JP2013510429A5 - - Google Patents
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- Publication number
- JP2013510429A5 JP2013510429A5 JP2012536885A JP2012536885A JP2013510429A5 JP 2013510429 A5 JP2013510429 A5 JP 2013510429A5 JP 2012536885 A JP2012536885 A JP 2012536885A JP 2012536885 A JP2012536885 A JP 2012536885A JP 2013510429 A5 JP2013510429 A5 JP 2013510429A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- goods
- composition
- dielectric
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Di(p-aminophenyl)sulphone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Claims (3)
- 物品であって、
未硬化高分子誘電体組成物を有する電気物品を備え、前記高分子誘電体組成物が、約１０〜約６０重量％のエポキシ樹脂、約２０〜約９０重量％の誘電体フィラー、及び約０．１〜約１０重量％のジアミノジフェニルスルホン硬化剤を含む、物品。 - 物品であって、
誘電体層に隣接する導電性基材を有する電気物品を備え、前記誘電体層が硬化エポキシ樹脂組成物を含み、前記硬化組成物が、エポキシ樹脂とジアミノジフェニルスルホン硬化剤との反応生成物を含む、物品。 - 前記エポキシ樹脂が、多価フェノール類のジグリシジルエーテル類、エポキシノボラック樹脂、及びそれらの組み合わせからなる群から選択される、請求項２に記載の物品。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25880909P | 2009-11-06 | 2009-11-06 | |
| US61/258,809 | 2009-11-06 | ||
| PCT/US2010/053562 WO2011056455A2 (en) | 2009-11-06 | 2010-10-21 | Dielectric material with non-halogenated curing agent |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013510429A JP2013510429A (ja) | 2013-03-21 |
| JP2013510429A5 true JP2013510429A5 (ja) | 2013-12-05 |
| JP5716033B2 JP5716033B2 (ja) | 2015-05-13 |
Family
ID=43970641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012536885A Expired - Fee Related JP5716033B2 (ja) | 2009-11-06 | 2010-10-21 | 非ハロゲン化硬化剤を有する誘電体材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9247645B2 (ja) |
| EP (1) | EP2497347A4 (ja) |
| JP (1) | JP5716033B2 (ja) |
| KR (1) | KR101770007B1 (ja) |
| CN (1) | CN102598895B (ja) |
| WO (1) | WO2011056455A2 (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013091197A1 (en) * | 2011-12-21 | 2013-06-27 | 3M Innovative Properties Company | Resin composition and dielectric layer and capacitor produced therefrom |
| EP2892950B1 (en) * | 2012-09-07 | 2017-03-08 | 3M Innovative Properties Company | Silicone compositions and related methods |
| WO2015200064A1 (en) * | 2014-06-26 | 2015-12-30 | Dow Global Technologies Llc | Curable compositions |
| CN104194271B (zh) * | 2014-08-29 | 2016-08-17 | 天津德高化成新材料股份有限公司 | 用于指纹传感器感应层的介电复合材料及制备方法 |
| CN104292764A (zh) * | 2014-10-31 | 2015-01-21 | 常熟市微尘电器有限公司 | 一种用于高储能电容器的复合介电材料及其制备方法 |
| CN107108923B (zh) * | 2014-12-24 | 2020-11-20 | 京瓷株式会社 | 介电膜、以及使用了其的薄膜电容器和连结型电容器、以及逆变器、电动车辆 |
| WO2019150994A1 (ja) * | 2018-02-01 | 2019-08-08 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板 |
| JP7123786B2 (ja) * | 2018-12-27 | 2022-08-23 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板 |
| AU2020253261B2 (en) * | 2019-03-29 | 2023-04-13 | Conmed Corporation | High permittivity electrosurgical electrode coating |
| CN113156554A (zh) * | 2020-01-03 | 2021-07-23 | 杭州柔谷科技有限公司 | 光学功能薄膜及其制备方法及柔性光电子器件 |
| CN111363122B (zh) * | 2020-02-17 | 2022-05-17 | 西南科技大学 | 一种三重交联高性能聚合物及其制备方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS559626A (en) * | 1978-07-07 | 1980-01-23 | Ube Ind Ltd | Epoxy resin composition |
| US4684678A (en) | 1985-05-30 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent, process, and composition |
| US5874152A (en) * | 1994-01-26 | 1999-02-23 | Amp-Akzo Linlam Vof | Method of making a composite laminate and a PWB substrate so made |
| US6274224B1 (en) | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
| JP4497262B2 (ja) * | 2000-09-29 | 2010-07-07 | 日本ゼオン株式会社 | 回路基板の製造方法 |
| EP1323761B1 (en) * | 2000-10-05 | 2007-04-25 | Nippon Kayaku Kabushiki Kaisha | Polyphenol resin, process for its production, epoxy resin composition and its use |
| US6577492B2 (en) | 2001-07-10 | 2003-06-10 | 3M Innovative Properties Company | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
| JP2003105205A (ja) * | 2001-09-28 | 2003-04-09 | Toppan Printing Co Ltd | 高誘電率複合材料、高誘電率フィルム、金属箔付き積層板およびプリント配線板 |
| JP4148501B2 (ja) * | 2002-04-02 | 2008-09-10 | 三井金属鉱業株式会社 | プリント配線板の内蔵キャパシタ層形成用の誘電体フィラー含有樹脂及びその誘電体フィラー含有樹脂を用いて誘電体層を形成した両面銅張積層板並びにその両面銅張積層板の製造方法 |
| JP4200802B2 (ja) * | 2003-04-11 | 2008-12-24 | 凸版印刷株式会社 | 素子内蔵基板及びその製造方法 |
| JP4047243B2 (ja) | 2003-08-07 | 2008-02-13 | 株式会社日立製作所 | 有機・無機酸化物混合体薄膜、それを用いた受動素子内蔵電子基板及び有機・無機酸化物混合体薄膜の製造方法 |
| JP4453325B2 (ja) * | 2003-10-03 | 2010-04-21 | 凸版印刷株式会社 | 電子部品内蔵基板の製造方法 |
| CN1934659B (zh) * | 2004-03-29 | 2010-11-24 | 日本化学工业株式会社 | 复合电介质材料用无机电介质粉末和复合电介质材料 |
| US7417111B2 (en) * | 2004-03-31 | 2008-08-26 | Intel Corporation | Liquid crystalline epoxy resins |
| CN1994030A (zh) * | 2004-04-27 | 2007-07-04 | 钟渊得克萨斯公司 | 多层印刷电路板 |
| KR100586963B1 (ko) * | 2004-05-04 | 2006-06-08 | 삼성전기주식회사 | 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판 |
| SG119379A1 (en) * | 2004-08-06 | 2006-02-28 | Nippon Catalytic Chem Ind | Resin composition method of its composition and cured formulation |
| KR100576882B1 (ko) * | 2005-02-15 | 2006-05-10 | 삼성전기주식회사 | Ｔｃｃ 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체 |
| US20060286696A1 (en) * | 2005-06-21 | 2006-12-21 | Peiffer Joel S | Passive electrical article |
| JP2007123550A (ja) * | 2005-10-28 | 2007-05-17 | Sumitomo Bakelite Co Ltd | 誘電体ペースト、キャパシタおよび基板 |
| CN101583672A (zh) * | 2007-01-18 | 2009-11-18 | 日本化学工业株式会社 | 无机填料和使用该无机填料的复合电介质材料 |
| GB0710425D0 (en) | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
| US7672113B2 (en) * | 2007-09-14 | 2010-03-02 | Oak-Mitsui, Inc. | Polymer-ceramic composites with excellent TCC |
| CN101381506B (zh) | 2008-09-26 | 2012-05-30 | 广东生益科技股份有限公司 | 无卤无磷阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板 |
-
2010
- 2010-10-21 CN CN201080050103.9A patent/CN102598895B/zh not_active Expired - Fee Related
- 2010-10-21 KR KR1020127014283A patent/KR101770007B1/ko active IP Right Grant
- 2010-10-21 EP EP10828797.0A patent/EP2497347A4/en not_active Withdrawn
- 2010-10-21 WO PCT/US2010/053562 patent/WO2011056455A2/en active Application Filing
- 2010-10-21 JP JP2012536885A patent/JP5716033B2/ja not_active Expired - Fee Related
- 2010-10-21 US US12/909,462 patent/US9247645B2/en active Active
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