JP5707697B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5707697B2
JP5707697B2 JP2009285971A JP2009285971A JP5707697B2 JP 5707697 B2 JP5707697 B2 JP 5707697B2 JP 2009285971 A JP2009285971 A JP 2009285971A JP 2009285971 A JP2009285971 A JP 2009285971A JP 5707697 B2 JP5707697 B2 JP 5707697B2
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JP
Japan
Prior art keywords
light emitting
light
emitting element
layer
semiconductor
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Active
Application number
JP2009285971A
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English (en)
Japanese (ja)
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JP2011129661A5 (enExample
JP2011129661A (ja
Inventor
将嗣 市川
将嗣 市川
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Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2009285971A priority Critical patent/JP5707697B2/ja
Priority to US12/970,355 priority patent/US8552448B2/en
Publication of JP2011129661A publication Critical patent/JP2011129661A/ja
Publication of JP2011129661A5 publication Critical patent/JP2011129661A5/ja
Priority to US13/959,834 priority patent/US8647906B2/en
Application granted granted Critical
Publication of JP5707697B2 publication Critical patent/JP5707697B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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JP2009285971A 2009-12-17 2009-12-17 発光装置 Active JP5707697B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009285971A JP5707697B2 (ja) 2009-12-17 2009-12-17 発光装置
US12/970,355 US8552448B2 (en) 2009-12-17 2010-12-16 Light emitting device
US13/959,834 US8647906B2 (en) 2009-12-17 2013-08-06 Method for manufacturing a light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009285971A JP5707697B2 (ja) 2009-12-17 2009-12-17 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015038705A Division JP2015099945A (ja) 2015-02-27 2015-02-27 発光装置

Publications (3)

Publication Number Publication Date
JP2011129661A JP2011129661A (ja) 2011-06-30
JP2011129661A5 JP2011129661A5 (enExample) 2013-02-07
JP5707697B2 true JP5707697B2 (ja) 2015-04-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009285971A Active JP5707697B2 (ja) 2009-12-17 2009-12-17 発光装置

Country Status (2)

Country Link
US (2) US8552448B2 (enExample)
JP (1) JP5707697B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10270014B2 (en) 2016-11-11 2019-04-23 Samsung Electronics Co., Ltd. Light-emitting device package

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JP5893888B2 (ja) * 2011-10-13 2016-03-23 シチズン電子株式会社 半導体発光装置
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CN103975041B (zh) * 2011-12-16 2017-10-10 皇家飞利浦有限公司 用于led的水玻璃中的磷光体
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JP5845134B2 (ja) * 2012-04-27 2016-01-20 株式会社東芝 波長変換体および半導体発光装置
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
US10270014B2 (en) 2016-11-11 2019-04-23 Samsung Electronics Co., Ltd. Light-emitting device package

Also Published As

Publication number Publication date
US8552448B2 (en) 2013-10-08
US20110147778A1 (en) 2011-06-23
US20130316478A1 (en) 2013-11-28
US8647906B2 (en) 2014-02-11
JP2011129661A (ja) 2011-06-30

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