JP5809866B2 - 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法 - Google Patents

光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法 Download PDF

Info

Publication number
JP5809866B2
JP5809866B2 JP2011159847A JP2011159847A JP5809866B2 JP 5809866 B2 JP5809866 B2 JP 5809866B2 JP 2011159847 A JP2011159847 A JP 2011159847A JP 2011159847 A JP2011159847 A JP 2011159847A JP 5809866 B2 JP5809866 B2 JP 5809866B2
Authority
JP
Japan
Prior art keywords
optical
optical element
hole
substrate
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011159847A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013025092A (ja
JP2013025092A5 (enExample
Inventor
寛幸 本原
寛幸 本原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2011159847A priority Critical patent/JP5809866B2/ja
Priority to PCT/JP2012/068108 priority patent/WO2013011983A1/ja
Priority to EP12814657.8A priority patent/EP2735899B1/en
Publication of JP2013025092A publication Critical patent/JP2013025092A/ja
Priority to US14/104,345 priority patent/US9385249B2/en
Publication of JP2013025092A5 publication Critical patent/JP2013025092A5/ja
Application granted granted Critical
Publication of JP5809866B2 publication Critical patent/JP5809866B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002—Operational features of endoscopes
    • A61B1/00011—Operational features of endoscopes characterised by signal transmission
    • A61B1/00013—Operational features of endoscopes characterised by signal transmission using optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Engineering & Computer Science (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
JP2011159847A 2011-07-21 2011-07-21 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法 Active JP5809866B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011159847A JP5809866B2 (ja) 2011-07-21 2011-07-21 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法
PCT/JP2012/068108 WO2013011983A1 (ja) 2011-07-21 2012-07-17 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法
EP12814657.8A EP2735899B1 (en) 2011-07-21 2012-07-17 Optical element module, optical transmission module, and method of manufacturing optical transmission module
US14/104,345 US9385249B2 (en) 2011-07-21 2013-12-12 Optical element module, optical transmission module, and method of manufacturing optical transmission module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011159847A JP5809866B2 (ja) 2011-07-21 2011-07-21 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2013025092A JP2013025092A (ja) 2013-02-04
JP2013025092A5 JP2013025092A5 (enExample) 2014-09-04
JP5809866B2 true JP5809866B2 (ja) 2015-11-11

Family

ID=47558160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011159847A Active JP5809866B2 (ja) 2011-07-21 2011-07-21 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法

Country Status (4)

Country Link
US (1) US9385249B2 (enExample)
EP (1) EP2735899B1 (enExample)
JP (1) JP5809866B2 (enExample)
WO (1) WO2013011983A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5996215B2 (ja) 2012-02-28 2016-09-21 オリンパス株式会社 光電変換モジュールおよび光伝送ユニット
JP6321933B2 (ja) * 2013-09-26 2018-05-09 オリンパス株式会社 光伝送モジュール、及び内視鏡
JP6411088B2 (ja) 2013-09-26 2018-10-24 オリンパス株式会社 光伝送モジュールおよび内視鏡
JP6203010B2 (ja) 2013-11-18 2017-09-27 オリンパス株式会社 内視鏡
JP6230388B2 (ja) 2013-11-28 2017-11-15 オリンパス株式会社 内視鏡
JP6226782B2 (ja) 2014-03-13 2017-11-08 オリンパス株式会社 光伝送モジュールおよび光伝送モジュールの製造方法
JP6382586B2 (ja) * 2014-06-11 2018-08-29 オリンパス株式会社 光伝送モジュール、および光伝送モジュールの製造方法
JP6382585B2 (ja) * 2014-06-11 2018-08-29 オリンパス株式会社 光伝送モジュール
JP2016004130A (ja) * 2014-06-16 2016-01-12 オリンパス株式会社 光伝送モジュールおよび光伝送モジュールの製造方法
JP6485840B2 (ja) * 2015-01-23 2019-03-20 オリンパス株式会社 光伝送モジュールおよび内視鏡
US9541717B2 (en) 2015-01-30 2017-01-10 Avago Technologies General IP (Singapore) Pta. Ltd. Optoelectronic assembly incorporating an optical fiber alignment structure
WO2016185537A1 (ja) * 2015-05-18 2016-11-24 オリンパス株式会社 内視鏡、および光伝送モジュール
WO2016189691A1 (ja) * 2015-05-27 2016-12-01 オリンパス株式会社 内視鏡および光伝送モジュール
JPWO2017109930A1 (ja) 2015-12-25 2018-10-18 オリンパス株式会社 撮像モジュールおよび内視鏡
US10186584B2 (en) 2016-08-18 2019-01-22 Uchicago Argonne, Llc Systems and methods for forming diamond heterojunction junction devices
WO2018134933A1 (ja) * 2017-01-19 2018-07-26 オリンパス株式会社 光モジュールおよび内視鏡
WO2018138778A1 (ja) 2017-01-24 2018-08-02 オリンパス株式会社 内視鏡
US20190129108A1 (en) * 2017-10-31 2019-05-02 Versalume LLC Modular Laser Connector Packaging System and Method
WO2019163014A1 (ja) * 2018-02-21 2019-08-29 オリンパス株式会社 内視鏡用光モジュール、内視鏡、および内視鏡用光モジュールの製造方法
WO2019207742A1 (ja) 2018-04-26 2019-10-31 オリンパス株式会社 内視鏡用光モジュール、内視鏡、および内視鏡用光モジュールの製造方法
WO2020075253A1 (ja) 2018-10-11 2020-04-16 オリンパス株式会社 内視鏡用撮像装置、内視鏡、および内視鏡用撮像装置の製造方法
US10551542B1 (en) 2018-12-11 2020-02-04 Corning Incorporated Light modules and devices incorporating light modules
WO2020217277A1 (ja) * 2019-04-22 2020-10-29 オリンパス株式会社 内視鏡用撮像装置の製造方法、内視鏡用撮像装置、および、内視鏡
CN110412700B (zh) * 2019-07-26 2022-05-17 西安微电子技术研究所 一种综合电子高速光互连模块集成结构及集成方法
JP7399180B2 (ja) * 2019-09-30 2023-12-15 京セラ株式会社 光素子搭載用パッケージ、電子装置及び電子モジュール
WO2021260854A1 (ja) 2020-06-24 2021-12-30 オリンパス株式会社 内視鏡用光モジュール、および、内視鏡
US12282137B2 (en) 2020-12-23 2025-04-22 Te Connectivity Solutions Gmbh Light source for an optical sensor

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594509U (ja) * 1982-06-29 1984-01-12 日本板硝子株式会社 光ファイバー端子
JPH0538327Y2 (enExample) * 1986-12-26 1993-09-28
JP3281518B2 (ja) 1995-09-28 2002-05-13 京セラ株式会社 光通信用モジュール
US6243508B1 (en) * 1999-06-01 2001-06-05 Picolight Incorporated Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide
JP2002250846A (ja) * 2001-02-26 2002-09-06 Seiko Epson Corp 光モジュール及びその製造方法並びに光伝達装置
JP2002252430A (ja) * 2001-02-26 2002-09-06 Ricoh Co Ltd 光通信システム
JP2002311305A (ja) * 2001-04-13 2002-10-23 Seiko Epson Corp 光ファイバ支持部材およびこれを用いた光送信装置
AU2003232225A1 (en) * 2003-04-29 2004-11-23 Pirelli And C. S.P.A. Coupling structure for optical fibres and process for making it
JP3991318B2 (ja) * 2004-01-20 2007-10-17 セイコーエプソン株式会社 光モジュールの製造方法、光通信装置、電子機器
JP2005286284A (ja) * 2004-02-03 2005-10-13 Sony Chem Corp 機能素子実装モジュール並びに光機能素子実装モジュール及びその製造方法
US20070278666A1 (en) * 2004-04-13 2007-12-06 Jean-Charles Garcia Method for Production of Electronic and Optoelectronic Circuits
US7352935B2 (en) * 2004-08-17 2008-04-01 Kabushiki Kaisha Toshiba Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system
JP4280851B2 (ja) * 2004-11-18 2009-06-17 株式会社白山製作所 光コネクタおよびその製造方法
WO2007088584A1 (ja) * 2006-01-31 2007-08-09 Fujitsu Limited 光モジュールおよびその製造方法
JP4698487B2 (ja) * 2006-05-29 2011-06-08 株式会社フジクラ 光ファイバアレイ
JP2009047937A (ja) * 2007-08-20 2009-03-05 Sony Corp 光送信／光受信モジュール及び光モジュールの製造方法並びに光通信モジュール
JP5049145B2 (ja) * 2008-01-22 2012-10-17 日東電工株式会社 光導波路デバイスの製法
JP2009206158A (ja) * 2008-02-26 2009-09-10 Sumitomo Electric Ind Ltd レーザモジュールおよびレーザ装置
JP2010048940A (ja) * 2008-08-20 2010-03-04 Fuji Xerox Co Ltd 光学装置
US9442255B2 (en) * 2010-06-29 2016-09-13 Ultra Communications, Inc. Low profile fiber-to-module interface with relaxed alignment tolerances

Also Published As

Publication number Publication date
WO2013011983A1 (ja) 2013-01-24
US20140097459A1 (en) 2014-04-10
JP2013025092A (ja) 2013-02-04
US9385249B2 (en) 2016-07-05
EP2735899B1 (en) 2018-09-05
EP2735899A1 (en) 2014-05-28
EP2735899A4 (en) 2015-03-25

Similar Documents

Publication Publication Date Title
JP5809866B2 (ja) 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法
CN104919346B (zh) 光传输模块和摄像装置
US9207412B2 (en) Optical transmission module and endoscope
JP6321933B2 (ja) 光伝送モジュール、及び内視鏡
US11445898B2 (en) Optical module for endoscope, endoscope, and manufacturing method for optical module for endoscope
JP4793169B2 (ja) 接続体および光送受信モジュール
US10088669B2 (en) Endoscope
US20180078114A1 (en) Endoscope and optical transmission module
JPWO2009090988A1 (ja) 光モジュール
JP2009047937A (ja) 光送信／光受信モジュール及び光モジュールの製造方法並びに光通信モジュール
WO2018150512A1 (ja) 光モジュール、内視鏡、および、光モジュールの製造方法
WO2019208633A1 (ja) 内視鏡用光モジュール、内視鏡、および内視鏡用光モジュールの製造方法
US20170315310A1 (en) Optical transmission module and endoscope
CN106104340A (zh) 光传送模块和光传送模块的制造方法
JP6081160B2 (ja) 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法
US20180368659A1 (en) Optical transmitter and endoscope
JP2015097588A (ja) 光伝送モジュール及び内視鏡
US20180368662A1 (en) Optical transmission module and endoscope
JP6382585B2 (ja) 光伝送モジュール
US10838194B2 (en) Optical transmission module and endoscope
JP2004317632A (ja) 光モジュール用マウント部材、光モジュール、光モジュールの製造方法
WO2018146806A1 (ja) 光モジュールおよび内視鏡

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140718

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140718

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150602

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150729

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150818

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150914

R151 Written notification of patent or utility model registration

Ref document number: 5809866

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250