JP5804706B2 - キャップ層を有する基板用の析出後洗浄方法並びに組成 - Google Patents

キャップ層を有する基板用の析出後洗浄方法並びに組成 Download PDF

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Publication number
JP5804706B2
JP5804706B2 JP2010539925A JP2010539925A JP5804706B2 JP 5804706 B2 JP5804706 B2 JP 5804706B2 JP 2010539925 A JP2010539925 A JP 2010539925A JP 2010539925 A JP2010539925 A JP 2010539925A JP 5804706 B2 JP5804706 B2 JP 5804706B2
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Prior art keywords
cleaning solution
substrate
cap
cobalt
cleaning
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Japanese (ja)
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JP2011508438A (ja
JP2011508438A5 (pt-PT
Inventor
コリクス・アートゥア
リー・シジャン
アルナジリ・ティルチラーパリ
ティエ・ウィリアム
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76849—Barrier, adhesion or liner layers formed in openings in a dielectric the layer being positioned on top of the main fill metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76861—Post-treatment or after-treatment not introducing additional chemical elements into the layer
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
JP2010539925A 2007-12-21 2008-12-20 キャップ層を有する基板用の析出後洗浄方法並びに組成 Active JP5804706B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US1642707P 2007-12-21 2007-12-21
US61/016,427 2007-12-21
US12/334,462 US8404626B2 (en) 2007-12-21 2008-12-13 Post-deposition cleaning methods and formulations for substrates with cap layers
US12/334,462 2008-12-13
PCT/US2008/087878 WO2009086231A2 (en) 2007-12-21 2008-12-20 Post-deposition cleaning methods and formulations for substrates with cap layers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013260355A Division JP2014088569A (ja) 2007-12-21 2013-12-17 キャップ層を有する基板用の析出後洗浄方法並びに組成

Publications (3)

Publication Number Publication Date
JP2011508438A JP2011508438A (ja) 2011-03-10
JP2011508438A5 JP2011508438A5 (pt-PT) 2012-02-02
JP5804706B2 true JP5804706B2 (ja) 2015-11-04

Family

ID=40788967

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010539925A Active JP5804706B2 (ja) 2007-12-21 2008-12-20 キャップ層を有する基板用の析出後洗浄方法並びに組成
JP2013260355A Pending JP2014088569A (ja) 2007-12-21 2013-12-17 キャップ層を有する基板用の析出後洗浄方法並びに組成

Family Applications After (1)

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JP2013260355A Pending JP2014088569A (ja) 2007-12-21 2013-12-17 キャップ層を有する基板用の析出後洗浄方法並びに組成

Country Status (6)

Country Link
US (2) US8404626B2 (pt-PT)
JP (2) JP5804706B2 (pt-PT)
KR (2) KR101633940B1 (pt-PT)
CN (1) CN101971296B (pt-PT)
TW (1) TWI528426B (pt-PT)
WO (1) WO2009086231A2 (pt-PT)

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US8614053B2 (en) 2009-03-27 2013-12-24 Eastman Chemical Company Processess and compositions for removing substances from substrates
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CN110249041A (zh) * 2017-02-10 2019-09-17 富士胶片电子材料美国有限公司 清洗制剂
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CN108377615B (zh) * 2018-03-15 2020-12-29 昆山长优电子材料有限公司 用于pcb图形转移前处理制程的铜面键合溶液
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CN110003996B (zh) * 2019-05-21 2021-03-23 广东剑鑫科技股份有限公司 一种浸泡液及其制备方法和使用方法

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Also Published As

Publication number Publication date
KR20160030326A (ko) 2016-03-16
WO2009086231A2 (en) 2009-07-09
KR101633940B1 (ko) 2016-06-27
CN101971296A (zh) 2011-02-09
US8404626B2 (en) 2013-03-26
JP2014088569A (ja) 2014-05-15
KR20100108397A (ko) 2010-10-06
WO2009086231A3 (en) 2009-08-27
JP2011508438A (ja) 2011-03-10
KR101698731B1 (ko) 2017-01-20
TWI528426B (zh) 2016-04-01
TW200945424A (en) 2009-11-01
US8790465B2 (en) 2014-07-29
US20090162537A1 (en) 2009-06-25
CN101971296B (zh) 2012-05-30
US20130323410A1 (en) 2013-12-05

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