JP5713787B2 - 電子部品の実装装置 - Google Patents

電子部品の実装装置 Download PDF

Info

Publication number
JP5713787B2
JP5713787B2 JP2011102152A JP2011102152A JP5713787B2 JP 5713787 B2 JP5713787 B2 JP 5713787B2 JP 2011102152 A JP2011102152 A JP 2011102152A JP 2011102152 A JP2011102152 A JP 2011102152A JP 5713787 B2 JP5713787 B2 JP 5713787B2
Authority
JP
Japan
Prior art keywords
mounting
mounting tool
electronic component
vibration
tcp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011102152A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012234952A (ja
JP2012234952A5 (enExample
Inventor
白石　敏郎
敏郎 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2011102152A priority Critical patent/JP5713787B2/ja
Publication of JP2012234952A publication Critical patent/JP2012234952A/ja
Publication of JP2012234952A5 publication Critical patent/JP2012234952A5/ja
Application granted granted Critical
Publication of JP5713787B2 publication Critical patent/JP5713787B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2011102152A 2011-04-28 2011-04-28 電子部品の実装装置 Active JP5713787B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011102152A JP5713787B2 (ja) 2011-04-28 2011-04-28 電子部品の実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011102152A JP5713787B2 (ja) 2011-04-28 2011-04-28 電子部品の実装装置

Publications (3)

Publication Number Publication Date
JP2012234952A JP2012234952A (ja) 2012-11-29
JP2012234952A5 JP2012234952A5 (enExample) 2014-06-05
JP5713787B2 true JP5713787B2 (ja) 2015-05-07

Family

ID=47434994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011102152A Active JP5713787B2 (ja) 2011-04-28 2011-04-28 電子部品の実装装置

Country Status (1)

Country Link
JP (1) JP5713787B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6374189B2 (ja) * 2014-03-17 2018-08-15 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP6667326B2 (ja) * 2016-03-17 2020-03-18 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法
JP7233079B2 (ja) * 2018-05-31 2023-03-06 ボンドテック株式会社 部品実装システム、部品供給装置および部品実装方法
JP7128697B2 (ja) * 2018-09-19 2022-08-31 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JPWO2024228335A1 (enExample) * 2023-05-02 2024-11-07

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091796A (ja) * 1998-09-14 2000-03-31 Murata Mfg Co Ltd 部品装着装置
JP4222741B2 (ja) * 2001-04-06 2009-02-12 芝浦メカトロニクス株式会社 部品実装装置および部品実装方法
JP4442694B2 (ja) * 2008-02-29 2010-03-31 ソニー株式会社 部品実装装置、振動制御装置及び振動制御方法

Also Published As

Publication number Publication date
JP2012234952A (ja) 2012-11-29

Similar Documents

Publication Publication Date Title
JP2012234952A (ja) 電子部品の実装装置及び実装方法
JP5046253B2 (ja) 電子部品の実装装置及び実装方法
CN105789102A (zh) 搬送装置
JP6154915B2 (ja) 部品実装装置
JP2015111613A (ja) 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体
WO2017064786A1 (ja) 部品実装装置
JP6599286B2 (ja) 基板作業装置
CN105881194A (zh) 加工装置
JP7148233B2 (ja) 被加工物の切削方法及び切削装置
JP5771847B2 (ja) 実装装置、電子部品の実装方法、基板の製造方法及びプログラム
KR102631713B1 (ko) 가공 방법
JP5174432B2 (ja) 部品供給装置
JP6498777B2 (ja) 部品供給装置
JP6964504B2 (ja) 被加工物の切削方法
JP2012234952A5 (enExample)
JP2011040489A (ja) 電子部品の実装装置及び実装方法
JP4712766B2 (ja) 部品移載装置
JP4847189B2 (ja) 切削装置
JP2012238650A (ja) 位置合わせマークの位置認識装置及び位置認識方法、電子部品の実装装置
KR101166058B1 (ko) 전자 부품의 실장 장치 및 실장 방법
JP6422338B2 (ja) 加工装置
JP2009010176A5 (enExample)
TWI724495B (zh) 固晶裝置及半導體裝置的製造方法
JP4323410B2 (ja) 電子部品の実装装置及び実装方法
JP6147185B2 (ja) 基板作業装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140422

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140422

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141017

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141222

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150303

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150310

R150 Certificate of patent or registration of utility model

Ref document number: 5713787

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150