JP2013510429A5 - - Google Patents

Download PDF

Info

Publication number
JP2013510429A5
JP2013510429A5 JP2012536885A JP2012536885A JP2013510429A5 JP 2013510429 A5 JP2013510429 A5 JP 2013510429A5 JP 2012536885 A JP2012536885 A JP 2012536885A JP 2012536885 A JP2012536885 A JP 2012536885A JP 2013510429 A5 JP2013510429 A5 JP 2013510429A5
Authority
JP
Japan
Prior art keywords
epoxy resin
goods
composition
dielectric
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012536885A
Other languages
English (en)
Japanese (ja)
Other versions
JP5716033B2 (ja
JP2013510429A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2010/053562 external-priority patent/WO2011056455A2/en
Publication of JP2013510429A publication Critical patent/JP2013510429A/ja
Publication of JP2013510429A5 publication Critical patent/JP2013510429A5/ja
Application granted granted Critical
Publication of JP5716033B2 publication Critical patent/JP5716033B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012536885A 2009-11-06 2010-10-21 非ハロゲン化硬化剤を有する誘電体材料 Expired - Fee Related JP5716033B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25880909P 2009-11-06 2009-11-06
US61/258,809 2009-11-06
PCT/US2010/053562 WO2011056455A2 (en) 2009-11-06 2010-10-21 Dielectric material with non-halogenated curing agent

Publications (3)

Publication Number Publication Date
JP2013510429A JP2013510429A (ja) 2013-03-21
JP2013510429A5 true JP2013510429A5 (enExample) 2013-12-05
JP5716033B2 JP5716033B2 (ja) 2015-05-13

Family

ID=43970641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012536885A Expired - Fee Related JP5716033B2 (ja) 2009-11-06 2010-10-21 非ハロゲン化硬化剤を有する誘電体材料

Country Status (6)

Country Link
US (1) US9247645B2 (enExample)
EP (1) EP2497347A4 (enExample)
JP (1) JP5716033B2 (enExample)
KR (1) KR101770007B1 (enExample)
CN (1) CN102598895B (enExample)
WO (1) WO2011056455A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9455088B2 (en) 2011-12-21 2016-09-27 3M Innovative Properties Company Resin composition and dielectric layer and capacitor produced therefrom
CA2883780A1 (en) * 2012-09-07 2014-03-13 3M Innovative Properties Company Silcone compositions and related methods
US20170226275A1 (en) * 2014-06-26 2017-08-10 Blue Cube Ip Llc Curable compositions
CN105693141B (zh) * 2014-08-29 2017-08-04 天津德高化成新材料股份有限公司 一种用于指纹传感器感应层的介电复合材料的制备方法
CN104292764A (zh) * 2014-10-31 2015-01-21 常熟市微尘电器有限公司 一种用于高储能电容器的复合介电材料及其制备方法
JP6085069B2 (ja) * 2014-12-24 2017-02-22 京セラ株式会社 誘電体フィルムと、これを用いたフィルムコンデンサおよび連結型コンデンサ、ならびにインバータ、電動車輌
SG11202007290XA (en) * 2018-02-01 2020-08-28 Mitsui Mining & Smelting Co Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
JP7123786B2 (ja) * 2018-12-27 2022-08-23 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JP7412413B2 (ja) 2019-03-27 2024-01-12 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
AU2020253261B2 (en) * 2019-03-29 2023-04-13 Conmed Corporation High permittivity electrosurgical electrode coating
CN113156554B (zh) * 2020-01-03 2024-11-15 杭州柔谷科技有限公司 光学功能薄膜及其制备方法及柔性光电子器件
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法
WO2025058085A1 (ja) * 2023-09-15 2025-03-20 富士フイルム株式会社 フィルム、積層体、バンドパスフィルタ、及び通信端末

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559626A (en) * 1978-07-07 1980-01-23 Ube Ind Ltd Epoxy resin composition
US4684678A (en) * 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
AU693847B2 (en) 1994-01-26 1998-07-09 Amp-Akzo Linlam Vof A method of making a composite laminate and a PWB substrate so made
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
JP4497262B2 (ja) * 2000-09-29 2010-07-07 日本ゼオン株式会社 回路基板の製造方法
US6723801B2 (en) * 2000-10-05 2004-04-20 Nippon Kayaku Kabushiki Kaisha Polyphenol resin, process for its production, epoxy resin composition and its use
US6577492B2 (en) * 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
JP2003105205A (ja) 2001-09-28 2003-04-09 Toppan Printing Co Ltd 高誘電率複合材料、高誘電率フィルム、金属箔付き積層板およびプリント配線板
JP4148501B2 (ja) * 2002-04-02 2008-09-10 三井金属鉱業株式会社 プリント配線板の内蔵キャパシタ層形成用の誘電体フィラー含有樹脂及びその誘電体フィラー含有樹脂を用いて誘電体層を形成した両面銅張積層板並びにその両面銅張積層板の製造方法
JP4200802B2 (ja) 2003-04-11 2008-12-24 凸版印刷株式会社 素子内蔵基板及びその製造方法
JP4047243B2 (ja) * 2003-08-07 2008-02-13 株式会社日立製作所 有機・無機酸化物混合体薄膜、それを用いた受動素子内蔵電子基板及び有機・無機酸化物混合体薄膜の製造方法
JP4453325B2 (ja) 2003-10-03 2010-04-21 凸版印刷株式会社 電子部品内蔵基板の製造方法
WO2005093763A1 (ja) * 2004-03-29 2005-10-06 Nippon Chemical Industrial Co., Ltd. 複合誘電体材料用無機誘電体粉末及び複合誘電体材料
US7417111B2 (en) * 2004-03-31 2008-08-26 Intel Corporation Liquid crystalline epoxy resins
JP2007535179A (ja) * 2004-04-27 2007-11-29 カネカ テキサス コーポレーション 多層プリント配線板
KR100586963B1 (ko) * 2004-05-04 2006-06-08 삼성전기주식회사 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판
SG119379A1 (en) * 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
KR100576882B1 (ko) * 2005-02-15 2006-05-10 삼성전기주식회사 Ｔｃｃ 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체
US20060286696A1 (en) 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article
JP2007123550A (ja) 2005-10-28 2007-05-17 Sumitomo Bakelite Co Ltd 誘電体ペースト、キャパシタおよび基板
WO2008087986A1 (ja) * 2007-01-18 2008-07-24 Nippon Chemical Industrial Co., Ltd. 無機充填材およびそれを用いた複合誘電体材料
GB0710425D0 (en) 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
US7672113B2 (en) * 2007-09-14 2010-03-02 Oak-Mitsui, Inc. Polymer-ceramic composites with excellent TCC
CN101381506B (zh) * 2008-09-26 2012-05-30 广东生益科技股份有限公司 无卤无磷阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板

Similar Documents

Publication Publication Date Title
JP2013510429A5 (enExample)
RU2015111649A (ru) Порошковые эпоксидные композиции для покрытий, способы и изделия
WO2013095908A3 (en) Process for preparing cured epoxy composites
EA030358B9 (ru) Винилфункционализованные уретановые смолы для композиций порошковых покрытий
MY171388A (en) Powder coating composition, process for producing cured film and coated article
MX371000B (es) Materiales de compuestos de resinas termoestables que comprenden partículas de endurecimiento entre las láminas.
MY176165A (en) Conductive surfacing material for composite structures
MX358605B (es) Pelicula de acabado superficial para estructuras de material compuesto y metodo para su fabricacion.
JP2009280823A5 (enExample)
JP2014111773A5 (enExample)
JP2011174082A5 (ja) 硬化体、シート状成形体、積層板及び多層積層板
TW201708482A (en) Conductive adhesive composition, conductive adhesive film, bonding method, and circuit board
WO2014049028A3 (en) Resin composition and composite structure containing resin
WO2014020060A3 (de) Flüssige härter zur härtung von epoxidharzen (i)
JP2013541531A5 (enExample)
JP2018500435A5 (enExample)
JP2013504652A5 (enExample)
WO2012138693A3 (en) Uv-curable coatings containing carbon nanotubes
JP2015182248A5 (ja) 異種部材を硬化性樹脂組成物で接合した積層体、車両用構造パネル、および硬化物
CN102711421B (zh) 一种屏蔽散热材料
JP2012248370A5 (enExample)
WO2012093860A3 (ko) 프리프레그 및 이를 포함하는 프린트 배선판
WO2011149556A3 (en) Composites
WO2012178111A3 (en) Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
WO2014062407A3 (en) Anhydride-cured epoxy resin systems containing divinylarene dioxides