JP5702136B2 - 耐熱サイクル接続 - Google Patents
耐熱サイクル接続 Download PDFInfo
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- JP5702136B2 JP5702136B2 JP2010501615A JP2010501615A JP5702136B2 JP 5702136 B2 JP5702136 B2 JP 5702136B2 JP 2010501615 A JP2010501615 A JP 2010501615A JP 2010501615 A JP2010501615 A JP 2010501615A JP 5702136 B2 JP5702136 B2 JP 5702136B2
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- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/8182—Diffusion bonding
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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Description
Claims (9)
- 第1チップ上の第1電気的接点と第2チップ上の第2電気的接点との間に電気的接続を形成する方法であって、
前記第1および第2電気的接点を互いに近付ける工程であって、第1融点を有する第1組成物が、前記第1電気接点上に堆積され、第2融点を有する第2組成物が、前記第2電気接点上に堆積される、工程と、
前記第1および第2電気的接点を第1温度に加熱してそれらの間に第3組成物を有する電気的接続を形成する工程であって、前記第3組成物は、前記第1および第2融点より高い第3融点を有する、工程と、
前記加熱する工程の後、前記第1および第2電気的接点を前記第1温度より低い温度に冷却する工程と、
前記冷却する工程の後、第3チップ上の第3電気的接点を前記第1または第2チップの一方上の相手電気的接点に近付ける工程と、
前記第3電気的接点および前記相手電気的接点を、少なくとも前記第1温度であるが前記第3融点より低い温度に加熱する工程と、
前記第3電気的接点および前記相手電気的接点を加熱する工程の後、前記第3電気的接点および前記相手電気的接点を、前記第1温度より低い温度に冷却する工程と、
を備える、方法。 - 前記第1および第2電気的接点間にバリア材料を提供する工程をさらに備える、請求項1に記載の方法。
- 前記第1および第2電気的接点間に材料を提供する工程をさらに備え、前記材料は、前記第1温度より高い温度に加熱されると、前記第1または第2組成物の一方と合金を成す、請求項1に記載の方法。
- 前記第1および第2組成物は層状構成に配置され、前記第3融点は前記第1温度より高い、請求項1に記載の方法。
- 前記第1または第2電気的接点の少なくとも一方上に合金を配置する工程をさらに備える、請求項1に記載の方法。
- 前記第1および第2電気的接点間にバリア材料を提供する工程をさらに備え、前記バリア材料は、前記合金、前記第1電気的接点、または前記第2電気的接点の1つからの可動成分と結合するように構成される、請求項5に記載の方法。
- 前記バリア材料はニッケルを備え、前記可動成分はスズを備える、請求項6に記載の方法。
- 前記第3組成物は、約70パーセントの金と30パーセントのスズを備える、請求項1に記載の方法。
- 前記電気的接続を、前記第1温度より低くなるように冷却する工程と、
前記電気的接続を冷却する工程の後、前記電気的接続を、前記第1温度より高いが前記第3融点より低い再加熱温度に加熱する工程と、
をさらに備える、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/696,774 US7850060B2 (en) | 2007-04-05 | 2007-04-05 | Heat cycle-able connection |
PCT/IB2008/001436 WO2008122890A2 (en) | 2007-04-05 | 2008-06-05 | Heat cycle-able connection |
Publications (2)
Publication Number | Publication Date |
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JP2011501394A JP2011501394A (ja) | 2011-01-06 |
JP5702136B2 true JP5702136B2 (ja) | 2015-04-15 |
Family
ID=39826084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010501615A Active JP5702136B2 (ja) | 2007-04-05 | 2008-06-05 | 耐熱サイクル接続 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7850060B2 (ja) |
EP (1) | EP2313916A2 (ja) |
JP (1) | JP5702136B2 (ja) |
KR (1) | KR20100012865A (ja) |
CN (1) | CN101652846B (ja) |
WO (1) | WO2008122890A2 (ja) |
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JP6043058B2 (ja) * | 2011-11-07 | 2016-12-14 | デクセリアルズ株式会社 | 接続装置、接続構造体の製造方法、チップスタック部品の製造方法及び電子部品の実装方法 |
JP6206159B2 (ja) * | 2013-12-17 | 2017-10-04 | 三菱電機株式会社 | 半導体装置の製造方法 |
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2007
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-
2008
- 2008-06-05 WO PCT/IB2008/001436 patent/WO2008122890A2/en active Application Filing
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- 2008-06-05 KR KR1020097022730A patent/KR20100012865A/ko active Search and Examination
- 2008-06-05 JP JP2010501615A patent/JP5702136B2/ja active Active
- 2008-06-05 EP EP08762777A patent/EP2313916A2/en not_active Withdrawn
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WO2008122890A2 (en) | 2008-10-16 |
WO2008122890A3 (en) | 2009-02-12 |
US7850060B2 (en) | 2010-12-14 |
JP2011501394A (ja) | 2011-01-06 |
CN101652846A (zh) | 2010-02-17 |
KR20100012865A (ko) | 2010-02-08 |
CN101652846B (zh) | 2013-04-24 |
US20080245846A1 (en) | 2008-10-09 |
EP2313916A2 (en) | 2011-04-27 |
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