JP5794850B2 - 接続端子構造の製造方法 - Google Patents

接続端子構造の製造方法 Download PDF

Info

Publication number
JP5794850B2
JP5794850B2 JP2011162909A JP2011162909A JP5794850B2 JP 5794850 B2 JP5794850 B2 JP 5794850B2 JP 2011162909 A JP2011162909 A JP 2011162909A JP 2011162909 A JP2011162909 A JP 2011162909A JP 5794850 B2 JP5794850 B2 JP 5794850B2
Authority
JP
Japan
Prior art keywords
connection terminal
terminal structure
support
connection
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011162909A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013026178A5 (https=
JP2013026178A (ja
Inventor
義博 井原
義博 井原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011162909A priority Critical patent/JP5794850B2/ja
Priority to US13/554,080 priority patent/US8784118B2/en
Publication of JP2013026178A publication Critical patent/JP2013026178A/ja
Publication of JP2013026178A5 publication Critical patent/JP2013026178A5/ja
Application granted granted Critical
Publication of JP5794850B2 publication Critical patent/JP5794850B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2011162909A 2011-07-26 2011-07-26 接続端子構造の製造方法 Expired - Fee Related JP5794850B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011162909A JP5794850B2 (ja) 2011-07-26 2011-07-26 接続端子構造の製造方法
US13/554,080 US8784118B2 (en) 2011-07-26 2012-07-20 Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011162909A JP5794850B2 (ja) 2011-07-26 2011-07-26 接続端子構造の製造方法

Publications (3)

Publication Number Publication Date
JP2013026178A JP2013026178A (ja) 2013-02-04
JP2013026178A5 JP2013026178A5 (https=) 2014-07-24
JP5794850B2 true JP5794850B2 (ja) 2015-10-14

Family

ID=47597568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011162909A Expired - Fee Related JP5794850B2 (ja) 2011-07-26 2011-07-26 接続端子構造の製造方法

Country Status (2)

Country Link
US (1) US8784118B2 (https=)
JP (1) JP5794850B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014071964A (ja) * 2012-09-27 2014-04-21 Fujitsu Component Ltd コンタクト部材
CN106415944A (zh) * 2014-04-23 2017-02-15 泰科电子公司 具有屏蔽帽和屏蔽端子的电连接器
FR3021814B1 (fr) * 2014-08-08 2018-06-15 Commissariat Energie Atomique Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie
JP6330689B2 (ja) * 2015-02-19 2018-05-30 株式会社オートネットワーク技術研究所 電気接点対およびコネクタ用端子対
FR3038779A1 (fr) * 2015-07-07 2017-01-13 Ingenico Group Connecteur de carte a puce securise
JP2019029535A (ja) * 2017-07-31 2019-02-21 イビデン株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板を備える電子デバイス、及び、フレキシブルプリント配線板を備える電子デバイスの製造方法
CN108258467B (zh) * 2017-12-01 2020-08-28 番禺得意精密电子工业有限公司 电连接器
US12537328B2 (en) * 2023-04-24 2026-01-27 Google Llc Force distributing spring contacts

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091048A (ja) * 1998-09-16 2000-03-31 Ngk Insulators Ltd 導通補助材及びその製造方法
JP4303854B2 (ja) * 1999-11-11 2009-07-29 モレックス インコーポレイテド ランドグリッドアレイ型パッケージ用ソケット
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
US6939143B2 (en) * 2000-01-20 2005-09-06 Gryphics, Inc. Flexible compliant interconnect assembly
JP4323055B2 (ja) * 2000-03-22 2009-09-02 富士通マイクロエレクトロニクス株式会社 半導体装置試験用コンタクタ及びその製造方法
US7458816B1 (en) * 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
JP2004259530A (ja) * 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
US7628617B2 (en) * 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7771803B2 (en) * 2004-10-27 2010-08-10 Palo Alto Research Center Incorporated Oblique parts or surfaces
JP4848752B2 (ja) * 2005-12-09 2011-12-28 イビデン株式会社 部品実装用ピンを有するプリント配線板及びこれを使用した電子機器
KR100941360B1 (ko) * 2006-07-21 2010-02-11 가부시키가이샤후지쿠라 집적 회로 소켓, 집적 회로 소켓 조립체, 및 집적 회로 소켓의 제조 방법
CN201725897U (zh) * 2010-01-29 2011-01-26 番禺得意精密电子工业有限公司 电连接装置
US8215966B2 (en) * 2010-04-20 2012-07-10 Tyco Electronics Corporation Interposer connector assembly
US8382487B2 (en) * 2010-12-20 2013-02-26 Tyco Electronics Corporation Land grid array interconnect

Also Published As

Publication number Publication date
US8784118B2 (en) 2014-07-22
JP2013026178A (ja) 2013-02-04
US20130029538A1 (en) 2013-01-31

Similar Documents

Publication Publication Date Title
JP5794850B2 (ja) 接続端子構造の製造方法
JP5713598B2 (ja) ソケット及びその製造方法
JP5606695B2 (ja) 接続端子付き基板
JP5788166B2 (ja) 接続端子構造及びその製造方法、並びにソケット
JP5500870B2 (ja) 接続端子付き基板及び電子部品のソケット等
JP5905181B2 (ja) フリップ・チップ・オン・フレックス（ｆｌｉｐ−ｃｈｉｐ−ｏｎ−ｆｌｅｘ）の応用例用のフレキシブル回路基板
JP5582995B2 (ja) ソケット
JP6162714B2 (ja) コネクタ構造、メスコネクタおよびオスコネクタ
JP2009016451A (ja) 配線回路基板と電子部品との接続構造
JP2011258364A (ja) ソケット
JP5794833B2 (ja) 接続端子及びその製造方法、並びにソケット
JP5564328B2 (ja) ソケット
JP4383843B2 (ja) 電気的接触構造体及びその製造方法
US20010038293A1 (en) Projection electrode, its forming method and apparatus for testing an electronic component
JPH0727789A (ja) 回路配線板およびその製造方法
JP2011165413A (ja) 電気コネクタ及びその製造方法
JP4354846B2 (ja) スパイラル接触子の製造方法
JP4050198B2 (ja) 接続装置の製造方法
JP2018014306A (ja) コネクタ
TWI871764B (zh) 用於探針卡之懸臂型探針及探針卡
JP2011133389A (ja) 半導体接触シートとその製造方法
JP4359193B2 (ja) スパイラルコンタクタおよびその製造方法
JP2012119574A (ja) 半導体装置およびその製造方法
JP2006013160A (ja) 配線回路基板および半導体装置
JP2015152577A (ja) 接続用コネクタ及び接続用コネクタの製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140610

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140610

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150317

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150319

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150513

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150804

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150811

R150 Certificate of patent or registration of utility model

Ref document number: 5794850

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees