JP5739826B2 - 半導体装置 - Google Patents
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- JP5739826B2 JP5739826B2 JP2012011471A JP2012011471A JP5739826B2 JP 5739826 B2 JP5739826 B2 JP 5739826B2 JP 2012011471 A JP2012011471 A JP 2012011471A JP 2012011471 A JP2012011471 A JP 2012011471A JP 5739826 B2 JP5739826 B2 JP 5739826B2
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- 239000004065 semiconductor Substances 0.000 title claims description 149
- 239000012535 impurity Substances 0.000 claims description 72
- 238000002955 isolation Methods 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 27
- 230000000052 comparative effect Effects 0.000 description 20
- 230000015556 catabolic process Effects 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 11
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 7
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 7
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005468 ion implantation Methods 0.000 description 6
- 238000002513 implantation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/866—Zener diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66098—Breakdown diodes
- H01L29/66106—Zener diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
Description
図1(a)は第1実施形態の半導体装置の模式断面図であり、図1(b)は図1(a)の模式上面図である。
図7(a)は、第1比較例のツェナーダイオードの模式断面図である。
図7(b)は、第2比較例のツェナーダイオードの模式断面図である。
図7(c)は、第3比較例のツェナーダイオードの模式断面図である。
図2(a)は、第2実施形態の半導体装置の模式断面図である。
図2(b)は、第3実施形態の半導体装置の模式断面図である。
図3は、第4実施形態の半導体装置の模式断面図である。
図6(a)は、第5実施形態の半導体装置の模式断面図である。
図6(b)は、第6実施形態の半導体装置の模式断面図である。
Claims (10)
- 第1のP形半導体層と、
前記第1のP形半導体層上に設けられたP形アノード層と、
前記P形アノード層上で前記P形アノード層に接合して設けられたN形カソード層と、
前記N形カソード層の周囲を囲み、前記N形カソード層よりも深い素子分離層と、
前記N形カソード層と前記素子分離層との間に設けられ、前記N形カソード層に隣接して前記N形カソード層を連続して囲み、前記N形カソード層よりも深いN形ガードリング層と、
を備え、
前記P形アノード層のP形不純物濃度および前記N形カソード層のN形不純物濃度は、前記N形ガードリング層のN形不純物濃度よりも高い半導体装置。 - 第1導電形の第1の半導体層と、
前記第1の半導体層上に設けられた第1導電形の第2の半導体層と、
前記第2の半導体層上で前記第2の半導体層に接合して設けられた第2導電形の第3の半導体層と、
前記第3の半導体層の周囲を囲み、前記第3の半導体層よりも深い素子分離層と、
前記第3の半導体層と前記素子分離層との間に設けられ、前記第3の半導体層に隣接し、前記第3の半導体層よりも深い第2導電形のガードリング層と、
を備え、
前記第2の半導体層の第1導電形不純物濃度および前記第3の半導体層の第2導電形不純物濃度は、前記ガードリング層の第2導電形不純物濃度よりも高い半導体装置。 - 前記ガードリング層は、前記第3の半導体層を連続して囲んでいる請求項2記載の半導体装置。
- 前記素子分離層は、前記第2の半導体層よりも深い請求項2または3に記載の半導体装置。
- 前記第2の半導体層の第1導電形不純物濃度は、前記第1の半導体層の第1導電形不純物濃度よりも高い請求項2〜4のいずれか1つに記載の半導体装置。
- 前記素子分離層を挟んで前記第3の半導体層及び前記ガードリング層が設けられた領域の反対側の前記第1の半導体層上に設けられた第1導電形の第4の半導体層をさらに備えた請求項2〜5のいずれか1つに記載の半導体装置。
- 前記第3の半導体層の側面のすべてに前記ガードリング層が設けられ、前記第3の半導体層の側面は前記第2の半導体層と接していない請求項2〜6のいずれか1つに記載の半導体装置。
- 基板と、前記基板上に設けられたダイオードと、前記基板上に設けられた第1のトランジスタと、前記基板上に設けられた第2のトランジスタと、を備え、
前記ダイオードは、
前記基板上に設けられた第1導電形の第1の半導体層と、
前記第1の半導体層上に設けられた第1導電形の第2の半導体層と、
前記第2の半導体層上で前記第2の半導体層に接合して設けられた第2導電形の第3の半導体層と、
前記第3の半導体層の周囲を囲み、前記第3の半導体層よりも深い素子分離層と、
前記第3の半導体層と前記素子分離層との間に設けられ、前記第3の半導体層に隣接し、前記第3の半導体層よりも深い第2導電形のガードリング層と、
を有し、
前記第2の半導体層の第1導電形不純物濃度および前記第3の半導体層の第2導電形不純物濃度は、前記ガードリング層の第2導電形不純物濃度よりも高く、
前記第1のトランジスタは、
第1導電形ソース層と、
第1導電形ドレイン層と、
前記第1導電形ソース層と前記第1導電形ドレイン層との間に設けられた第2導電形チャネル領域と、
前記第2導電形チャネル領域上に設けられた第1のゲート絶縁膜と、
前記第1のゲート絶縁膜上に設けられた第1のゲート電極と、
を有し、
前記第2のトランジスタは、
第2導電形ソース層と、
第2導電形ドレイン層と、
前記第2導電形ソース層と前記第2導電形ドレイン層との間に設けられた第1導電形チャネル領域と、
前記第1導電形チャネル領域上に設けられた第2のゲート絶縁膜と、
前記第2のゲート絶縁膜上に設けられた第2のゲート電極と、
を有する半導体装置。 - 前記第2の半導体層、前記第1導電形ソース層および前記第1導電形ドレイン層の第1導電形不純物濃度は同じであり、
前記第3の半導体層、前記第2導電形ソース層および前記第2導電形ドレイン層の第2導電形不純物濃度は同じである請求項8記載の半導体装置。 - 前記第2のトランジスタは、前記第2導電形ソース層における前記第1導電形チャネル領域側、および前記第2導電形ドレイン層における前記第1導電形チャネル領域側に隣接し、前記ダイオードの前記ガードリング層と同じ第2導電形不純物濃度を有する第2導電形半導体層をさらに有する請求項8記載の半導体装置。
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JP2012011471A JP5739826B2 (ja) | 2012-01-23 | 2012-01-23 | 半導体装置 |
US13/493,848 US8890281B2 (en) | 2012-01-23 | 2012-06-11 | Semiconductor device |
CN201210222983.4A CN103219360B (zh) | 2012-01-23 | 2012-06-28 | 半导体装置 |
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JP2012011471A JP5739826B2 (ja) | 2012-01-23 | 2012-01-23 | 半導体装置 |
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JP5739826B2 true JP5739826B2 (ja) | 2015-06-24 |
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JP6315190B2 (ja) * | 2014-04-23 | 2018-04-25 | サンケン電気株式会社 | 車両用点火装置の駆動装置 |
JP6679908B2 (ja) * | 2015-12-11 | 2020-04-15 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JP6641958B2 (ja) * | 2015-12-11 | 2020-02-05 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
US20170179226A1 (en) * | 2015-12-18 | 2017-06-22 | Microchip Technology Incorporated | Ultrasound t/r isoltation disolator with fast recovery time on soi |
US10355076B2 (en) * | 2017-10-31 | 2019-07-16 | Texas Instruments Incorporated | Low substrate leakage zener diode with modulated buried junction |
JP7341831B2 (ja) | 2019-09-30 | 2023-09-11 | ローム株式会社 | ダイオードチップ |
CN111710729B (zh) * | 2020-07-28 | 2022-07-19 | 杰华特微电子股份有限公司 | 齐纳二极管及其制造方法 |
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JP2004071677A (ja) * | 2002-08-02 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
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JP5558901B2 (ja) | 2010-04-28 | 2014-07-23 | 株式会社東芝 | ダイオード及びその製造方法 |
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- 2012-01-23 JP JP2012011471A patent/JP5739826B2/ja active Active
- 2012-06-11 US US13/493,848 patent/US8890281B2/en active Active
- 2012-06-28 CN CN201210222983.4A patent/CN103219360B/zh active Active
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US20130187238A1 (en) | 2013-07-25 |
US8890281B2 (en) | 2014-11-18 |
JP2013149926A (ja) | 2013-08-01 |
CN103219360B (zh) | 2016-01-20 |
CN103219360A (zh) | 2013-07-24 |
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