CN102598895B - 具有非卤化固化剂的电介质材料 - Google Patents

具有非卤化固化剂的电介质材料 Download PDF

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Publication number
CN102598895B
CN102598895B CN201080050103.9A CN201080050103A CN102598895B CN 102598895 B CN102598895 B CN 102598895B CN 201080050103 A CN201080050103 A CN 201080050103A CN 102598895 B CN102598895 B CN 102598895B
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CN
China
Prior art keywords
goods
dielectric
goods according
epoxy resin
electrical
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Expired - Fee Related
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CN201080050103.9A
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English (en)
Chinese (zh)
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CN102598895A (zh
Inventor
乔尔·S·派弗
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN102598895A publication Critical patent/CN102598895A/zh
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
CN201080050103.9A 2009-11-06 2010-10-21 具有非卤化固化剂的电介质材料 Expired - Fee Related CN102598895B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25880909P 2009-11-06 2009-11-06
US61/258,809 2009-11-06
PCT/US2010/053562 WO2011056455A2 (en) 2009-11-06 2010-10-21 Dielectric material with non-halogenated curing agent

Publications (2)

Publication Number Publication Date
CN102598895A CN102598895A (zh) 2012-07-18
CN102598895B true CN102598895B (zh) 2016-06-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080050103.9A Expired - Fee Related CN102598895B (zh) 2009-11-06 2010-10-21 具有非卤化固化剂的电介质材料

Country Status (6)

Country Link
US (1) US9247645B2 (enExample)
EP (1) EP2497347A4 (enExample)
JP (1) JP5716033B2 (enExample)
KR (1) KR101770007B1 (enExample)
CN (1) CN102598895B (enExample)
WO (1) WO2011056455A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103999558B (zh) * 2011-12-21 2017-07-14 3M创新有限公司 树脂组合物，由其制备的介电层和电容器
EP2892950B1 (en) * 2012-09-07 2017-03-08 3M Innovative Properties Company Silicone compositions and related methods
KR20170023809A (ko) * 2014-06-26 2017-03-06 블루 큐브 아이피 엘엘씨 경화성 조성물
CN105693141B (zh) * 2014-08-29 2017-08-04 天津德高化成新材料股份有限公司 一种用于指纹传感器感应层的介电复合材料的制备方法
CN104292764A (zh) * 2014-10-31 2015-01-21 常熟市微尘电器有限公司 一种用于高储能电容器的复合介电材料及其制备方法
WO2016104398A1 (ja) 2014-12-24 2016-06-30 京セラ株式会社 誘電体フィルムと、これを用いたフィルムコンデンサおよび連結型コンデンサ、ならびにインバータ、電動車輌
SG11202007290XA (en) * 2018-02-01 2020-08-28 Mitsui Mining & Smelting Co Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
JP7123786B2 (ja) * 2018-12-27 2022-08-23 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
US12351698B2 (en) 2019-03-27 2025-07-08 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
CN113645917A (zh) * 2019-03-29 2021-11-12 康曼德公司 高介电常数电外科电极涂层
CN113156554B (zh) * 2020-01-03 2024-11-15 杭州柔谷科技有限公司 光学功能薄膜及其制备方法及柔性光电子器件
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法
WO2025058085A1 (ja) * 2023-09-15 2025-03-20 富士フイルム株式会社 フィルム、積層体、バンドパスフィルタ、及び通信端末

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1934659A (zh) * 2004-03-29 2007-03-21 日本化学工业株式会社 复合电介质材料用无机电介质粉末和复合电介质材料
CN101381506A (zh) * 2008-09-26 2009-03-11 广东生益科技股份有限公司 无卤无磷阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559626A (en) * 1978-07-07 1980-01-23 Ube Ind Ltd Epoxy resin composition
US4684678A (en) 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
RU2139792C1 (ru) 1994-01-26 1999-10-20 Амп-Акцо Линлам Воф Способ изготовления слоистой конструкции и подложки для печатных плат на ее основе
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
JP4497262B2 (ja) * 2000-09-29 2010-07-07 日本ゼオン株式会社 回路基板の製造方法
KR100750998B1 (ko) * 2000-10-05 2007-08-22 니폰 가야꾸 가부시끼가이샤 폴리페놀수지, 그의 제조방법, 에폭시수지 조성물 및 그의용도
US6577492B2 (en) 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
JP2003105205A (ja) * 2001-09-28 2003-04-09 Toppan Printing Co Ltd 高誘電率複合材料、高誘電率フィルム、金属箔付き積層板およびプリント配線板
JP4148501B2 (ja) * 2002-04-02 2008-09-10 三井金属鉱業株式会社 プリント配線板の内蔵キャパシタ層形成用の誘電体フィラー含有樹脂及びその誘電体フィラー含有樹脂を用いて誘電体層を形成した両面銅張積層板並びにその両面銅張積層板の製造方法
JP4200802B2 (ja) * 2003-04-11 2008-12-24 凸版印刷株式会社 素子内蔵基板及びその製造方法
JP4047243B2 (ja) 2003-08-07 2008-02-13 株式会社日立製作所 有機・無機酸化物混合体薄膜、それを用いた受動素子内蔵電子基板及び有機・無機酸化物混合体薄膜の製造方法
JP4453325B2 (ja) * 2003-10-03 2010-04-21 凸版印刷株式会社 電子部品内蔵基板の製造方法
US7417111B2 (en) * 2004-03-31 2008-08-26 Intel Corporation Liquid crystalline epoxy resins
US20080032103A1 (en) * 2004-04-27 2008-02-07 Kaneka Texas Corporation Multilayer Printed Circuit Board
KR100586963B1 (ko) * 2004-05-04 2006-06-08 삼성전기주식회사 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판
SG119379A1 (en) * 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
KR100576882B1 (ko) * 2005-02-15 2006-05-10 삼성전기주식회사 Ｔｃｃ 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체
US20060286696A1 (en) * 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article
JP2007123550A (ja) * 2005-10-28 2007-05-17 Sumitomo Bakelite Co Ltd 誘電体ペースト、キャパシタおよび基板
KR20090110308A (ko) * 2007-01-18 2009-10-21 니폰 가가쿠 고교 가부시키가이샤 무기 충전재 및 그것을 사용한 복합 유전체 재료
GB0710425D0 (en) 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
US7672113B2 (en) * 2007-09-14 2010-03-02 Oak-Mitsui, Inc. Polymer-ceramic composites with excellent TCC

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1934659A (zh) * 2004-03-29 2007-03-21 日本化学工业株式会社 复合电介质材料用无机电介质粉末和复合电介质材料
CN101381506A (zh) * 2008-09-26 2009-03-11 广东生益科技股份有限公司 无卤无磷阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Frequency and Temperature Dependence of Dielectric Constant of Epoxy/BaTiO3 Composite Embedded Capacitor Films(ECFs) for Organic Substrate;Jin-Gul Hyun等;<Electronic Components and Technology Conference>;20051231;1244页 *
钛酸钡/环氧树脂复合材料的制备及其介电性能的研究;余飞燕等;《功能材料》;20070516;第38卷(第9期);1480页 *

Also Published As

Publication number Publication date
JP5716033B2 (ja) 2015-05-13
EP2497347A2 (en) 2012-09-12
EP2497347A4 (en) 2015-08-12
CN102598895A (zh) 2012-07-18
WO2011056455A2 (en) 2011-05-12
KR101770007B1 (ko) 2017-08-30
WO2011056455A3 (en) 2011-11-24
US20110108309A1 (en) 2011-05-12
US9247645B2 (en) 2016-01-26
KR20120103608A (ko) 2012-09-19
JP2013510429A (ja) 2013-03-21

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Granted publication date: 20160608

CF01 Termination of patent right due to non-payment of annual fee