JP5700759B2 - 硬化性樹脂組成物、及びその硬化物 - Google Patents

硬化性樹脂組成物、及びその硬化物 Download PDF

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Publication number
JP5700759B2
JP5700759B2 JP2010118877A JP2010118877A JP5700759B2 JP 5700759 B2 JP5700759 B2 JP 5700759B2 JP 2010118877 A JP2010118877 A JP 2010118877A JP 2010118877 A JP2010118877 A JP 2010118877A JP 5700759 B2 JP5700759 B2 JP 5700759B2
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Japan
Prior art keywords
resin composition
curable resin
curing
tert
acid
Prior art date
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Active
Application number
JP2010118877A
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English (en)
Japanese (ja)
Other versions
JP2011246531A (ja
Inventor
政隆 中西
政隆 中西
智江 佐々木
智江 佐々木
英之 太田
英之 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2010118877A priority Critical patent/JP5700759B2/ja
Priority to PCT/JP2011/061825 priority patent/WO2011148923A1/ja
Priority to KR1020127030828A priority patent/KR101763192B1/ko
Priority to TW100118218A priority patent/TWI492958B/zh
Publication of JP2011246531A publication Critical patent/JP2011246531A/ja
Application granted granted Critical
Publication of JP5700759B2 publication Critical patent/JP5700759B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2010118877A 2010-05-25 2010-05-25 硬化性樹脂組成物、及びその硬化物 Active JP5700759B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010118877A JP5700759B2 (ja) 2010-05-25 2010-05-25 硬化性樹脂組成物、及びその硬化物
PCT/JP2011/061825 WO2011148923A1 (ja) 2010-05-25 2011-05-24 硬化性樹脂組成物及びその硬化物
KR1020127030828A KR101763192B1 (ko) 2010-05-25 2011-05-24 경화성 수지 조성물 및 그 경화물
TW100118218A TWI492958B (zh) 2010-05-25 2011-05-25 Hardened resin composition and hardened product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010118877A JP5700759B2 (ja) 2010-05-25 2010-05-25 硬化性樹脂組成物、及びその硬化物

Publications (2)

Publication Number Publication Date
JP2011246531A JP2011246531A (ja) 2011-12-08
JP5700759B2 true JP5700759B2 (ja) 2015-04-15

Family

ID=45003913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010118877A Active JP5700759B2 (ja) 2010-05-25 2010-05-25 硬化性樹脂組成物、及びその硬化物

Country Status (4)

Country Link
JP (1) JP5700759B2 (ko)
KR (1) KR101763192B1 (ko)
TW (1) TWI492958B (ko)
WO (1) WO2011148923A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6107559B2 (ja) * 2012-11-09 2017-04-05 豊田合成株式会社 発光装置
US9957349B2 (en) 2012-12-28 2018-05-01 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and film
JP2014192328A (ja) * 2013-03-27 2014-10-06 Kyocera Chemical Corp 光半導体装置
JP6252929B2 (ja) * 2013-07-04 2017-12-27 パナソニックＩｐマネジメント株式会社 樹脂組成物の製造方法
US10233295B2 (en) 2014-04-15 2019-03-19 Mitsubishi Gas Chemical Company, Inc. Fiber-reinforced composite material
JP6676318B2 (ja) * 2014-09-18 2020-04-08 昭和電工株式会社 薄膜印刷用絶縁性樹脂組成物及び薄膜パターンの製造方法
JP2017089494A (ja) * 2015-11-10 2017-05-25 株式会社ダイセル 自動車部品及びその製造方法
KR102475977B1 (ko) * 2021-01-19 2022-12-09 한국화학연구원 삼관능성 지환족 에폭시 화합물을 포함하는 에폭시 수지 제조용 조성물 및 이를 이용한 경화물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06239974A (ja) * 1993-02-19 1994-08-30 Mitsui Toatsu Chem Inc 半導体封止用エポキシ樹脂組成物および半導体装置
JP4356909B2 (ja) * 1998-08-27 2009-11-04 株式会社Ａｄｅｋａ 光学的立体造形用樹脂組成物および光学的立体造形方法
SE529306C2 (sv) * 2005-03-18 2007-06-26 Perstorp Specialty Chem Ab Ultravioletthärdande hartskomposition
US8222348B2 (en) * 2007-04-17 2012-07-17 Asahi Kasei Chemicals Corporation Epoxy silicone and process for producing same, and curable mix composition using same and use thereof
JP5511047B2 (ja) * 2008-03-14 2014-06-04 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、及び硬化性樹脂組成物
JP5213547B2 (ja) * 2008-06-27 2013-06-19 昭和電工株式会社 エポキシ基含有エステル化合物を含む硬化性組成物、該組成物の製造方法およびエポキシ基含有エステル化合物
JP5517237B2 (ja) * 2008-09-17 2014-06-11 日本化薬株式会社 エポキシ化合物の製造方法、エポキシ化合物、硬化性樹脂組成物及びその硬化物
JP5210122B2 (ja) * 2008-10-31 2013-06-12 昭和電工株式会社 接着剤用硬化性組成物

Also Published As

Publication number Publication date
WO2011148923A1 (ja) 2011-12-01
JP2011246531A (ja) 2011-12-08
TW201211093A (en) 2012-03-16
KR20130040895A (ko) 2013-04-24
KR101763192B1 (ko) 2017-07-31
TWI492958B (zh) 2015-07-21

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