JP5742723B2 - 流動特性測定用金型、流動特性測定方法、半導体封止用樹脂組成物及び半導体装置の製造方法 - Google Patents
流動特性測定用金型、流動特性測定方法、半導体封止用樹脂組成物及び半導体装置の製造方法 Download PDFInfo
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- JP5742723B2 JP5742723B2 JP2011543097A JP2011543097A JP5742723B2 JP 5742723 B2 JP5742723 B2 JP 5742723B2 JP 2011543097 A JP2011543097 A JP 2011543097A JP 2011543097 A JP2011543097 A JP 2011543097A JP 5742723 B2 JP5742723 B2 JP 5742723B2
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Images
Classifications
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Description
前記流路の断面形状における断面重心から外郭線までの最小距離が0.02mm以上、0.4mm以下であり、
前記流路の長さは70cm以上であることを特徴とする流動特性測定用金型が提供される。
下記式:
0.25L2≦L1
を満たす。
0.25L2≦L1
を満たすものがより好ましい。
以下、参考形態の例を付記する。
1.金型に設けられた流路に被測定物である樹脂組成物を注入して前記樹脂組成物の流動特性を測定するために使用する流動特性測定用金型であって、
前記流路の断面形状における断面重心から外郭線までの最小距離が0.02mm以上、0.4mm以下であることを特徴とする流動特性測定用金型。
2.前記流路が螺旋状の流路である、1.に記載の流動特性測定用金型。
3.前記流路の断面形状が、長方形、台形又は蒲鉾形である、1.に記載の流動特性測定用金型。
4.前記流路の断面形状の最大幅(w)と最大高さ(h)とがw≧hの関係にある、1.に記載の流動特性測定用金型。
5.前記流路の断面形状の前記最大高さが0.05mm以上、0.8mm以下である、4.に記載の流動特性測定用金型。
6.前記流路の断面形状の前記最大幅が0.5mm以上、10mm以下である、4.に記載の流動特性測定用金型。
7.1.に記載の流動特性測定用金型の流路に被測定物である樹脂組成物を注入して一方向に流動させる工程と、前記樹脂組成物の前記流動の始点から終点までの流動距離を流動長として求める工程を含む、流動特性測定方法。
8.流動距離を流動長として求める前記工程が、低圧トランスファー成形機を用いて、金型温度140〜190℃、注入圧力6.9MPa、保圧時間60〜180秒の条件で実施される、7.に記載の流動特性測定方法。
9.7.に記載の流動特性測定方法により、樹脂組成物の流動特性を評価する樹脂組成物の検査方法であって、
前記樹脂組成物が半導体封止用樹脂組成物であり、
前記半導体封止用樹脂組成物の製品検査として前記半導体封止用樹脂組成物の流動長を測定し、その値を予め定められた製品規格と比較して合否判定する工程を含む、半導体封止用樹脂組成物の検査方法。
10.(A)エポキシ樹脂、(B)フェノール樹脂系硬化剤、(C)無機充填材及び(D)硬化促進剤を含む半導体封止用樹脂組成物であって、
低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する1.に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、7.に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長が50cm以上である、半導体封止用樹脂組成物。
11.低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する1.に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、7.に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長をL 1 とし、
低圧トランスファー成形機を用いて、流路の断面形状が半径R1.6mmの半円形である螺旋状の流路を有するANSI/ASTM D 3123−72に規定されたスパイラルフロー測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、前記半導体封止用樹脂組成物を注入して測定した流動長をL 2 としたとき、
下記式:
0.25L 2 ≦L 1
を満たす、10.に記載の半導体封止用樹脂組成物。
12.低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する1.に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、7.に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長が60cm以上である、10.に記載の半導体封止用樹脂組成物。
13.低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する1.に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、7.に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長が80cm以上である、10.に記載の半導体封止用樹脂組成物。
14.ダイパッド部を有するリードフレーム又は回路基板上に積層もしくは並列して搭載された1以上の半導体素子を、10.に記載の半導体封止用樹脂組成物により封止成形する半導体装置の製造方法であって、
前記半導体装置が最小高さ0.01mm以上、0.1mm以下の狭路を有する、半導体装置の製造方法。
なお、実験例で用いた流動特性評価用金型及び半導体封止用樹脂組成物について以下に示す。
本発明に従う図1に示された流動特性評価用金型(以下、「フラットフロー金型」ともいう。):流路の断面形状における断面重心から外郭線までの最小距離が0.1mm(流路の断面形状が、幅5mm、高さ0.2mmの長方形)であり、流路が螺旋状である流動特性評価用金型
ANSI/ASTM D 3123−72に規定されたスパイラルフロー測定用金型(以下、「スパイラルフロー金型」ともいう):流路の断面形状における断面重心から外郭線までの最小距離が約0.7mm(流路の断面形状が、R1.6mm(R0.63インチ)の半円形)であり、流路が螺旋状である流動特性評価用金型
表1に記載の配合割合で以下に示す各成分を配合し、ミキサーにて混合後、熱ロールを用いて95℃で8分間混練し、さらに冷却後粉砕して半導体封止用樹脂組成物を得た。
フェノール樹脂系硬化剤1:下記式(3)で表されるビフェニレン骨格を有するフェノールアラルキル樹脂(明和化成株式会社製、商品名MEH−7851SS、軟化点107℃、水酸基当量204)
溶融球状シリカ1(平均径6μm、篩により、24μm以上の粗粉を除去したもの)
硬化促進剤1:トリフェニルホスフィン
シランカップリング剤1:N−フェニル−γ−アミノプロピルトリメトキシシラン(信越化学株式会社製、商品名KBM−573)
カルナバワックス(日興ファインプロダクツ株式会社製、商品名ニッコウカルナバ)
カーボンブラック:(三菱化学株式会社製、商品名MA−600)
評価方法
フラットフロー:低圧トランスファー成形機(コータキ精機株式会社製、KTS−15)を用いて、流動特性評価用金型(フラットフロー金型)に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、半導体封止用樹脂組成物を注入し、半導体封止用樹脂組成物の流動の始点から終点までの流動距離を流動長として求めた。単位はcm。
単位はcm。
Claims (14)
- 金型に設けられた流路に被測定物である樹脂組成物を注入して前記樹脂組成物の流動特性を測定するために使用する流動特性測定用金型であって、
前記流路の断面形状における断面重心から外郭線までの最小距離が0.02mm以上、0.4mm以下であり、
前記流路の長さは70cm以上であることを特徴とする流動特性測定用金型。 - 前記流路が螺旋状の流路である、請求項1に記載の流動特性測定用金型。
- 前記流路の断面形状が、長方形、台形又は蒲鉾形である、請求項1に記載の流動特性測定用金型。
- 前記流路の断面形状の最大幅(w)と最大高さ(h)とがw≧hの関係にある、請求項1に記載の流動特性測定用金型。
- 前記流路の断面形状の前記最大高さが0.05mm以上、0.8mm以下である、請求項4に記載の流動特性測定用金型。
- 前記流路の断面形状の前記最大幅が0.5mm以上、10mm以下である、請求項4に記載の流動特性測定用金型。
- 請求項1に記載の流動特性測定用金型の流路に被測定物である樹脂組成物を注入して一方向に流動させる工程と、前記樹脂組成物の前記流動の始点から終点までの流動距離を流動長として求める工程を含む、流動特性測定方法。
- 流動距離を流動長として求める前記工程が、低圧トランスファー成形機を用いて、金型温度140〜190℃、注入圧力6.9MPa、保圧時間60〜180秒の条件で実施される、請求項7に記載の流動特性測定方法。
- 請求項7に記載の流動特性測定方法により、樹脂組成物の流動特性を評価する樹脂組成物の検査方法であって、
前記樹脂組成物が半導体封止用樹脂組成物であり、
前記半導体封止用樹脂組成物の製品検査として前記半導体封止用樹脂組成物の流動長を測定し、その値を予め定められた製品規格と比較して合否判定する工程を含む、半導体封止用樹脂組成物の検査方法。 - (A)エポキシ樹脂、(B)フェノール樹脂系硬化剤、(C)無機充填材及び(D)硬化促進剤を含む半導体封止用樹脂組成物であって、
低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する請求項1に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、請求項7に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長が50cm以上であり、
前記(C)無機充填材は、粒径が45μm以上である粒子の割合が前記(C)無機充填材全体の1質量%以下である、半導体封止用樹脂組成物。 - 低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する請求項1に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、請求項7に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長をL1とし、
低圧トランスファー成形機を用いて、流路の断面形状が半径R1.6mmの半円形である螺旋状の流路を有するANSI/ASTM D 3123−72に規定されたスパイラルフロー測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、前記半導体封止用樹脂組成物を注入して測定した流動長をL2としたとき、
下記式:
0.25L2≦L1
を満たす、請求項10に記載の半導体封止用樹脂組成物。 - 低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する請求項1に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、請求項7に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長が60cm以上である、請求項10に記載の半導体封止用樹脂組成物。
- 低圧トランスファー成形機を用いて、流路の断面形状が幅5mm、高さ0.2mmの略長方形である螺旋状の流路を有する請求項1に記載の流動特性測定用金型の流路に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、請求項7に記載の流動特性測定方法に従って、前記半導体封止用樹脂組成物を注入して測定した際の流動長が80cm以上である、請求項10に記載の半導体封止用樹脂組成物。
- ダイパッド部を有するリードフレーム又は回路基板上に積層もしくは並列して搭載された1以上の半導体素子を、請求項10に記載の半導体封止用樹脂組成物により封止成形する半導体装置の製造方法であって、
前記半導体装置が最小高さ0.01mm以上、0.1mm以下の狭路を有する、半導体装置の製造方法。
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