式会社 発光装置
DE102015007750A1 (de) * 2015-06-17 2016-12-22 Osram Gmbh Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
JP2018134117A (ja) * 2015-06-26 2018-08-30 オリンパス株式会社 光ファイババンドルおよびそれを用いた内視鏡のための照明装置
JP6617452B2 (ja) * 2015-07-07 2019-12-11 日亜化学工業株式会社 線状光源
JP6583673B2 (ja) * 2015-09-10 2019-10-02 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
CN106887507B (zh) 2015-10-30 2020-09-22 日亚化学工业株式会社 发光装置及其制造方法
JP6790602B2 (ja) * 2015-10-30 2020-11-25 日亜化学工業株式会社 発光装置及びその製造方法
CN114188460B (zh) 2015-11-30 2025-07-04 日亚化学工业株式会社 发光装置
JP6584308B2 (ja) * 2015-12-04 2019-10-02 シチズン電子株式会社 Ｌｅｄ発光モジュール
JP6643910B2 (ja) * 2016-02-08 2020-02-12 シチズン電子株式会社 発光装置
JP6728869B2 (ja) * 2016-02-25 2020-07-22 豊田合成株式会社 発光装置
JP6866580B2 (ja) * 2016-06-29 2021-04-28 日亜化学工業株式会社 発光装置及び光源
JP2018041843A (ja) 2016-09-07 2018-03-15 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
JP6807686B2 (ja) * 2016-09-13 2021-01-06 シチズン電子株式会社 発光装置
JP6458793B2 (ja) * 2016-11-21 2019-01-30 日亜化学工業株式会社 発光装置の製造方法
JP2018206886A (ja) * 2017-06-01 2018-12-27 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
JP7063583B2 (ja) * 2017-11-22 2022-05-09 シチズン電子株式会社 発光装置
JP2019121678A (ja) * 2018-01-04 2019-07-22 シチズン電子株式会社 発光装置
JP2019138940A (ja) 2018-02-06 2019-08-22 セイコーエプソン株式会社 光源装置、照明装置及びプロジェクター
JP2020161649A (ja) * 2019-03-27 2020-10-01 日亜化学工業株式会社 発光モジュールの製造方法
KR102777054B1 (ko) * 2019-07-04 2025-03-11 서울반도체 주식회사 직병렬 연결된 복수의 발광 다이오드 칩을 갖는 발광 모듈
JP7492119B2 (ja) * 2020-03-31 2024-05-29 日亜化学工業株式会社 発光装置
JP7723258B2 (ja) * 2021-08-31 2025-08-14 日亜化学工業株式会社 発光装置、およびディスプレイ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5113820B2 (ja) * 2009-10-27 2013-01-09 パナソニック株式会社 発光装置
DE102010044470B4 (de) * 2010-09-06 2018-06-28 Heraeus Noblelight Gmbh Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit

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