JP5716033B2 - 非ハロゲン化硬化剤を有する誘電体材料 - Google Patents

非ハロゲン化硬化剤を有する誘電体材料 Download PDF

Info

Publication number
JP5716033B2
JP5716033B2 JP2012536885A JP2012536885A JP5716033B2 JP 5716033 B2 JP5716033 B2 JP 5716033B2 JP 2012536885 A JP2012536885 A JP 2012536885A JP 2012536885 A JP2012536885 A JP 2012536885A JP 5716033 B2 JP5716033 B2 JP 5716033B2
Authority
JP
Japan
Prior art keywords
epoxy resin
article
dielectric
electrical
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012536885A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013510429A (ja
JP2013510429A5 (enExample
Inventor
ジョエル， エス． パイファー，
ジョエル， エス． パイファー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2013510429A publication Critical patent/JP2013510429A/ja
Publication of JP2013510429A5 publication Critical patent/JP2013510429A5/ja
Application granted granted Critical
Publication of JP5716033B2 publication Critical patent/JP5716033B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
JP2012536885A 2009-11-06 2010-10-21 非ハロゲン化硬化剤を有する誘電体材料 Expired - Fee Related JP5716033B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25880909P 2009-11-06 2009-11-06
US61/258,809 2009-11-06
PCT/US2010/053562 WO2011056455A2 (en) 2009-11-06 2010-10-21 Dielectric material with non-halogenated curing agent

Publications (3)

Publication Number Publication Date
JP2013510429A JP2013510429A (ja) 2013-03-21
JP2013510429A5 JP2013510429A5 (enExample) 2013-12-05
JP5716033B2 true JP5716033B2 (ja) 2015-05-13

Family

ID=43970641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012536885A Expired - Fee Related JP5716033B2 (ja) 2009-11-06 2010-10-21 非ハロゲン化硬化剤を有する誘電体材料

Country Status (6)

Country Link
US (1) US9247645B2 (enExample)
EP (1) EP2497347A4 (enExample)
JP (1) JP5716033B2 (enExample)
KR (1) KR101770007B1 (enExample)
CN (1) CN102598895B (enExample)
WO (1) WO2011056455A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12351698B2 (en) 2019-03-27 2025-07-08 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013091197A1 (en) * 2011-12-21 2013-06-27 3M Innovative Properties Company Resin composition and dielectric layer and capacitor produced therefrom
CA2883780A1 (en) * 2012-09-07 2014-03-13 3M Innovative Properties Company Silcone compositions and related methods
JP2017520656A (ja) * 2014-06-26 2017-07-27 ブルー キューブ アイピー エルエルシー 硬化性組成物
CN104194271B (zh) * 2014-08-29 2016-08-17 天津德高化成新材料股份有限公司 用于指纹传感器感应层的介电复合材料及制备方法
CN104292764A (zh) * 2014-10-31 2015-01-21 常熟市微尘电器有限公司 一种用于高储能电容器的复合介电材料及其制备方法
EP3239218B1 (en) * 2014-12-24 2021-11-24 Kyocera Corporation Dielectric film, film capacitor and combination type capacitor using same, inverter and electric vehicle
US12297354B2 (en) * 2018-02-01 2025-05-13 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
JP7123786B2 (ja) * 2018-12-27 2022-08-23 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
CA3132524A1 (en) * 2019-03-29 2020-10-08 Conmed Corporation High permittivity electrosurgical electrode coating
CN113156554B (zh) * 2020-01-03 2024-11-15 杭州柔谷科技有限公司 光学功能薄膜及其制备方法及柔性光电子器件
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法
WO2025058085A1 (ja) * 2023-09-15 2025-03-20 富士フイルム株式会社 フィルム、積層体、バンドパスフィルタ、及び通信端末

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559626A (en) * 1978-07-07 1980-01-23 Ube Ind Ltd Epoxy resin composition
US4684678A (en) 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
EP0741636A1 (en) * 1994-01-26 1996-11-13 AMP-Akzo LinLam VOF A method of making a composite laminate and a pwb substrate so made
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
JP4497262B2 (ja) * 2000-09-29 2010-07-07 日本ゼオン株式会社 回路基板の製造方法
DE60128118T2 (de) * 2000-10-05 2007-08-30 Nippon Kayaku K.K. Polyphenolharz, verfahren zu dessen herstellung, epoxyharzzusammensetzung und dessen anwendung
US6577492B2 (en) 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
JP2003105205A (ja) * 2001-09-28 2003-04-09 Toppan Printing Co Ltd 高誘電率複合材料、高誘電率フィルム、金属箔付き積層板およびプリント配線板
JP4148501B2 (ja) * 2002-04-02 2008-09-10 三井金属鉱業株式会社 プリント配線板の内蔵キャパシタ層形成用の誘電体フィラー含有樹脂及びその誘電体フィラー含有樹脂を用いて誘電体層を形成した両面銅張積層板並びにその両面銅張積層板の製造方法
JP4200802B2 (ja) * 2003-04-11 2008-12-24 凸版印刷株式会社 素子内蔵基板及びその製造方法
JP4047243B2 (ja) 2003-08-07 2008-02-13 株式会社日立製作所 有機・無機酸化物混合体薄膜、それを用いた受動素子内蔵電子基板及び有機・無機酸化物混合体薄膜の製造方法
JP4453325B2 (ja) * 2003-10-03 2010-04-21 凸版印刷株式会社 電子部品内蔵基板の製造方法
KR101136665B1 (ko) 2004-03-29 2012-04-18 니폰 가가쿠 고교 가부시키가이샤 복합 유전체 재료
US7417111B2 (en) * 2004-03-31 2008-08-26 Intel Corporation Liquid crystalline epoxy resins
KR20070112697A (ko) * 2004-04-27 2007-11-27 가네카 텍사스 코포레이션 다층인쇄회로기판
KR100586963B1 (ko) * 2004-05-04 2006-06-08 삼성전기주식회사 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판
SG119379A1 (en) * 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
KR100576882B1 (ko) * 2005-02-15 2006-05-10 삼성전기주식회사 Ｔｃｃ 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체
US20060286696A1 (en) 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article
JP2007123550A (ja) * 2005-10-28 2007-05-17 Sumitomo Bakelite Co Ltd 誘電体ペースト、キャパシタおよび基板
US20100144947A1 (en) * 2007-01-18 2010-06-10 Naoaki Narishige Inorganic filler and composite dielectric material using the same
GB0710425D0 (en) 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
US7672113B2 (en) * 2007-09-14 2010-03-02 Oak-Mitsui, Inc. Polymer-ceramic composites with excellent TCC
CN101381506B (zh) 2008-09-26 2012-05-30 广东生益科技股份有限公司 无卤无磷阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12351698B2 (en) 2019-03-27 2025-07-08 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor

Also Published As

Publication number Publication date
US9247645B2 (en) 2016-01-26
EP2497347A4 (en) 2015-08-12
CN102598895B (zh) 2016-06-08
KR101770007B1 (ko) 2017-08-30
WO2011056455A3 (en) 2011-11-24
US20110108309A1 (en) 2011-05-12
KR20120103608A (ko) 2012-09-19
WO2011056455A2 (en) 2011-05-12
JP2013510429A (ja) 2013-03-21
EP2497347A2 (en) 2012-09-12
CN102598895A (zh) 2012-07-18

Similar Documents

Publication Publication Date Title
JP5716033B2 (ja) 非ハロゲン化硬化剤を有する誘電体材料
EP2180772A1 (en) Multilayered wiring board and semiconductor device
US9779880B2 (en) Resin composition and dielectric layer and capacitor produced therefrom
WO2009064121A2 (en) Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same
CN101433134A (zh) 阻焊材料及使用该材料的电路板和半导体封装
US6577492B2 (en) Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
JP2025111437A (ja) 誘電体基板及びその形成方法
JP2025090707A (ja) 誘電体基板及びその形成方法
CN101942178B (zh) 热固性树脂组成以及铜箔层合板
WO2010048297A2 (en) Passive electrical article
US9708484B2 (en) Resin composition and uses of the same
KR20100068281A (ko) 반도체 소자 탑재 기판
TWI424021B (zh) 熱固性樹脂組成以及銅箔層合板
JP2004277671A (ja) プリプレグおよびそれを用いたプリント配線板
JP6428638B2 (ja) 金属張積層板、回路基板、および電子装置
JP5157103B2 (ja) プリプレグ、基板および半導体装置
JP2011124077A (ja) 絶縁シート、積層構造体及び積層構造体の製造方法
JP2003105205A (ja) 高誘電率複合材料、高誘電率フィルム、金属箔付き積層板およびプリント配線板
JP5982710B2 (ja) プリント配線板
JP2013057065A (ja) プリプレグ、基板および半導体装置
KR100909334B1 (ko) 접착 조성물, 이를 이용한 동박 부착 접착시트 및 이를포함하는 인쇄회로기판
JP2001313468A (ja) 配線基板
KR20090076857A (ko) 접착 조성물, 이를 이용한 동박 부착 접착시트 및 이를 포함하는 인쇄회로기판
KR20140002354A (ko) 에폭시 수지 조성물, 이로부터 제조된 절연필름 및 이를 구비한 다층 인쇄회로기판
HK1065162B (en) Electrical article having epoxy dielectric layer cured with aminophenylfluorenes

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131017

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20131017

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140804

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140909

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141118

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150316

R150 Certificate of patent or registration of utility model

Ref document number: 5716033

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees