JP5800716B2 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP5800716B2
JP5800716B2 JP2012000335A JP2012000335A JP5800716B2 JP 5800716 B2 JP5800716 B2 JP 5800716B2 JP 2012000335 A JP2012000335 A JP 2012000335A JP 2012000335 A JP2012000335 A JP 2012000335A JP 5800716 B2 JP5800716 B2 JP 5800716B2
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Japan
Prior art keywords
power semiconductor
power
control
die pad
semiconductor device
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JP2012000335A
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English (en)
Japanese (ja)
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JP2013140870A (ja
JP2013140870A5 (https=
Inventor
藤野　純司
純司 藤野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2012000335A priority Critical patent/JP5800716B2/ja
Publication of JP2013140870A publication Critical patent/JP2013140870A/ja
Publication of JP2013140870A5 publication Critical patent/JP2013140870A5/ja
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2012000335A 2012-01-05 2012-01-05 電力用半導体装置 Active JP5800716B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012000335A JP5800716B2 (ja) 2012-01-05 2012-01-05 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012000335A JP5800716B2 (ja) 2012-01-05 2012-01-05 電力用半導体装置

Publications (3)

Publication Number Publication Date
JP2013140870A JP2013140870A (ja) 2013-07-18
JP2013140870A5 JP2013140870A5 (https=) 2014-01-09
JP5800716B2 true JP5800716B2 (ja) 2015-10-28

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ID=49038075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012000335A Active JP5800716B2 (ja) 2012-01-05 2012-01-05 電力用半導体装置

Country Status (1)

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JP (1) JP5800716B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6274986B2 (ja) * 2014-06-26 2018-02-07 三菱電機株式会社 パワー半導体モジュールおよびその製造方法
JP6269573B2 (ja) 2015-05-18 2018-01-31 株式会社デンソー 半導体装置
WO2024013998A1 (ja) * 2022-07-15 2024-01-18 日立Astemo株式会社 半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226422A (ja) * 1994-02-14 1995-08-22 Sumitomo Electric Ind Ltd 電子部品パッケージ
JP3080049B2 (ja) * 1997-11-17 2000-08-21 日本電気株式会社 集積回路チップの実装構造および方法
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP2003100924A (ja) * 2001-09-21 2003-04-04 Kyocera Corp 半導体装置
JP2004172211A (ja) * 2002-11-18 2004-06-17 Yaskawa Electric Corp パワーモジュール
JP4022758B2 (ja) * 2003-03-31 2007-12-19 株式会社デンソー 半導体装置
TWI226110B (en) * 2004-03-17 2005-01-01 Cyntec Co Ltd Package with stacked substrates
JP2008066026A (ja) * 2006-09-05 2008-03-21 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイパネルの製造方法
JP5193777B2 (ja) * 2008-09-26 2013-05-08 株式会社東芝 パワー半導体モジュールとそれを用いたインバータシステム
JP2011044452A (ja) * 2009-08-19 2011-03-03 Denso Corp 電子装置およびその製造方法

Also Published As

Publication number Publication date
JP2013140870A (ja) 2013-07-18

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